Matches 101 - 150 out of 1839 < 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >
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7545027 Wafer level package having redistribution interconnection layer and method of forming the same  
A wafer level package may include a semiconductor substrate supporting an electrode pad. A first insulating layer may be provided on the semiconductor substrate. The first insulating layer may...
7544527 Method and apparatus for providing optoelectronic communication with an electronic device  
An optoelectronic assembly for an electronic system includes a thermally conductive, metallized transparent substrate having a first surface and an opposite second surface. A support chip set is...
7544537 Semiconductor IC-embedded substrate and method for manufacturing same  
A semiconductor IC-embedded substrate suitable for embedding a semiconductor IC in which the electrode pitch is extremely narrow. The substrate comprises a semiconductor IC 120 in which stud...
7544538 Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the same  
Provided are methods of fabricating semiconductor chips, semiconductor chips formed by the methods, and chip-stack packages having the semiconductor chips. One embodiment specifies a method that...
7537959 Chip stack package and manufacturing method thereof  
A chip stack package is manufactured at a wafer level by forming connection vias in the scribe lanes adjacent the chips and connecting the device chip pads to the connection vias using rerouting...
7537958 High performance multi-chip flip chip package  
A structure and method of manufacture for an improved multi-chip semiconductor package that reduces package resistance to a negligible level, and offers superior thermal performance. Housing of...
7538022 Method of manufacturing electronic circuit device  
The method of manufacturing an electronic circuit device according to an embodiment of the present invention includes preparing an interconnect substrate 10 including an interconnect 14 and an...
7537960 Method of making multi-chip package with high-speed serial communications between semiconductor dice  
A multi-chip package includes a package substrate. First and second semiconductor die are formed on the package substrate. The first and the second semiconductor die are configured to communicate...
7535097 Semiconductor device and method of manufacturing the same  
A semiconductor device includes a semiconductor chip having at least an electrode pad and a device formed on a semiconductor layer on its surface, a seal cap having a recess portion facing the...
7534650 Carbon-carbon and/or metal-carbon fiber composite heat spreader  
A heat spreader, comprised of a plurality of carbon fibers oriented in a plurality of directions, with a carbon or metal matrix material dispersed about the fibers, is described. The carbon fibers...
7534659 Silicone-based adhesive sheet, method of bonding a semiconductor chip to a chip attachment component, and a semiconductor device  
A silicone-based adhesive sheet has either a layer of clay-like curable silicone composition on one side and a layer of slower curing clay-like curable silicone composition than the first...
7534630 Method of improving power distribution in wirebond semiconductor packages  
A semiconductor package comprising a die adjacent a substrate, a supporting plate adjacent the die, and a conducting plate abutting the supporting plate and electrically coupled to a metal...
7534634 Surface-mountable light-emitting diode light source and method of producing a light-emitting diode light source  
A surface-mountable light-emitting diode light source is described, in which the leadframe-bends toward the rear side of the package that are required for surface mounting lie within a transparent...
7534649 Thermoset polyimides for microelectronic applications  
Dendrimer/hyperbranched materials are combined with polyimide to form a low CTE material for use as a dielectric substrate layer or an underfill. In the alternative, ruthenium carbene complexes are...
7534664 Semiconductor device and method of manufacturing same  
The present invention provides a semiconductor device capable of improving productivity while maintaining electrical characteristics, and a manufacturing method thereof. One characteristic point of...
7531382 Method of fabricating a patterned device using sacrificial spacer layer  
A method of creating a patterned device by selecting a substrate; depositing a mask layer on the substrate; forming a first step on the mask layer; depositing a sacrificial layer along the first...
7531894 Method of electrically connecting a microelectronic component  
A method of electrically connecting a microelectronic component having a first surface bearing a plurality of contacts. The method including the steps of forming a subassembly by juxtaposing a...
7531381 Manufacturing method of a quad flat no-lead package structure  
The present invention provides a method for fabricating a quad flat no-lead package structure, comprising a chip carrier and at least a chip. The chip is disposed on the top surface of the chip...
7528010 Semiconductor component and method for producing the same  
A semiconductor component of semiconductor chip size includes a semiconductor chip. The semiconductor chip has a metallic coating that completely covers the edge sides and the rear side and partly...
7528009 Wafer-leveled chip packaging structure and method thereof  
This invention relates to a wafer-leveled chip packaging method, comprising the steps of: providing a wafer; attaching at least one first chip to the wafer; forming a first insulating layer on the...
7528005 Method of manufacturing chip size package semiconductor device without intermediate substrate  
A method of manufacturing a semiconductor device includes providing a first semiconductor chip having a plurality of pads, providing a second semiconductor chip having a plurality of pads, fixing...
7528007 Methods for assembling semiconductor devices and interposers  
A method for assembling one or more semiconductor devices with an interposer includes positioning the one or more semiconductor devices within a receptacle that extends through the interposer, on a...
7528006 Integrated circuit die containing particle-filled through-silicon metal vias with reduced thermal expansion  
A method, apparatus and system with an electrically conductive through hole via of a composite material with a matrix forming a continuous phase and embedded particles, with a different material...
7524693 Method and apparatus for forming an electrical connection to a semiconductor substrate  
A device ( 100 ) may use one or more conductive elements ( 112 ) to electrically couple a substrate ( 116 ) and a cap ( 114 ). In one embodiment, an acceleration sense element may be formed on the...
7524701 Chip-scale package  
A method for manufacturing a semiconductor package that includes forming a frame inside a conductive can, the frame being unwettable by liquid solder.
7524696 Sensor including lead frame and method of forming sensor including lead frame  
A sensor includes a plurality of leads that have bottom surfaces extending in a first plane, a stage that extends in a second plane that tilts from the first plane, a sensor chip that is supported...
7524697 Method for manufactuing a semiconductor integrated circuit device  
A burn-in process for a semiconductor integrated circuit device includes a first process of positioning bump electrodes of the semiconductor integrated circuit device with respect to pads of a...
7524698 Handling and positioning of metallic plated balls for socket application in ball grid array packages  
A method and apparatus for handling and positioning half plated balls for socket application in ball grid array packages. The half plated balls, comprising a first side adapted to be soldered and a...
7525189 Semiconductor device, wiring board, and manufacturing method thereof  
A wiring board ( 20 ) includes a first wiring portion ( 10 ) having a plurality of wiring layers ( 1 ) and a plurality of external connecting bumps ( 5 ), and a second wiring portion ( 15 )...
7524754 Interconnect shunt used for current distribution and reliability redundancy  
In one embodiment of the invention, an integrated circuit package includes an integrated circuit, a package substrate, a first bump, a second bump and a shunt to provide for current distribution...
7520679 Optical device package with turning mirror and alignment post  
An optoelectronic package or sub-assembly includes an edge-emitting laser and a reflector that directs a beam from the laser through a sub-mount. The sub-mount contains passive or active circuit...
7521283 Manufacturing method of chip integrated substrate  
A manufacturing method of a chip integrated substrate is disclosed. The manufacturing method includes a first step that forms a wiring structure to be connected to a semiconductor chip on a first...
7521294 Lead frame for semiconductor package  
A semiconductor package including a lead frame comprising a frame including both a ground ring and a chip mounting board located therein. Extending between the ground ring and the chip mounting...
7521724 Light emitting diode package and process of making the same  
A light emitting diode (LED) package and process of making the same includes a silicon-on-insulator (SOI) substrate that is composed of two silicon based materials and an insulation layer...
7521290 Method of manufacturing circuit device  
The method of the present invention includes a first step of preparing a substrate in which a plurality of circuit boards are integrally connected to one another, each of the circuit boards having...
7521284 System and method for increased stand-off height in stud bumping process  
System and method for creating single stud bumps having an increased stand-off height. A preferred embodiment includes a method of using a capillary for creating stud bumps in a flip chip assembly,...
7521285 Method for fabricating chip-stacked semiconductor package  
A chip-stacked semiconductor package and a method for fabricating the same are proposed. A chip carrier module plate including a plurality of chip carriers, and a heat sink module plate including a...
7517727 Method for connection of an integrated circuit to a substrate, and a corresponding circuit arrangement  
The present invention provides a method for connection of an integrated circuit ( 1 ), in particular of a chip, a wafer or a hybrid, to a substrate ( 10 ), which has the following steps: provision...
7517721 Linear actuator and apparatus utilizing the same  
A linear actuator includes a first inner permanent magnet joined to an inner yoke, a second inner permanent magnet joined to the inner yoke, an outer yoke, a member interconnecting the outer and...
7517722 Method of producing a universal semiconductor housing with precrosslinked plastic embedding compounds  
An electronic component and a blank have plastic embedding compounds of a first and a second plastic layer. Semiconductor chips are embedded in the first plastic layer in such a way that their...
7517726 Wire bonded chip scale package fabrication methods  
In one embodiment the present invention includes a method of manufacturing a chip scale package. Embodiments of the present invention include sawing kerfs between semiconductor device boundaries on...
7518219 Integrated heat spreader lid  
A heat spreader lid includes an outer periphery region having a lip for bonding to an underlying substrate board, a center region, and one or more strain isolation regions. The strain isolation...
7517707 Manufacturing method of semiconductor integrated circuit device and probe card  
Electrical testing is to be performed on a semiconductor integrated circuit device which the test pads formed. To facilitate such testing, the method of manufacture of the semiconductor integrated...
7514292 Individualized low parasitic power distribution lines deposited over active integrated circuits  
An integrated circuit (IC) chip, mounted on a leadframe, has a network of power distribution lines deposited on the surface of the chip so that these lines are located over active components of the...
7514273 Method for applying rewiring to a panel while compensating for position errors of semiconductor chips in component positions of the panel  
The invention relates to a method for applying rewiring to a panel. For this purpose, a panel is provided which has a coplanar overall upper side of an upper side of a plastic compound and the...
7514296 Method for manufacturing semiconductor device  
A method for manufacturing a semiconductor device includes preparing a wiring board including a base board having a first surface and a second surface, a wiring pattern having a plurality of...
7514297 Methods for a multiple die integrated circuit package  
Methods for a multiple die package for integrated circuits are disclosed. An insulator layer is provided and one or more vias are formed within it. The insulator may be provided without vias, and...
7514779 Multilayer build-up wiring board  
Mesh holes 35 a and 59 a of upper solid layers 35 and upper solid layers 59 are formed to overlie on one another, so that the insulating properties of interlayer resin insulating layers 50...
7510108 Method of making an electronic assembly  
A method of making an electronic assembly comprising an electronic component that is attached to a circuit board by protruding solder bumps of the electronic component places the electronic...
7510907 Through-wafer vias and surface metallization for coupling thereto  
An apparatus and method of fabricating a through-wafer via. A first mask is formed over a first side of a first semiconductor die to define a first via area. A deep recess is etched through the...
Matches 101 - 150 out of 1839 < 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >