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7622813 |
Oriented self-location of microstructures with alignment structures
An electronic apparatus comprising one or more microstructures on a substrate and a method for fabricating the electronic apparatus. The microstructures have alignment structures that allow the...
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7622330 |
Semiconductor substrates having useful and transfer layers
A method of fabricating composite substrates by associating a plurality of transfer layers in spaced relation upon a single intermediate support; providing a support layer on each transfer layer to...
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7622329 |
Method for fabricating core substrate using paste bumps
A core substrate and multilayer printed circuit board using paste bumps and manufacturing method thereof are disclosed. With the method of manufacturing a core substrate using paste bumps...
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7618875 |
Marking method for product information
A product information marking method including a back side grinding step for grinding the back side of a wafer having a plurality of devices formed on the front side so as to be partitioned by a...
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7618847 |
Bonding method of semiconductor and laminated structure fabricated thereby
A bonding method (three-dimensional mounting) of semiconductor substrates is provided to sequentially bond a principal surface of a silicon wafer on which coupling bumps are formed, and a principal...
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7618843 |
Method of fabricating multilayer ceramic substrate
A method of fabricating a multilayer ceramic substrate includes stacking one or a plurality of unfired ceramic greensheets on one or both sides of a previously fired ceramic substrate, thereby...
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7615479 |
Assembly comprising functional block deposited therein
An electronic assembly. The assembly includes a substrate, a plurality of recessed regions, and a plurality of functional blocks. Each functional block is deposited in one of the recessed regions....
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7615409 |
Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages
An electronic component is disclosed including a plurality of stacked semiconductor packages. A first such embodiment includes an internal connector for electrically coupling the stacked...
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7615408 |
Method of manufacturing semiconductor device
An internal connecting terminal 12 is formed on electrode pads 23 of a plurality of semiconductor chips 11 formed on a semiconductor substrate 35 , and there is formed a resin member 13 ...
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7611924 |
Integrated circuit package with chip-side signal connections
Embodiments of the present invention include an apparatus, method, and/or system for an integrated circuit package with signal connections on the chip-side of the package structure.
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7608480 |
Method of fabricating a semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion
A semiconductor device includes metal foil to which a ground potential is applied, at a semiconductor constructing body provided on the metal foil and having a semiconductor substrate and a...
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7608477 |
Process for substrate incorporating component
In a process for producing the component-embedded substrate, a first electronic component is connected and fixed onto a first electrode pattern with a conductive bonding material, the first...
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7608469 |
Method of fabricating a chip
A method of fabricating a chip may include the step of providing a first electrical part. The method may also include the step of forming a shell with the first electrical part embedded in a first...
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7605478 |
Semiconductor package and method of manufacturing the same
Provided are a semiconductor package and a method of manufacturing the semiconductor package, and more particularly, a semiconductor package with bonding wires and a method of manufacturing the...
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7605466 |
Sealed wafer packaging of microelectromechanical systems
Multiple microelectromechanical systems (MEMS) on a substrate are capped with a cover using a layer that may function as a bonding agent, separation layer, and hermetic seal. A substrate has a...
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7601612 |
Method for forming solder joints for a flip chip assembly
A method for forming a solder joint for a package arrangement with a dispersed Sn microstructure provides a flip chip on a package, with a flip chip having solder bumps to be connected by eutectic...
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7601559 |
Apparatus and method for identifying proper orientation and electrical conductivity between a semiconductor device and a socket or contactor
A semiconductor device with a semiconductor die thereon and a contactor board are electrically coupled when the electrically conductive elements on the semiconductor device and the contactor board...
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7598619 |
Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board
An integrated type semiconductor device that is capable of reducing cost or improving the reliability of connecting semiconductor chips together or chips to a circuit board. One embodiment of such...
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7598100 |
Manufacturing method of semiconductor integrated circuit device
As the thickness of the card holder for preventing warping of a multilayered wiring substrate 1 is increased, there occurs a problem that a thin film sheet 2 is buried in a card holder and...
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7595222 |
Semiconductor device and manufacturing method thereof
The semiconductor device includes a first semiconductor chip having first electrodes on a fringe region of a main surface thereof, and a second semiconductor chip smaller in area than the first...
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7595221 |
Method of fabricating a patterned device using sacrificial spacer layer
A method of fabricating a device using a sacrificial layer by selecting a substrate; forming a first step on the substrate, where the first step is formed from a second material; depositing a...
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7592707 |
Method and apparatus for facilitating proximity communication and power delivery
One embodiment of the present invention provides a system that facilitates precise inter-chip alignment for proximity communication and power delivery. The system includes a first integrated...
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7589412 |
Semiconductor device
One of the aspects of the present invention is to provide a semiconductor device, which includes a base plate, an insulating substrate on the base plate, and a wiring patterned layer on the...
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7588966 |
Chip mounting with flowable layer
A circuit structure may be formed in a substrate having a face and an open trench, where one or more chips are to be mounted. At least one bridge may extend across an intermediate portion of the...
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7586183 |
Multilevel semiconductor module and method for fabricating the same
A semiconductor module is formed by alternately stacking resin boards and sheet members. Each of the resin boards includes first buried conductors. A semiconductor chip is mounted on the upper face...
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7585699 |
Semiconductor package board using a metal base
A semiconductor package board for mounting thereon a semiconductor chip includes a metal base having an opening for receiving therein the semiconductor chip and a multilayer wiring film layered...
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7582963 |
Vertically integrated system-in-a-package
According to one embodiment of the invention, a method of forming a system-in-a-package includes providing a first substrate, coupling a first die to a top surface of the first substrate, coupling...
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7579214 |
Semiconductor device and a method of manufacturing the same
To form a driver circuit to be mounted to a liquid crystal display device or the like on a glass substrate, a quartz substrate, etc., and to provide a display device mounting driver circuits formed...
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7575999 |
Method for creating conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies
A method for forming at least one conductive element is disclosed. Particularly, a semiconductor substrate, including a plurality of semiconductor dice thereon, may be provided and a dielectric...
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7575955 |
Method for making electronic packages
A process for fabricating an electronic package for a Thermally Enhanced BGA package including the steps of fabricating a thermally conductive support member, an adhesive bonding member, and a...
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7569918 |
Semiconductor package-on-package system including integrated passive components
A semiconductor system ( 300 ) has one or more packaged active subsystems ( 310, 330 ); each subsystem has a substrate with electrical contact pads and one or more semiconductor chips stacked on...
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7566977 |
Semiconductor device and method for manufacturing the same
A method for manufacturing a semiconductor device, includes: mounting a semiconductor chip having an electrode on a wiring substrate having a base substrate and a wiring formed on the base...
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7566648 |
Method of making solder pad
A method of making a solder pad includes providing a substrate having a metal layer formed on it, and applying a photo resist to the metal layer. The photo resist is patterned. A first etching...
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7566632 |
Lock and key structure for three-dimensional chip connection and process thereof
A method positions a first wafer with respect to a second wafer such that key studs on the first wafer are fit (positioned) within lock openings in the second wafer. The key studs contact...
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7566591 |
Method and system for secure heat sink attachment on semiconductor devices with macroscopic uneven surface features
Methods, systems, and apparatuses for attaching heat sinks to integrated circuit packages using thermally conductive adhesive materials are described. The adhesive materials can be shaped to...
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7564137 |
Stackable integrated circuit structures and systems devices and methods related thereto
An apparatus and a method for packaging semiconductor devices. The apparatus is a three-dimensional electronic package comprising one or more electronic components, a plurality of electrical...
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7563640 |
Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof
A first semiconductor element is mounted on a base plate, and is in a sealed state by the periphery thereof being covered by an insulation member, and the upper surface thereof being covered by an...
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7561221 |
Apparatuses and methods for forming assemblies
Apparatuses and methods for forming displays are claimed. One embodiment of the invention relates to forming a flexible active matrix display along a length of flexible substrate. Another...
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7560304 |
Method of making a semiconductor device having multiple die redistribution layer
A semiconductor device and methods of forming same are disclosed having multiple die redistribution layer. After fabrication of semiconductor die on a wafer and prior to singulation from the wafer,...
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7560303 |
Method and apparatus for linear die transfer
A method for assembling a semiconductor device including the steps of providing a penetrable substrate having an adhesive surface and a plurality of dies disposed on the adhesive surface; providing...
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7557451 |
Electro-optical device and electronic apparatus
An electro-optical device includes a substrate that holds an electro-optical material; and a flexible substrate that is connected to the substrate. The flexible substrate has a first connecting...
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7554177 |
Attachment system incorporating a recess in a structure
An attachment system. The attachment system includes a first structure and a second structure. The first structure has a surface and a recess in the surface. The second structure is molded into the...
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7553698 |
Semiconductor package having semiconductor constructing body and method of manufacturing the same
A semiconductor package includes at least one semiconductor constructing body which has a semiconductor substrate and a plurality of external connection electrodes formed thereon. An insulating...
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7553696 |
Method for implementing component placement suspended within grid array packages for enhanced electrical performance
A method and structure are provided for implementing component placement suspended within electrical pin grid array packages for enhanced electrical performance. A solder column grid array is...
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7553695 |
Method of fabricating a package for a micro component
Techniques are disclosed for fabricating a relatively thin package for housing a micro component, such as an opto-electronic or MEMs device. The packages may be fabricated in a wafer-level batch...
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7547577 |
Method of making circuitized substrate with solder paste connections
A method of making a circuitized substrate assembly in which two or more subassemblies are aligned and bonded together. The bonding, preferably using lamination, results in effective electrical...
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7547575 |
Two-stage die-bonding method for simultaneous die-bonding of multiple dies
A die bonder and a die bonding method thereof are provided. The die bonder includes a wafer platform, an arranging platform, a conveyer, at least one first pick-up device and a second pick-up...
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7545029 |
Stack microelectronic assemblies
A stacked microelectronic assembly includes a base substrate having conductive elements projecting from a bottom surface thereof and a first microelectronic subassembly underlying a bottom surface...
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7544539 |
Forced heat transfer apparatus for heating stacked dice
An apparatus and method are provided for effectively heating a first die stacked above a second die attached onto a substrate during wire bonding conducted on the first die. A gas outlet...
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7544529 |
Image sensor packaging structure and method of manufacturing the same
An image sensor module includes a first substrate, a second substrate provided over the first substrate, an image sensor device for receiving an image signal flip-chip bonded to the second...
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