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Match Document Document Title
7429787 Semiconductor assembly including chip scale package and second substrate with exposed surfaces on upper and lower sides  
Semiconductor assemblies include a first package, each having at least one die affixed to, and electrically interconnected with, a die attach side of the first package substrate, and a second...
7427535 Semiconductor/printed circuit board assembly, and computer system  
A method of forming a computer system and a printed circuit board assembly, are provided comprising first and second semiconductor dies and an intermediate substrate. The intermediate substrate is...
7425467 Web process interconnect in electronic assemblies  
Apparatuses and methods for forming displays are claimed. One embodiment of the invention relates to depositing a plurality of blocks onto a substrate and is coupled to a flexible layer having...
7425466 Wire bonding system and method of use  
A semiconductor package wire bonding system and method of use are provided. The wire bonding system includes a heating block that heats and supports a printed circuit board on which a multi-layered...
7425465 Method of fabricating a multi-post structures on a substrate  
Micromechanical devices having complex multilayer structures and techniques for forming the devices are described.
7425464 Semiconductor device packaging  
Methods and apparatus are provided for encapsulating electronic devices, comprising: providing one or more electronic devices ( 62 ) with primary faces ( 63 ) having electrical contacts ( 69 ),...
7425462 Methods relating to the reconstruction of semiconductor wafers for wafer-level processing  
Methods relating to the reconstruction of semiconductor wafers for wafer-level processing are disclosed. Selected semiconductor dice having alignment cavities formed in a surface thereof are placed...
7422930 Integrated circuit with re-route layer and stacked die assembly  
An apparatus and a method of manufacture for a stacked-die assembly. A first die is placed on a substrate such that the backside of the die, i.e., the side opposite the side with the bond pads, is...
7422928 Process for fabricating a micro-electro-mechanical system with movable components  
A process for fabricating a micro-electro-mechanical system (MEMS) composed of fixed components fixedly supported on a lower substrate and movable components movably supported on the lower...
7420273 Thinned die integrated circuit package  
A method and apparatus provide an integrated circuit package with improved heat dissipation and easier fabrication. The integrated circuit package includes a thinned semiconductor die attached to a...
7419851 Method of making a semiconductor chip assembly with a metal containment wall and a solder terminal  
A method of making a semiconductor chip assembly includes providing a metal base, a routing line, a metal containment wall and a solder layer in which the metal containment wall includes a cavity...
7417322 Multi-chip module with embedded package and method for manufacturing the same  
A multi-chip module comprises a first package and at least a second package. The first package includes a substrate, at least a first chip, an encapsulant, and a plurality of solder balls. The...
7416919 Method for wafer level stack die placement  
A method for wafer level stack die placement is disclosed. At first, a wafer including a plurality of dice is provided. The wafer is adhered to a photosensitive adhesive tape. The wafer is attached...
7414299 Semiconductor package assembly and method for electrically isolating modules  
A semiconductor package assembly and method for electrically isolating modules, having a capacitor within the semiconductor package assembly. The package assembly and method are suitable for...
7413965 Method of manufacturing a thin-film circuit substrate having penetrating structure, and protecting adhesive tape  
A method of manufacturing a thin-film circuit substrate, containing: (a) gouging a surface of a circuit substrate in a depth at least approximately equal to a thickness of a final product of the...
7413926 Methods of making microelectronic packages  
A method of making a microelectronic package includes providing a first substrate having a top surface, providing a second substrate having a top surface including a plurality of conductive pads, a...
7410884 3D integrated circuits using thick metal for backside connections and offset bumps  
Backside connections for 3D integrated circuits and methods to fabricate thereof are described. A stack of a first wafer over a second wafer that has a substrate of the first wafer on top of the...
7407883 Electronic package with improved current carrying capability and method of forming the same  
An electronic package and method for forming such package that expands the current capability of lines and/or reducing line resistance for packages with a given feature dimension while relaxing...
7405487 Method and apparatus for removing encapsulating material from a packaged microelectronic device  
A method and apparatus for encapsulating microelectronic devices. In one embodiment, the method includes removing a portion of encapsulating material that at least partially surrounds a...
7405476 Asymmetric alignment of substrate interconnect to semiconductor die  
An apparatus includes a first semiconductor die and at least one further semiconductor die. A substrate is attached to the first die and the further die and has an electrical interconnect pattern...
7400037 Packaging structure with coplanar filling paste and dice and with patterned glue for WL-CSP  
A filling paste structure and process of wafer level package is disclosed. The process comprises filling an adhesive material to fill among plurality of dice and cover the plurality of dice. The...
7396700 Method for fabricating thermally enhanced semiconductor device  
A method for fabricating a thermally enhanced semiconductor device. A support plate having at least one opening is mounted on a heat sink. At least one chip is mounted on the heat sink and received...
7393718 Unmolded package for a semiconductor device  
A semiconductor device that does not include a molded body or package. The semiconductor device includes a substrate and a die coupled to the substrate. The die is coupled to the substrate such...
7390742 Method for producing a rewiring printed circuit board  
The invention relates to a method for producing a rewiring printed circuit board with a substrate wafer having passage connections between a first and a second surface. One embodiment of the method...
7390699 Integrated circuit die connection methods and apparatus  
This invention generally relates to methods and apparatus for connecting to an integrated circuit die, in particular where the die includes both analogue/microwave radio frequency (rf) circuitry...
7388277 Chip and wafer integration process using vertical connections  
A process is described for semiconductor device integration at chip level or wafer level, in which vertical connections are formed through a substrate. A metallized feature is formed in the top...
7387951 Method of dicing semiconductor wafer into chips, and apparatus using this method  
The invention relates to a semiconductor wafer dicing method of dicing a semiconductor wafer along parting lines into chips. The semiconductor wafer in which parting lines along which the...
7384819 Method of forming stackable package  
A method of forming a semiconductor package ( 50 and 52 ) includes providing a substrate ( 14 ) having a die pad and bond pads on a first surface ( 20 ) and conductive pads ( 66, 68 and 74 ) on...
7381593 Method and apparatus for stacked die packaging  
A method and apparatus for stacked die packaging provide a leadframe configured for supporting a lower semiconductor die. At least one pillar is formed on the leadframe for supporting an upper...
7381587 Method of making circuitized substrate  
A method of making a circuitized substrate and an electrical assembly utilizing same in which the substrate is comprised of at least two sub-composites in which the dielectric material of at least...
7378735 High performance sub-system design and assembly  
A multiple integrated circuit chip structure provides interchip communication between integrated circuit chips of the structure with no ESD protection circuits and no input/output circuitry. The...
7378290 Isolation circuit  
An isolation circuit includes a first pad adapted to receive a control signal and a second pad adapted to receive another signal. A third pad is coupled to a microelectronic die and a device is...
7374972 Micro-package, multi-stack micro-package, and manufacturing method therefor  
A micro package, a multi-stack micro package, and a manufacture method therefor are provided. A micro package according to the present invention includes a device substrate for mounting a devices,...
7374966 Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby  
The present invention relates to an apparatus for stacking semiconductor chips, a method for manufacturing a semiconductor package using the same and a semiconductor package manufactured thereby....
7371607 Method of manufacturing semiconductor device and method of manufacturing electronic device  
A method of manufacturing a semiconductor device includes mounting a first semiconductor chip on each partitioned region of a frame substrate partitioned for each first semiconductor package;...
7368809 Pillar grid array package  
A pillar grid array package (PGA) includes a substrate, a chip disposed on top of the substrate, and a plurality of stud bumps disposed on bottom of the substrate. The stud bumps are formed in an...
7368808 MEMS packaging using a non-silicon substrate for encapsulation and interconnection  
A MEMS die is bonded to a cap to form a MEMS device. The cap is non-silicon and has an electrical via extending from one side of the cap to another side of the cap. In one embodiment, a plurality...
7368398 Substrate processing apparatus and substrate processing method  
A substrate processing apparatus includes a reaction chamber with a structure allowing pressure reduction, a shower head for supplying a processing gas into the reaction chamber including a gas...
7368325 Semiconductor package  
A semiconductor package that includes a conductive can, a power semiconductor device electrically and mechanically attached to the inside surface of the can, and an IC semiconductor device...
7358115 Method of fabricating a semiconductor assembly including chip scale package and second substrate with exposed substrate surfaces on upper and lower sides  
A semiconductor multi-package module has stacked lower and upper packages, each package including a die attached to a substrate, in which the upper and lower substrates are interconnected by wire...
7348217 Method and structure for interfacing electronic devices  
Method and structure for optimizing and controlling diffusional creep at metal contact interfaces are disclosed. Embodiments of the invention accommodate height variations in adjacent contacts,...
7348214 Integrated circuit package with improved power signal connection  
An integrated circuit (IC) package includes a substrate and an IC die mounted on a first side of the substrate. The IC package also includes a plurality of capacitors mounted on a second side of...
7348211 Method for fabricating semiconductor packages  
A method for fabricating semiconductor packages is proposed. A plurality of substrates each having a chip thereon are prepared. Each substrate has similar length and width to the predetermined...
7344919 Method for using gel package structure enhancing thermal dissipation between compressed printed circuit board and heat sink mechanical stiffener  
A MCM system board uses a stiffener arrangement to enhance mechanical, thermo and electrical properties by incorporating an LGA compression connector in a computer system. The present designs of...
7342262 Split-gate power module for suppressing oscillation therein  
The invention involves a method of packaging and interconnecting four power transistor dies to operate at a first frequency without oscillation at a second frequency higher than the first frequency...
7341894 Semiconductor, electrooptic apparatus and electronic apparatus  
In a semiconductor device made by forming functional elements on a first substrate, transferring the element chip onto a second substrate, and connecting first pads on the element chip to second...
7341887 Integrated circuit die configuration for packaging  
Integrate circuit die terminal arrangements and configurations for mounting an integrate circuit die on a package substrate to reduce package transmission paths. In one embodiment, terminals for...
7340828 Method for producing metal/ceramic bonding circuit board  
There is provided a method for producing a metal/ceramic bonding circuit board, which can form a fine pattern even if a circuit forming metal plate is thick and which can shorten the time required...
7339278 Cavity chip package  
A package for an IC includes a carrier with a cavity formed on one of the major surfaces. Bumps of a semiconductor die are mated to contact pads located on the bottom of the cavity. The die is...
7338884 Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device  
An interconnecting substrate for carrying a semiconductor device, comprising: an insulating layer; an interconnection set on an obverse surface of the insulating layer; an electrode which is set on...
Matches 1 - 50 out of 1045 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >