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7619312 |
Method and apparatus for precisely aligning integrated circuit chips
A system that facilitates precise inter-chip alignment. The system includes a first integrated circuit chip, whose surface has etch pit wells. The system also includes a second integrated circuit...
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7618844 |
Method of packaging and interconnection of integrated circuits
A semiconductor chip packaging on a flexible substrate is disclosed. The chip and the flexible substrate are provided with corresponding raised and indented micron-scale contact pads with the...
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7615856 |
Integrated antenna type circuit apparatus
An integrated antenna type circuit apparatus which provides excellent circuit characteristics while suppressing an increase in packaging area. The integrated antenna type circuit apparatus includes...
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7615462 |
Etch stop layer for silicon (Si) via etch in three-dimensional (3-D) wafer-to-wafer vertical stack
A method of forming a silicon (Si) via in vertically stacked wafers is provided with a contact plug extending from selected metallic lines of a top wafer and an etch stop layer formed prior to the...
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7615410 |
Chip-sized flip-chip semiconductor package and method for making the same
A semiconductor package ( 10; 14 ) comprises a semiconductor die ( 2; 2′ ) with a plurality of contact areas ( 4 ) on its active surface and an electrically conductive bump ( 7 ) on each contact...
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7611925 |
Electronic device and method of manufacturing the same, chip carrier, circuit board, and electronic instrument
An external terminal is formed on an interconnect pattern formed on a substrate by using a soldering material. Subsequently, a chip component having an electrode is mounted on the substrate. An...
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7608480 |
Method of fabricating a semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion
A semiconductor device includes metal foil to which a ground potential is applied, at a semiconductor constructing body provided on the metal foil and having a semiconductor substrate and a...
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7608469 |
Method of fabricating a chip
A method of fabricating a chip may include the step of providing a first electrical part. The method may also include the step of forming a shell with the first electrical part embedded in a first...
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7605020 |
Semiconductor chip package
A method of manufacturing a semiconductor chip package includes mechanically and electrically connecting a semiconductor chip to a top surface of a main substrate, securely attaching the...
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7603769 |
Method of coupling a surface mount device
Methods of coupling a surface mount device with a substrate such as a printed circuit, for example, are disclosed. A method, according to one aspect, may include coupling a holder with a substrate...
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7601612 |
Method for forming solder joints for a flip chip assembly
A method for forming a solder joint for a package arrangement with a dispersed Sn microstructure provides a flip chip on a package, with a flip chip having solder bumps to be connected by eutectic...
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7601560 |
Method for producing an electronic circuit
The invention relates to a method for producing an electronic circuit. According to said method, two semiconductor chips ( 46 ) with essentially the same structure are mounted on a surface ( 13 )...
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7598619 |
Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board
An integrated type semiconductor device that is capable of reducing cost or improving the reliability of connecting semiconductor chips together or chips to a circuit board. One embodiment of such...
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7598613 |
Flip chip bonding structure
A semiconductor device is provided with: a solid device having a connection surface formed with a connection electrode projected therefrom; a semiconductor chip which has a functional surface...
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7598123 |
Semiconductor component and method of manufacture
A semiconductor component comprising two stacked semiconductor dice and a method of manufacture. A leadframe having an active area that includes leadframe leads and a cavity is mounted to a support...
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7598121 |
Method of manufacturing a semiconductor device
A method of manufacturing a semiconductor device includes the steps of: grinding the rear surface of a semiconductor wafer to reduce its thickness; flattening the rear surface of the semiconductor...
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7598117 |
Method for manufacturing semiconductor module using interconnection structure
In a method for manufacturing a semiconductor module, a metal layer is formed on a support substrate. Then, first conductive posts and a first insulating layer are formed on the metal layer. The...
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7595223 |
Process for bonding and electrically connecting microsystems integrated in several distinct substrates
A process for bonding two distinct substrates that integrate microsystems, including the steps of forming micro-integrated devices in at least one of two substrates using micro-electronic...
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7592707 |
Method and apparatus for facilitating proximity communication and power delivery
One embodiment of the present invention provides a system that facilitates precise inter-chip alignment for proximity communication and power delivery. The system includes a first integrated...
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7592202 |
Embedding device in substrate cavity
An embodiment of the present invention is a technique to reduce interconnect length between devices. A cavity is formed in a substrate having a substrate surface. The cavity has a depth. A first...
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7588968 |
Linked chip attach and underfill
A method for attaching an integrated circuit chip to a package substrate includes placing the integrated circuit onto the package substrate, and performing reflow to attach the integrated circuit...
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7585702 |
Structure and assembly procedure for low stress thin die flip chip packages designed for low-K Si and thin core substrate
Provided are semiconductor die flip chip packages and semiconductor die flip chip package components where certain properties of the packages/components are controlled to facilitate management of...
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7582510 |
Electronic packaging materials for use with low-k dielectric-containing semiconductor devices
Electronic packaging materials for use with Low-k dielectric-containing semiconductor devices are provided.
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7579211 |
Flip-chip semiconductor device utilizing an elongated tip bump
A flip-chip type semiconductor device includes a semiconductor chip having electrode pads formed and arranged on a chip surface thereof. Sprout-shaped metal bumps are bonded to the electrode pads...
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7576432 |
Using external radiators with electroosmotic pumps for cooling integrated circuits
An integrated circuit to be cooled may be abutted in face-to-face abutment with a cooling integrated circuit. The cooling integrated circuit may include electroosmotic pumps to pump cooling fluid...
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7575999 |
Method for creating conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies
A method for forming at least one conductive element is disclosed. Particularly, a semiconductor substrate, including a plurality of semiconductor dice thereon, may be provided and a dielectric...
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7575955 |
Method for making electronic packages
A process for fabricating an electronic package for a Thermally Enhanced BGA package including the steps of fabricating a thermally conductive support member, an adhesive bonding member, and a...
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7573136 |
Semiconductor device assemblies and packages including multiple semiconductor device components
A multidie semiconductor device assembly or package includes an interposer comprising a substrate with at least one receptacle therethrough. A plurality of semiconductor device components (e.g.,...
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7572659 |
Semiconductor dynamic sensor and method of manufacturing the same
A semiconductor sensor includes an adhesive film for suppressing thermal stress transfer to a semiconductor sensor chip. More specifically, the adhesive film includes a first layer and a second...
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7569940 |
Method and device for connecting chips
The invention relates to an electronic device comprising:
a circuit, comprising a first and a second face, the first face being provided with electrical connection means, a transfer element,...
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7569420 |
Flip-chip packaging method for light emitting diode with eutectic layer not overlapping insulating layer
A packaging structure and method for a light emitting diode is provided. The present invention uses flip-chip and eutectic bonding technology to attach a LED to a thermal and electrical conducting...
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7569419 |
Method for manufacturing semiconductor device that includes mounting chip on board and sealing with two resins
The present invention provides a method for manufacturing a semiconductor device, which is capable of suppressing an overflow of a sealing resin and obtaining good sealing quality, simply and at...
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7566977 |
Semiconductor device and method for manufacturing the same
A method for manufacturing a semiconductor device, includes: mounting a semiconductor chip having an electrode on a wiring substrate having a base substrate and a wiring formed on the base...
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7566961 |
Multi-stacked package and method of manufacturing the same
A multi-stacked package includes a first package, a second package and a combining member. The second package supports the first package, and is electrically connected to the first package and has...
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7566649 |
Compressible films surrounding solder connectors
Disclosed is a method of forming an integrated circuit structure that forms lead-free connectors on a device, surrounds the lead-free connectors with a compressible film, connects the device to a...
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7566591 |
Method and system for secure heat sink attachment on semiconductor devices with macroscopic uneven surface features
Methods, systems, and apparatuses for attaching heat sinks to integrated circuit packages using thermally conductive adhesive materials are described. The adhesive materials can be shaped to...
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7566586 |
Method of manufacturing a semiconductor device
A method of manufacturing a semiconductor device flip-chip bonds electrode terminals of a substrate and a semiconductor chip together by solid-phase diffusion and underfills a gap between the...
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7566575 |
Mounting circuit and method for producing semiconductor-chip-mounting circuit
A method according to the present invention for producing a semiconductor-chip-mounting circuit 1 includes mainly three steps. In a first step, contacts 2 each in the form of a conical helix...
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7563703 |
Microelectronic interconnect device comprising localised conductive pins
A method producing conductive rods localized on conductive blocks of an electronic component.
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7563641 |
Laminated light-emitting diode display device and manufacturing method thereof
A laminated light-emitting diode display device and a manufacturing method thereof are described. The laminated light-emitting diode display device has an insulator, a circuitry device placed on...
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7560371 |
Methods for selectively filling apertures in a substrate to form conductive vias with a liquid using a vacuum
Methods of forming a conductive via in a substrate include contacting the substrate with a wave of conductive liquid material, such as molten solder, and drawing the liquid material into the...
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7560306 |
Manufacturing process for chip package without core
A manufacturing process for chip package without core is disclosed. First of all, a conductive layer with a first surface and a second surface is provided. A first film is formed onto the first...
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7557452 |
Reinforced, self-aligning conductive structures for semiconductor device components and methods for fabricating same
A conductive structure configured to connect a contact pad of a semiconductor device with a corresponding contact pad of a substrate. The conductive structure includes two interconnectable members,...
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7556983 |
Thin planar semiconductor device having electrodes on both surfaces and method of fabricating same
A thin, planar semiconductor device having electrodes on both surfaces is disclosed. This semiconductor device is provided with an IC chip and a wiring layer having one side that is electrically...
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7553743 |
Wafer bonding method of system in package
A method of bonding a wafer in a system in package is provided. A plating layer is formed on each of a first semiconductor substrate and a second semiconductor substrate. The plating layers are...
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7553697 |
Multiple chip semiconductor package
A semiconductor device package and method of fabricating the same are disclosed. The semiconductor device package may include a variety of semiconductor dice, thereby providing a system on a chip...
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7552532 |
Method for hermetically encapsulating a component
A method is provided to produce a hermetic encapsulation for an electronic component, which may be an optical and at least partially light-permeable component or a surface wave component, comprises...
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7550316 |
Board on chip package and manufacturing method thereof
An aspect of the present invention features a manufacturing method of a board on chip package. The method can comprise: (a) laminating a dry film on a carrier film, one side of which is laminated...
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7550315 |
Method for fabricating semiconductor package with multi-layer die contact and external contact
A semiconductor package includes a substrate formed of a board material, a semiconductor die bonded to the substrate, and an encapsulant on the die. The package also includes an array of external...
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7550314 |
Patterned plasma treatment to improve distribution of underfill material
A patterned plasma treatment may be provided on the chip and/or the substrate to enhance the distribution of underfill material between the chip and the substrate. The underfill material is...
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