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7622813 |
Oriented self-location of microstructures with alignment structures
An electronic apparatus comprising one or more microstructures on a substrate and a method for fabricating the electronic apparatus. The microstructures have alignment structures that allow the...
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7622367 |
Methods and devices for fabricating and assembling printable semiconductor elements
The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device...
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7622328 |
Processing method of wafer
A separation groove having a depth corresponding to a finished thickness of a semiconductor chip is formed in a boundary between a device region and an outer peripheral surplus region of a wafer, a...
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7622327 |
Covered devices in a semiconductor package
An embodiment of the present invention is a technique to fabricate a cover assembly. A cover has a base plate and sidewalls attached to perimeter of the base plate. The sidewalls have a height. A...
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7622326 |
Manufacturing process of a chip package structure
A manufacturing process of a chip package structure is provided. The manufacturing method uses fine pitch circuit processes, such as a TFT-LCD process or an IC process, to increase layout density...
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7622325 |
Integrated circuit package system including high-density small footprint system-in-package
An integrated circuit package system including a high-density small footprint system-in-package with a substrate is provided. Passive components are mounted on the substrate. Solder separators are...
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7622324 |
Wafer bonding hermetic encapsulation
A method for providing encapsulation of an electronic device which obtains an encapsulating member configured to enclose the electronic device, prepares a surface of the encapsulating member for...
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7622313 |
Fabrication of three dimensional integrated circuit employing multiple die panels
A method of assembling an electronic device includes testing a first wafer of first die to identify the location of functional first die and dividing the first wafer into a set of panels, wherein a...
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7622309 |
Mechanical integrity evaluation of low-k devices with bump shear
A bump shear test is disclosed for evaluating the mechanical integrity of low-k interconnect stacks in an integrated circuit which includes a die test structure ( 11 ) having a stiff structural...
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7621969 |
Mounting system
A mounting system is provided with a substrate loader section, a chip mounting section, and a substrate unloader section for sequentially taking out substrates whereupon chips are mounted. The...
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7619312 |
Method and apparatus for precisely aligning integrated circuit chips
A system that facilitates precise inter-chip alignment. The system includes a first integrated circuit chip, whose surface has etch pit wells. The system also includes a second integrated circuit...
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7618875 |
Marking method for product information
A product information marking method including a back side grinding step for grinding the back side of a wafer having a plurality of devices formed on the front side so as to be partitioned by a...
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7618842 |
Method of applying encapsulant to wire bonds
A method of applying encapsulant to wire bonds between a die and conductors on a supporting substrate, by forming a bead of the encapsulant on a profiling surface, positioning the profiling surface...
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7615492 |
Preparing method of CNT-based semiconductor sensitized solar cell
A solar cell is prepared. The solar cell is photo-sensitized. The solar cell has a semiconductor layer. And carbon nanotubes are deposited on the semiconductor layer with an arrangement. The solar...
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7615479 |
Assembly comprising functional block deposited therein
An electronic assembly. The assembly includes a substrate, a plurality of recessed regions, and a plurality of functional blocks. Each functional block is deposited in one of the recessed regions....
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7615414 |
Dental intraoral radiological image sensor with a fiber-optic plate
The invention relates to dental radiological image sensors for intraoral use. What is described is a method of fabricating an image sensor, comprising steps for the collective production of a...
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7615412 |
System in package (SIP) integrated circuit and packaging method thereof
The present invention discloses a system in package (SIP) integrated circuit and a packaging method thereof. The SIP integrated circuit includes one or more first block dices produced by a first...
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7615411 |
Semiconductor package including connected upper and lower interconnections, and manufacturing method thereof
A semiconductor package includes a base plate, at least one semiconductor constructing body which is formed on one surface of the base plate and has a plurality of external connection electrodes...
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7615408 |
Method of manufacturing semiconductor device
An internal connecting terminal 12 is formed on electrode pads 23 of a plurality of semiconductor chips 11 formed on a semiconductor substrate 35 , and there is formed a resin member 13 ...
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7615407 |
Methods and systems for packaging integrated circuits with integrated passive components
A method is described for packaging integrated circuit dice such that each package includes a die with an integrated passive component mounted to the active surface of the die.
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7615406 |
Electronic device package manufacturing method and electronic device package
By joining a lid member to a base member, internal electrodes put in contact with the lid member and an electronic device connected to the internal electrodes are placed in an internal space...
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7615405 |
Method for precision assembly of integrated circuit chip packages
An electronic dive and method of fabricating an electronic device. The method including placing a placement guide over a top surface of a module substrate, the placement guide having a guide...
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7615404 |
High-contrast laser mark on substrate surfaces
As part of a first configured laser operation, a smooth, more reflective marking area is formed at a surface of a substrate (e.g., integral heat spreader, or IHS). In a second configured laser...
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7612992 |
Cooling device for memory chips
A cooling device for memory chip includes a first part and a second part which is pivotably connected to the first part at a top thereof. Each of the first and second parts includes an elongate...
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7611924 |
Integrated circuit package with chip-side signal connections
Embodiments of the present invention include an apparatus, method, and/or system for an integrated circuit package with signal connections on the chip-side of the package structure.
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7611923 |
Method and apparatus for forming stacked die and substrate structures for increased packing density
A stacked semiconductor apparatus has at least one die attached to a first side of a carrier substrate. A first circuitized substrate is attached to the first side of the carrier substrate and...
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7608480 |
Method of fabricating a semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion
A semiconductor device includes metal foil to which a ground potential is applied, at a semiconductor constructing body provided on the metal foil and having a semiconductor substrate and a...
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7608479 |
Method of manufacturing semiconductor device and method of treating electrical connection section
A method of manufacturing a semiconductor device includes: applying a paste containing acid to an electrical connection section which is electrically connected with a semiconductor substrate;...
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7608478 |
On-chip igniter and method of manufacture
A chip for igniting nanoenergetic materials, includes a substrate, an igniter positioned on the substrate and the nanoenergetic material arranged in a linear pattern positioned on said substrate. A...
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7608477 |
Process for substrate incorporating component
In a process for producing the component-embedded substrate, a first electronic component is connected and fixed onto a first electrode pattern with a conductive bonding material, the first...
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7607222 |
Method of manufacturing an electronic component package
An electronic component package and a manufacturing method thereof are disclosed. A method of manufacturing an electronic component package, which includes: forming a protrusion part on a first...
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7606033 |
Mounting a heat sink in thermal contact with an electronic component
A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the...
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7605092 |
Passive elements, articles, packages, semiconductor composites, and methods of manufacturing same
Systems and methods associated with semiconductor articles are disclosed, including forming a first layer of material on a substrate, etching trenches within regions defining a passive element in...
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7605021 |
Manufacturing method of electronic device
A manufacturing method of manufacturing an electronic device, includes the steps of: applying a thermosetting adhesive on a surface of a base having a conductive pattern formed on a film; mounting...
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7605018 |
Method for forming a die-attach layer during semiconductor packaging processes
Disclosed is a method for forming a die-attach layer during semiconductor packaging processes. A chip carrier includes a substrate core and a stiffener. Top surface of the substrate core includes a...
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7601612 |
Method for forming solder joints for a flip chip assembly
A method for forming a solder joint for a package arrangement with a dispersed Sn microstructure provides a flip chip on a package, with a flip chip having solder bumps to be connected by eutectic...
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7601563 |
Small form factor molded memory card and a method thereof
A shape-molding structure of a memory card comprises a circuit substrate, at least one chip, and an encapsulant covering. The upper and lower surfaces of the circuit substrate have a circuit layer...
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7601559 |
Apparatus and method for identifying proper orientation and electrical conductivity between a semiconductor device and a socket or contactor
A semiconductor device with a semiconductor die thereon and a contactor board are electrically coupled when the electrically conductive elements on the semiconductor device and the contactor board...
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7598125 |
Method for wafer level packaging and fabricating cap structures
A cap wafer with cavities is etched through areas not covered by a patterned photoresist to form a plurality of openings. The cap wafer is bonded to a transparent wafer at the surface having the...
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7598121 |
Method of manufacturing a semiconductor device
A method of manufacturing a semiconductor device includes the steps of: grinding the rear surface of a semiconductor wafer to reduce its thickness; flattening the rear surface of the semiconductor...
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7598120 |
Method for holding semiconductor wafer
Provided is a method comprising: back grinding a back side or a semiconductor wafer W having a protective tape applied on the surface thereof leaving annularly an outer peripheral part un-ground;...
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7598119 |
System and method for inhibiting and containing resin bleed-out from adhesive materials used in assembly of semiconductor devices
System and method for preventing resin-based adhesive from contacting a substrate to minimize resin bleed-out and contamination. A preferred embodiment comprises a semiconductor device having a die...
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7598118 |
Method of manufacturing semiconductor sensor
A method of manufacturing a semiconductor sensor includes a forming step, a preparing step, a fixing step and a separating step. In the forming step, a plurality of caps made of resin is formed on...
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7598117 |
Method for manufacturing semiconductor module using interconnection structure
In a method for manufacturing a semiconductor module, a metal layer is formed on a support substrate. Then, first conductive posts and a first insulating layer are formed on the metal layer. The...
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7595221 |
Method of fabricating a patterned device using sacrificial spacer layer
A method of fabricating a device using a sacrificial layer by selecting a substrate; forming a first step on the substrate, where the first step is formed from a second material; depositing a...
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7595220 |
Image sensor package and fabrication method thereof
The invention provides an image sensor package and method for fabricating the same. The image sensor package comprises a first substrate comprising a sensor device thereon and a hole therein. A...
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7595219 |
IC chip mounting method for mounting two or more IC chips by sequentially transferring the IC chips sucked onto a first roller to a second roller and mounting the IC chips transferred to the second roller on a traveling base
The present invention provides an IC chip mounting method for mounting two or more IC chips on a base, including: preparing a wafer by mounting a tape on a face thereof, which is the reverse of the...
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7588962 |
Method of making semiconductor device
A method for manufacturing a semiconductor device that includes a housing, formed of a polyamide-series thermoplastic resin, and a semiconductor package sealed in the housing, which is formed of a...
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7586193 |
Mm-wave antenna using conventional IC packaging
An integrated circuit with an antenna and a method of forming the integrated circuit. The method includes, in an integrated circuit package, forming each bond to or from an integrated circuit pad...
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7585700 |
Ball grid array package stack
Disclosed herein is a ball grid array (BGA) package stack that is not limited by ball arrangement because it utilizes a foldable circuit substrate, which permits interconnection between upper and...
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