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7615872 |
Semiconductor device
A semiconductor device comprises: a package substrate having a plurality of bonding electrodes arranged in a peripheral region of a main surface thereof and wirings connected to the respective...
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7608484 |
Non-pull back pad package with an additional solder standoff
Disclosed herein is a method of manufacturing a semiconductor package with a solder standoff on lead pads that reach to the edge of the package (non-pullback leads). It includes encapsulating a...
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7605021 |
Manufacturing method of electronic device
A manufacturing method of manufacturing an electronic device, includes the steps of: applying a thermosetting adhesive on a surface of a base having a conductive pattern formed on a film; mounting...
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7592237 |
Laser processing method and object to be processed
A laser processing method is provided, which, when cutting a substrate formed with a laminate part including a plurality of functional devices into a plurality of chips, each chip including at...
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7582513 |
Electronic device and method for producing electronic devices
One aspect includes an electronic device including an integrated component with a substrate. An electrically conductive first layer region is arranged at the substrate, wherein the layer thickness...
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7579260 |
Method of dividing an adhesive film bonded to a wafer
A method of dividing an adhesive film for die bonding which is bonded to the rear surface of a wafer having devices in a plurality of areas sectioned by dividing lines formed in a lattice pattern...
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7575954 |
Ceramic substrate and method of breaking same
A ceramic substrate ( 100 ) includes a top surface, a plurality of identification marks ( 104 ), a protective compound ( 110 ), a bottom surface, and a plurality of grooves ( 106 ). The top surface...
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7572674 |
Method for manufacturing semiconductor device
In a production of a semiconductor device, after a step in which a thermosetting resin is thermally cured to seal a semiconductor chip with the resin and before a step in which a characteristic of...
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7569409 |
Isolation structures for CMOS image sensor chip scale packages
Isolation structure for CMOS image sensor device chip scale packages and fabrication methods thereof. A CMOS image sensor chip scale package includes a transparent substrate configured as a support...
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7569423 |
Wafer-level-chip-scale package and method of fabrication
A wafer-level-chip-scale package and related method of fabrication are disclosed. The wafer-level-chip-scale package comprises a semiconductor substrate comprising an integrated circuit, a...
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7563694 |
Scribe based bond pads for integrated circuits
A method and system for utilizing a semiconductor wafer is disclosed. The wafer comprises a plurality of semiconductor die and a plurality of scribe areas interspersed between. The method and...
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7563643 |
Wafer processing apparatus
A wafer processing apparatus ( 10 ), for processing a wafer ( 20 ) with a surface protective film ( 110 ) attached on the front surface ( 21 ) on which at least one circuit pattern is formed,...
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7552528 |
Wafer expanding device, component feeder, and expanding method for wafer sheet
In slack removal processing for removing slack generated on a wafer sheet by heating blow, a wafer feeding plate is positioned at a height position between a first height position and a second...
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7547577 |
Method of making circuitized substrate with solder paste connections
A method of making a circuitized substrate assembly in which two or more subassemblies are aligned and bonded together. The bonding, preferably using lamination, results in effective electrical...
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7534657 |
Method of manufacturing a semiconductor device
A method of manufacturing a semiconductor device involves the steps of: forming a plurality of product formation areas each having a circuit and a plurality of first electrode pads over a main...
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7517724 |
Dicing/die bonding sheet
The present invention provides a dicing/die bonding sheet which can be used as a dicing tape during dicing, enables ready separation of the semiconductor element and the adhesive layer from the...
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7517726 |
Wire bonded chip scale package fabrication methods
In one embodiment the present invention includes a method of manufacturing a chip scale package. Embodiments of the present invention include sawing kerfs between semiconductor device boundaries on...
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7517725 |
System and method for separating and packaging integrated circuits
A method of separating an IC. The method includes dicing a semiconductor wafer. The semiconductor wafer includes multiple ICs. The diced wafer is secured to a stretchable substrate. The stretchable...
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7510908 |
Method to dispense light blocking material for wafer level CSP
Disclosed is a packaged semiconductor device. The device includes a die with an active surface having a plurality of electrical contacts, a back surface located opposite the active surface, and a...
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7510909 |
Fabricating method of wafer protection layers
A fabricating method of wafer protection layers and a wafer structure are provided. The fabricating method includes providing a wafer first. The wafer includes pluralities of chips and has an...
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7504320 |
Method for manufacturing a tag integrated circuit flexible board
In a method for manufacturing a tag integrated circuit flexible board, first a copper foil, an insulating heat-conductive material and a base material coated with an adhesive layer are prepared....
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7504318 |
Nanopowder coating for scribing and structures formed thereby
Methods of forming a microelectronic structure are described. Embodiments of those methods include forming a conformal layer of a water soluble nanopowder on a wafer, and then scribing the wafer.
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7501310 |
Structure of image sensor module and method for manufacturing of wafer level package
An image sensor die comprises a substrate and an image sensor array formed over the substrate. Micro lens are disposed on the image sensor array. A protection layer is formed on the micro lens to...
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7501311 |
Fabrication method of a wafer structure
A wafer fabricating method at least includes the steps of providing a wafer having an active surface with a plurality of pads, forming a plurality of bumps on the pad, and forming an organic...
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7495315 |
Method and apparatus of fabricating a semiconductor device by back grinding and dicing
A method and apparatus of fabricating a semiconductor device by back grinding and dicing is disclosed. The method may include at least adhering a protection tape for back grinding on a front...
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7485548 |
Die loss estimation using universal in-line metric (UILM)
A system predicts die loss for a semiconductor wafer by using a method referred to as universal in-line metric (UILM). A wafer inspection tool detects defects on the wafer and identifies the...
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7482251 |
Etch before grind for semiconductor die singulation
Methods are provided, and devices made by such methods. One of the methods includes procuring a semiconductor wafer, processing the wafer to form a plurality of circuits on a top side, forming...
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7468293 |
Method for the production of window elements which can be soldered into a housing in a hermetically tight manner and of a window element sealing a housing
In a method for the production of window elements which can be soldered into a housing in a hermetically tight manner and of a window element sealing a housing, the object of the invention is to...
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7465609 |
Method of manufacturing semiconductor device
In the method of manufacturing a semiconductor device that semiconductor chips are mounted facing-up on the printed wiring board on which a protective insulation film is formed by means of a...
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7459343 |
Method of manufacturing semiconductor device and support structure for semiconductor substrate
A method of manufacturing a semiconductor device is disclosed. The method comprises a first step of grinding a second principle surface of a semiconductor substrate opposite to a first principle...
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7452753 |
Method of processing a semiconductor wafer for manufacture of semiconductor device
A method of processing a semiconductor wafer that has a first surface and a second surface opposite to the first surface. The method includes forming grooves of a predetermined depth on the second...
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7452747 |
Semiconductor package with contact support layer and method to produce the package
A semiconductor package comprises a substrate which includes a plurality of conducting traces and upper contact areas on its upper surface and a second plurality of lower conductive traces and...
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7452752 |
Production method of semiconductor chip
Provided is a method for producing a semiconductor chip, comprising applying a photothermal conversion layer on a light-transmitting support, provided that upon irradiation of radiation energy, the...
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7442580 |
Manufacturing method of a package structure
A manufacturing method of a package structure is provided. Firstly, a substrate having a surface is provided. Next, a chip is disposed on the surface of the substrate. Then, a packing material...
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7427527 |
Method for aligning devices
A method is provided for aligning parts such as MEMS devices and photonics devices. One approach involves: providing between first and second parts a bonding material having fluid and solid states;...
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7416920 |
Semiconductor device protective structure and method for fabricating the same
The present invention provides a semiconductor device protective structure. The structure comprises a die with contact metal balls formed thereon electrically coupling with a print circuit board. A...
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7416921 |
Method for flip-chip mounting utilizing a delay curing-type adhesive with two-part hardening resin
A method of flip-chip mounting a semiconductor chip can carry out bonding at normal temperature and improves the positional accuracy of bonding. The method of flip-chip bonding a semiconductor chip...
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7413927 |
Apparatus for forming a pre-applied underfill adhesive layer for semiconductor wafer level chip-scale packages
An apparatus and method for enhancing the formation of fillets around the periphery of assembled wafer-level chip scale packages when mounted onto substrates. The method includes fabricating a...
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7410831 |
Method and device for dividing plate-like member
In a method and an apparatus for dividing a plate-like member related to the present invention, multiple substrates are obtained by forming a linear modified region on a surface of a plate-like...
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7405100 |
Packaging of a semiconductor device with a non-opaque cover
Packages of semiconductor devices with non-opaque covers and methods for making the packages. The invention allows an encapsulant to be used with a non-opaque cover. By ensuring the cover is...
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7399683 |
Manufacturing method of semiconductor device
A manufacturing method of a semiconductor device of this invention includes forming metal pads on a Si substrate through a first oxide film, bonding the Si substrate and a holding substrate which...
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7399682 |
Wafer processing method
A wafer processing method for carrying out processing by applying a laser beam along streets formed on a wafer, comprising a step of applying a laser beam at an incident angle of a predetermined...
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7387950 |
Method for forming a metal structure
A semiconductor wafer comprises a plurality of die areas, at least a first scribe line area and at least a second scribe line area surrounding each die area, at least a first metal structure...
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7387911 |
Application of a thermally conductive thin film to a wafer backside prior to dicing to prevent chipping and cracking
A thermally conductive protective film or layer is applied to the backside surface of a semiconductor wafer prior to a subsequent dicing operation performed on the wafer to singulate the wafer into...
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7378293 |
MEMS fabrication method
A method for singulating a substrate such as a semiconductor wafer populated with a plurality of MEMS devices. A preferred embodiment of the present invention comprises mounting a glass cover onto...
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7374971 |
Semiconductor die edge reconditioning
An integrated circuit has a semiconductor substrate and an interconnect layer that mechanically relatively weak and susceptible to cracks and delamination. In the formation of the integrated...
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7368318 |
Semiconductor device and method for manufacturing the same, and electric appliance
The present invention provides a semiconductor device having a plurality of functions and a method for manufacturing the semiconductor device. The semiconductor device comprises a thin film...
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7339204 |
Backside contact for touchchip
A contact is formed within an active region of a substrate at the edge of a die, preferably within the first metallization level in the active region of the substrate. An opening having sloped...
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7326590 |
Method for manufacturing ball grid array package
A method for manufacturing a ball grid array package includes the steps of providing a substrate strip having a plurality of sub-substrate strips wherein each has an upper surface and a lower...
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7316940 |
Chip dicing
A semiconductor structure and method for chip dicing. The method includes (a) providing a semiconductor substrate and (b) forming first and second device regions in and at top of the substrate. The...
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