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7622328 |
Processing method of wafer
A separation groove having a depth corresponding to a finished thickness of a semiconductor chip is formed in a boundary between a device region and an outer peripheral surplus region of a wafer, a...
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7622325 |
Integrated circuit package system including high-density small footprint system-in-package
An integrated circuit package system including a high-density small footprint system-in-package with a substrate is provided. Passive components are mounted on the substrate. Solder separators are...
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7619158 |
Thermoelectric device having P-type and N-type materials
A method of forming a thermoelectric device includes extruding a P/N-type billet to form a P/N-type extrusion having a first plurality of P-type regions and a first plurality of N-type regions. The...
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7618878 |
Wafer dividing method
A method of dividing a wafer having a plurality of devices, which are formed in a plurality of areas sectioned by streets formed in a lattice pattern on the front surface, and having test metal...
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7618847 |
Bonding method of semiconductor and laminated structure fabricated thereby
A bonding method (three-dimensional mounting) of semiconductor substrates is provided to sequentially bond a principal surface of a silicon wafer on which coupling bumps are formed, and a principal...
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7618846 |
Semiconductor device and method of forming shielding along a profile disposed in peripheral region around the device
A semiconductor device has a semiconductor die with a peripheral region around the die. A first insulating material is deposited in the peripheral region. A conductive via is formed through the...
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7615414 |
Dental intraoral radiological image sensor with a fiber-optic plate
The invention relates to dental radiological image sensors for intraoral use. What is described is a method of fabricating an image sensor, comprising steps for the collective production of a...
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7615413 |
Method of manufacturing stack-type semiconductor device and method of manufacturing stack-type electronic component
A first semiconductor element is bonded on a substrate. A complex film formed of integrated dicing film and adhesive film is affixed on a rear surface of a semiconductor wafer which is to be second...
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7615410 |
Chip-sized flip-chip semiconductor package and method for making the same
A semiconductor package ( 10; 14 ) comprises a semiconductor die ( 2; 2′ ) with a plurality of contact areas ( 4 ) on its active surface and an electrically conductive bump ( 7 ) on each contact...
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7615407 |
Methods and systems for packaging integrated circuits with integrated passive components
A method is described for packaging integrated circuit dice such that each package includes a die with an integrated passive component mounted to the active surface of the die.
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7611927 |
Method of minimizing kerf width on a semiconductor substrate panel
A semiconductor die substrate panel is disclosed including a minimum kerf width between adjoining semiconductor package outlines on the panel, while ensuring electrical isolation of plated...
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7611925 |
Electronic device and method of manufacturing the same, chip carrier, circuit board, and electronic instrument
An external terminal is formed on an interconnect pattern formed on a substrate by using a soldering material. Subsequently, a chip component having an electrode is mounted on the substrate. An...
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7608484 |
Non-pull back pad package with an additional solder standoff
Disclosed herein is a method of manufacturing a semiconductor package with a solder standoff on lead pads that reach to the edge of the package (non-pullback leads). It includes encapsulating a...
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7608483 |
Method of machining wafer
A method of machining a wafer, wherein a wafer provided with devices each having a low dielectric constant insulating film (low-k film) stacked on the face side thereof is divided into the...
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7608481 |
Method for producing semiconductor package
A method for producing a semiconductor package including a main semiconductor chip having a semiconductor circuit formed on one surface thereof, at least one subsidiary semiconductor chip stacked...
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7605021 |
Manufacturing method of electronic device
A manufacturing method of manufacturing an electronic device, includes the steps of: applying a thermosetting adhesive on a surface of a base having a conductive pattern formed on a film; mounting...
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7605019 |
Semiconductor device with stacked chips and method for manufacturing thereof
A semiconductor device includes a first semiconductor device and a second semiconductor device. Through-holes in the second semiconductor device extend from an upper side of the second...
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7598154 |
Manufacturing method of semiconductor device
Size of a chipping is made small, suppressing blinding of a blade, when performing dicing of a wafer. When cutting a wafer, cutting is performed so that the portion of a V character-shaped...
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7598120 |
Method for holding semiconductor wafer
Provided is a method comprising: back grinding a back side or a semiconductor wafer W having a protective tape applied on the surface thereof leaving annularly an outer peripheral part un-ground;...
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7595226 |
Method of packaging an integrated circuit die
A structure ( 40 ) for holding an integrated circuit die ( 38 ) during packaging includes a support substrate ( 42 ), a release film ( 44 ) attached to the substrate ( 42 ), and a swelling agent (...
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7592636 |
Radiation-emitting semiconductor component and method for the production thereof
A radiation-emitting semiconductor component having a radiation-transmissive substrate ( 1 ), on the underside of which a radiation-generating layer ( 2 ) is arranged, in which the substrate ( 1 )...
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7592594 |
Method of construction of CTE matching structure with wafer processing and resulting structure
A method includes bonding a first side of a metal shim to a silicon shim, removing metal from the metal shim to form a plurality of cleared metal lanes in accordance with a pattern, bonding a...
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7592237 |
Laser processing method and object to be processed
A laser processing method is provided, which, when cutting a substrate formed with a laminate part including a plurality of functional devices into a plurality of chips, each chip including at...
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7592236 |
Method for applying a structure of joining material to the back surfaces of semiconductor chips
A structure of joining material is applied to the back surfaces of semiconductor chips in manufacturing semiconductor devices. The joining material is applied, in finely metered and structured form...
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7592203 |
Method of manufacturing an electronic protection device
A method of manufacturing an electronic protection device comprises: providing a substrate mother board with a top surface and a bottom surface; forming a first conductive layer and a second...
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7585689 |
Method for manufacturing semiconductor laser device and method for inspecting semiconductor laser bar
A method for manufacturing a semiconductor laser device in which a first conductivity type cladding layer, and active layer, a second conductivity type first cladding layer, and a second...
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7582512 |
Method of fabricating semiconductor device having conducting portion of upper and lower conductive layers on a peripheral surface of the semiconductor device
A semiconductor device includes a base plate, at least one first conductive layer carried by the base plate, and a semiconductor constructing body formed on or above the base plate, and having a...
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7579260 |
Method of dividing an adhesive film bonded to a wafer
A method of dividing an adhesive film for die bonding which is bonded to the rear surface of a wafer having devices in a plurality of areas sectioned by dividing lines formed in a lattice pattern...
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7579216 |
Method of manufacturing a semiconductor device
A semiconductor device manufacturing method comprising the steps of providing a matrix substrate having a main surface with plural device areas formed thereon, fixing plural semiconductor chips to...
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7579215 |
Method for fabricating a low cost integrated circuit (IC) package
A method for fabricating a low cost integrated circuit package ( 600 ) includes separating a processed silicon wafer into a plurality of individual die ( 601 ) and then positioning the die ( 603 )...
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7575954 |
Ceramic substrate and method of breaking same
A ceramic substrate ( 100 ) includes a top surface, a plurality of identification marks ( 104 ), a protective compound ( 110 ), a bottom surface, and a plurality of grooves ( 106 ). The top surface...
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7572673 |
Wafer level package having a stress relief spacer and manufacturing method thereof
In a semiconductor device package having a stress relief spacer, and a manufacturing method thereof, metal interconnect fingers extend from the body of a chip provide for chip interconnection. The...
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7569422 |
Chip package and method for fabricating the same
A method for fabricating chip package includes providing a semiconductor chip with a metal bump, next adhering the semiconductor chip to a substrate using a glue material, next forming a polymer...
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7569421 |
Through-hole via on saw streets
A semiconductor device is manufactured by, first, providing a wafer designated with a saw street guide. The wafer is taped with a dicing tape. The wafer is singulated along the saw street guide...
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7567735 |
Optical device wafer, and optical device chip and method for manufacturing the same
An optical device wafer includes: a plurality of chip regions; and at least one connecting section, wherein the chip region includes a first semiconductor layer of a first conductivity type, an...
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7566575 |
Mounting circuit and method for producing semiconductor-chip-mounting circuit
A method according to the present invention for producing a semiconductor-chip-mounting circuit 1 includes mainly three steps. In a first step, contacts 2 each in the form of a conical helix...
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7563694 |
Scribe based bond pads for integrated circuits
A method and system for utilizing a semiconductor wafer is disclosed. The wafer comprises a plurality of semiconductor die and a plurality of scribe areas interspersed between. The method and...
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7563652 |
Method for encapsulating sensor chips
A method for encapsulating sensor chips is disclosed. A protective layer is formed on an active surface of a sensor chip, and at least covers a sensor region in the active surface. The active...
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7563642 |
Manufacturing method of a semiconductor device
A semiconductor wafer is mounted onto a dicing tape, the dicing tape comprising a first tape easy to stretch and a second tape difficult to stretch and provided on the first tape. Thereafter, a...
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7560801 |
Rewiring substrate strip with several semiconductor component positions
A rewiring substrate strip and a method of producing a rewiring substrate strip is disclosed. In one embodiment, the rewiring substrate strip has several semiconductor component positions for...
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7560371 |
Methods for selectively filling apertures in a substrate to form conductive vias with a liquid using a vacuum
Methods of forming a conductive via in a substrate include contacting the substrate with a wave of conductive liquid material, such as molten solder, and drawing the liquid material into the...
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7560302 |
Semiconductor device fabricating method
To improve the fabrication yield of semiconductor devices. A semiconductor device where a desired number of semiconductor chips are laminated in the thickness direction thereof is fabricated by...
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7557017 |
Method of manufacturing semiconductor device with two-step etching of layer
The invention is directed to improvement of reliability of a process of separating a layer to be patterned such as a wiring layer in a semiconductor device manufacturing method. A wiring layer is...
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7556985 |
Method of fabricating semiconductor device
A semiconductor device has a resin package layer on a principal surface of a semiconductor chip, on which a number of bump electrodes are formed, wherein the semiconductor device has a chamfer...
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7553745 |
Integrated circuit package, panel and methods of manufacturing the same
A method of manufacturing an integrated circuit package includes: assembling a composite wafer including alternating rows or columns of first and second strips on an adhesive tape, the first strips...
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7553700 |
Chemical-enhanced package singulation process
Singulation of individual electronic packages fabricated as part of a common matrix, is accomplished by mask patterning and chemical exposure in combination with physical sawing. In one embodiment...
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7553698 |
Semiconductor package having semiconductor constructing body and method of manufacturing the same
A semiconductor package includes at least one semiconductor constructing body which has a semiconductor substrate and a plurality of external connection electrodes formed thereon. An insulating...
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7552528 |
Wafer expanding device, component feeder, and expanding method for wafer sheet
In slack removal processing for removing slack generated on a wafer sheet by heating blow, a wafer feeding plate is positioned at a height position between a first height position and a second...
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7549560 |
Wafer dividing method
A method of dividing a wafer along a plurality of first dividing lines and a plurality of second dividing lines intersecting with the first dividing lines on the surface of the wafer. The method...
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7547578 |
Methods of processing semiconductor wafers having silicon carbide power devices thereon
Methods of forming a silicon carbide semiconductor device are disclosed. The methods include forming a semiconductor device at a first surface of a silicon carbide substrate having a first...
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