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7608480 Method of fabricating a semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion  
A semiconductor device includes metal foil to which a ground potential is applied, at a semiconductor constructing body provided on the metal foil and having a semiconductor substrate and a...
7605019 Semiconductor device with stacked chips and method for manufacturing thereof  
A semiconductor device includes a first semiconductor device and a second semiconductor device. Through-holes in the second semiconductor device extend from an upper side of the second...
7598124 System and method to increase die stand-off height  
In accordance with the present invention, a system and method to increase die stand-off height in a flip chip are provided. The system includes a plurality of separator pedestals disposed between a...
7566584 Electronic substrate manufacturing method, semiconductor device manufacturing method, and electronic equipment manufacturing method  
A method of manufacture of an electronic substrate, having a process of embedding electronic components in a substrate, and a process of ejecting liquid droplets containing a conductive material,...
7563645 Electronic package having a folded package substrate  
An electronic package of the kind having a folded substrate is provided. The substrate is configured so that a stress concentration is created where folding is desired. In the present example, the...
7560364 Dislocation-specific lateral epitaxial overgrowth to reduce dislocation density of nitride films  
In accordance with the present invention, improved methods for reducing the dislocation density of nitride epitaxial films are provided. Specifically, an in-situ etch treatment is provided to...
7550317 Method for manufacture of wafer level package with air pads  
A structure for improving electrical performance and interconnection reliability of an integrated circuit in a Wafer Level Packaging (WLP) application comprises an air pad located under an...
7547576 Solder wall structure in flip-chip technologies  
A structure and method for forming the same. The semiconductor structure includes a first semiconductor chip and N solder bumps in direct physical contact with the first semiconductor chip, wherein...
7547564 Method of manufacturing device having flexible substrate and device having flexible substrate manufactured using the same  
The present invention relates to a method of manufacturing a device having a flexible substrate and a device having a flexible substrate manufactured using the method. According to the method of...
7541672 Semiconductor device  
A semiconductor device includes a header, a semiconductor chip fixed to the header constituting a MOSFET, and a sealing body of insulating resin which covers the semiconductor chip, the header and...
7541219 Integrated metallic contact probe storage device  
A mass storage device includes a probe that has a cantilever having a first end region operatively connected to a substrate and a second end region rotated in a direction such that the second end...
7534652 Microelectronic elements with compliant terminal mountings and methods for making the same  
A dielectric structure is formed by a molding process, so that a first surface of a dielectric structure is shaped by contact with the mold. The opposite second surface of the dielectric structure...
7531443 Method and system for fabricating semiconductor components with through interconnects and back side redistribution conductors  
A method for fabricating semiconductor components includes the step of providing a semiconductor substrate having a circuit side, a back side, a plurality of integrated circuits on the circuit...
7528413 Sintered diamond having high thermal conductivity and method for producing the same and heat sink employing it  
This invention relates to a high thermal conductivity composite material which comprises diamond particles and a copper matrix useful as electronic heat sinks for electronics parts, particularly...
7525187 Apparatus and method for connecting components  
An apparatus for connecting at least two components contains a lower die and an upper die. The lower die has the components which are to be connected, with the first component supporting the at...
7524700 Method for manufacturing semiconductor device, and method and structure for implementing semicondutor device  
A method for manufacturing a semiconductor device includes forming an electrode; forming a projection projecting with respect to the electrode by melting a resin; and providing a conductive layer...
7524697 Method for manufactuing a semiconductor integrated circuit device  
A burn-in process for a semiconductor integrated circuit device includes a first process of positioning bump electrodes of the semiconductor integrated circuit device with respect to pads of a...
7494844 Method for manufacturing substrate with cavity  
A method for manufacturing a substrate having a cavity is disclosed. The method comprises: (a) forming a first circuit pattern on one side of a seed layer by use of a first dry film; (b) laminating...
7443026 IC chip package having force-adjustable member between stiffener and printed circuit board  
An IC chip package and related method are disclosed. The IC chip package may include a printed circuit board (PCB) coupled to a chip carrier by a land grid array (LGA) connector; a metal stiffener...
7425467 Web process interconnect in electronic assemblies  
Apparatuses and methods for forming displays are claimed. One embodiment of the invention relates to depositing a plurality of blocks onto a substrate and is coupled to a flexible layer having...
7402182 High-power LGA socket  
A system for providing electrical contacts between a die and an electrical device includes a die and a package. The package includes a first major surface, a second major surface, a first scalloped...
7400514 Non-rigid conductor link measurement sensor and method for the production thereof  
The invention relates to electronic sensors comprising an electromechanical microsensor cell such as a micro-accelerometer, and it more particularly relates to the way in which the microsensor cell...
7382042 COF flexible printed wiring board and method of producing the wiring board  
The present invention provides a COF flexible printed wiring board whose insulating layer is not melt-adhered to a heating tool, and which exhibits no drop in bonding strength during panel bonding...
7351612 Method for fabricating quad flat non-leaded package  
The present invention discloses a method for fabricating a quad flat non-leaded package. A lead frame is disposed on a lower mold equipped with a resilient film. The lead frame includes at least a...
7311451 Method of manufacturing optical communication module, and optimum mold and lead frame for use in the manufacturing method  
A method of manufacturing an optical communication module, and a mold and a lead frame that are suitable for the method are provided. The method comprises the steps of: placing in a mold the lead...
7291910 Semiconductor chip assemblies, methods of making same and components for same  
Semiconductor chip assemblies incorporating flexible, sheet-like elements having terminals thereon overlying the front or rear face of the chip to provide a compact unit. The terminals on the...
7288432 Electronic devices with small functional elements supported on a carrier  
Apparatuses and methods for forming displays are claimed. One embodiment of the invention relates to depositing a plurality of blocks onto a substrate and is coupled to a flexible layer having...
7279363 Vertically stacked semiconductor device  
A semiconductor device including a vertical assembly of semiconductor chips interconnected on a substrate with one or more metal standoffs providing a fixed space between each supporting chip and a...
7278857 Brittle fracture resistant spring  
A spring contact has a post-release outer upper surface in compression and a post-release outer lower surface in compression. A compressive lower layer of spring material may be formed at a...
7264999 Semiconductor device with interlocking clip  
A semiconductor device is provided having a single-piece clip that interlocks into a lead frame using one or more forks on the clip that mate with one or more corresponding slots in the lead frame....
7256067 LGA fixture for indium assembly process  
An integrated circuit lid fixture and methods of using the same are provided. In one aspect, an integrated circuit lid fixture is provided that includes a base that has a plurality of pillars. Each...
7241680 Electronic packaging using conductive interposer connector  
Formation of a plurality of conductive connectors of an integrated circuit package is described. The conductive connectors made with a conductive elastomer material and formed using an interposer...
7217992 Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device  
Semiconductor devices,-semiconductor wafers, and semiconductor modules are provided: wherein the semiconductor device has a small warp; damages at chip edge and cracks in a dropping test are...
7217580 Method for processing an integrated circuit  
Methods for processing at least one die which comprises an integrated circuit. In one example of a method of the invention, an identification code is applied to a carrier. A singulated die is...
7217579 Voltage contrast test structure  
A method for electrically testing a semiconductor wafer during integrated-circuit fabrication process, the method including: (i) providing a scanning charged-particle microscope (SCPM), having a...
7198989 Method of producing a COF flexible printed wiring board  
The present invention provides a COF flexible printed wiring board whose insulating layer is not melt-adhered to a heating tool, to thereby enhance reliability and productivity of a semiconductor...
7192806 Method of establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate  
A spring contact for establishing electrical contact between a lead element of an IC device and a substrate. The spring contact generally comprises a contact portion and a base portion. The contact...
7176059 Method of fabricating an electronic component having at least one semiconductor chip on a circuit carrier with elastic external contacts  
An electronic component includes at least one semiconductor chip, which has an active chip top side with contact areas and has a chip rear side arranged on a carrier top side of a circuit carrier....
7173328 Integrated circuit package and method having wire-bonded intra-die electrical connections  
A semiconductor package having a substrate mounted die. The die configured having active circuit components and a top surface having bond pads electrically connected with circuitry of the die. The...
7169646 Interconnect assemblies and methods  
Interconnect assemblies and methods for forming and using them. In one example of the invention, an interconnect assembly comprises a substrate, a resilient contact element and a stop structure....
7161234 Semiconductor component and production method suitable therefor  
A semiconductor component has a lower semiconductor element and an upper semiconductor element. A contact-making region is provided between the lower and the upper semiconductor element that makes...
7160757 Gap control between interposer and substrate in electronic assemblies  
Electronic assemblies and methods for forming assemblies are described. One embodiment includes a method of forming an electronic assembly, including forming a plurality of first solder bumps on...
7141448 Controlled collapse chip connection (C4) integrated circuit package which has two dissimilar underfill materials  
An integrated circuit package which may include the dispense of a second encapsulant material (or fillet) different from the first underfill material on an integrated circuit package which may...
7137830 Miniaturized contact spring  
This invention provides a solution to increase the yield strength and fatigue strength of miniaturized springs, which can be fabricated in arrays with ultra-small pitches. It also discloses a...
7135356 Semiconductor device and method of producing a high contrast identification mark  
A seconductor device ( 50 ) includes a semiconductor die ( 20 ) having a first surface ( 14 ) for forming electronic circuitry. A coating layer ( 16 ) formed on a second surface ( 15 ) of the...
7129572 Submember mounted on a chip of electrical device for electrical connection  
A submember for electrical device is disclosed. Said submember is mounted on a chip of electrical device. An embodiment for the submember comprised of an insulator and a plurality of conductive...
7087465 Method of packaging a semiconductor light emitting device  
A semiconductor light emitting device is packaged by forming a sealed compartment enclosing the device, at least one of the walls of the sealed compartment being formed of an elastomeric material....
7087442 Process for the formation of a spatial chip arrangement and spatial chip arrangement  
Process for the formation of a spatial chip arrangement having several chips ( 32, 36, 37, 38, 39 ) arranged in several planes and electrically connected to one another, in which the chips are...
7078109 Heat spreading thermal interface structure  
The thermal interface structure of the present invention is suited for use in a non-referenced die system between a heat source and heat sink spaced up to 300 mils apart and comprises a plurality...
7059047 Sockets for “springed” semiconductor devices  
Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the...
Matches 1 - 50 out of 213 1 2 3 4 5 >