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7598117 |
Method for manufacturing semiconductor module using interconnection structure
In a method for manufacturing a semiconductor module, a metal layer is formed on a support substrate. Then, first conductive posts and a first insulating layer are formed on the metal layer. The...
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7598118 |
Method of manufacturing semiconductor sensor
A method of manufacturing a semiconductor sensor includes a forming step, a preparing step, a fixing step and a separating step. In the forming step, a plurality of caps made of resin is formed on...
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7595221 |
Method of fabricating a patterned device using sacrificial spacer layer
A method of fabricating a device using a sacrificial layer by selecting a substrate; forming a first step on the substrate, where the first step is formed from a second material; depositing a...
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7595219 |
IC chip mounting method for mounting two or more IC chips by sequentially transferring the IC chips sucked onto a first roller to a second roller and mounting the IC chips transferred to the second roller on a traveling base
The present invention provides an IC chip mounting method for mounting two or more IC chips on a base, including: preparing a wafer by mounting a tape on a face thereof, which is the reverse of the...
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7595220 |
Image sensor package and fabrication method thereof
The invention provides an image sensor package and method for fabricating the same. The image sensor package comprises a first substrate comprising a sensor device thereon and a hole therein. A...
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7588962 |
Method of making semiconductor device
A method for manufacturing a semiconductor device that includes a housing, formed of a polyamide-series thermoplastic resin, and a semiconductor package sealed in the housing, which is formed of a...
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7585700 |
Ball grid array package stack
Disclosed herein is a ball grid array (BGA) package stack that is not limited by ball arrangement because it utilizes a foldable circuit substrate, which permits interconnection between upper and...
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7584537 |
Method for making a microcircuit card
A method for mounting a microcircuit module in a card body to make the card non-detachable without damage includes fixing the module ( 22 ) in a cavity ( 12 ) of the card body ( 11 ) with a resin...
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7586193 |
Mm-wave antenna using conventional IC packaging
An integrated circuit with an antenna and a method of forming the integrated circuit. The method includes, in an integrated circuit package, forming each bond to or from an integrated circuit pad...
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7582510 |
Electronic packaging materials for use with low-k dielectric-containing semiconductor devices
Electronic packaging materials for use with Low-k dielectric-containing semiconductor devices are provided.
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7579211 |
Flip-chip semiconductor device utilizing an elongated tip bump
A flip-chip type semiconductor device includes a semiconductor chip having electrode pads formed and arranged on a chip surface thereof. Sprout-shaped metal bumps are bonded to the electrode pads...
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7579212 |
Semiconductor device having tin-based solder layer and method for manufacturing the same
A semiconductor device includes: a semiconductor substrate; a base member; a tin-based solder layer; a first metal layer; and a first alloy layer. The semiconductor substrate is bonded to the base...
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7579213 |
Modified chip attach process
A process for assembling a package for a semiconductor device is described. The process includes reducing the stress in an inner dielectric layer during packaging by heating the die and the...
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7579628 |
Backlight device for liquid crystal display including a plurality of light emitting diodes within their own concaves aligned in a straight line within a larger concave
A semiconductor light emitting device of the present invention includes a plurality of light emitting elements, a package body for storing the light emitting elements, wiring patterns being...
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7578858 |
Making capacitor structure in a semiconductor device
A method of making capacitor structure includes arranging first-layer conducting strips on a first layer of an integrated circuit chip, and arranging second-layer conducting strips on a second...
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7579679 |
Chipcard with contact areas and method for producing contact areas
A chip card with a chip module having an integrated circuit and, for external contacting, has on a main face a contact zone with a number of contact areas which are spaced apart from one another...
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7576427 |
Cold weld hermetic MEMS package and method of manufacture
A cold welded hermetic micro or nano package sealed in an inert atmosphere with optional force maintenance means for ensuring permanent closure. A package cap 410 coated with precursor weld...
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7572670 |
Methods of forming semiconductor packages
The invention includes semiconductor packages having a patterned substrate with openings extending therethrough, conductive circuit traces over the substrate and having portions extending over the...
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7572659 |
Semiconductor dynamic sensor and method of manufacturing the same
A semiconductor sensor includes an adhesive film for suppressing thermal stress transfer to a semiconductor sensor chip. More specifically, the adhesive film includes a first layer and a second...
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7572671 |
Stacked module systems and methods
The present invention stacks chip scale-packaged integrated circuits (CSPs) into modules that conserve PWB or other board surface area. In a preferred embodiment in accordance with the invention, a...
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7572668 |
Method of patterning an organic thin film, an organic thin film transistor, a method of manufacturing an organic thin film transistor, and an organic electroluminescence display device having the organic thin film transistor
Provided is a method of patterning an organic thin film which can prevent surface damage of an organic semiconductor layer. Also, an organic thin film transistor that can reduce an off-current and...
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7572665 |
Microelectronics grade metal substrate, related metal-embedded devices and methods for fabricating same
Fabricating a microelectronics grade metal substrate comprises forming the metal substrate on a sacrificial substrate. An adhesion layer can be deposited on or over the surface of the sacrificial...
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7573136 |
Semiconductor device assemblies and packages including multiple semiconductor device components
A multidie semiconductor device assembly or package includes an interposer comprising a substrate with at least one receptacle therethrough. A plurality of semiconductor device components (e.g.,...
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7573142 |
Alignment key structure in a semiconductor device and method of forming the same
An alignment key structure in a semiconductor device is provided. The alignment key structure includes an insulation layer formed on a substrate, and a passivation layer pattern formed on the...
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7569410 |
Method for integrated MEMS packaging
An integrated MEMS package and associated packaging method are provided. The method includes: forming an electrical circuit, electrically connected to the first substrate; integrating a MEMS device...
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7569418 |
Methods for securing packaged semiconductor devices to carrier substrates
A method for securing a semiconductor device to a carrier substrate includes inserting a semiconductor device with a plurality of stub contacts extending from a bottom edge thereof into a...
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7566632 |
Lock and key structure for three-dimensional chip connection and process thereof
A method positions a first wafer with respect to a second wafer such that key studs on the first wafer are fit (positioned) within lock openings in the second wafer. The key studs contact...
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7566591 |
Method and system for secure heat sink attachment on semiconductor devices with macroscopic uneven surface features
Methods, systems, and apparatuses for attaching heat sinks to integrated circuit packages using thermally conductive adhesive materials are described. The adhesive materials can be shaped to...
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7566584 |
Electronic substrate manufacturing method, semiconductor device manufacturing method, and electronic equipment manufacturing method
A method of manufacture of an electronic substrate, having a process of embedding electronic components in a substrate, and a process of ejecting liquid droplets containing a conductive material,...
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7566585 |
Semiconductor component and method for production of a semiconductor component
A semiconductor substrate, a semiconductor chip and a semiconductor component with areas composed of a stressed monocrystalline material, and a method for production of a semiconductor component is...
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7563703 |
Microelectronic interconnect device comprising localised conductive pins
A method producing conductive rods localized on conductive blocks of an electronic component.
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7563633 |
Microelectromechanical systems encapsulation process
An encapsulated MEMS process including a high-temperature anti-stiction coating that is stable under processing steps at temperatures over 450 C is described. The coating is applied after device...
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7563640 |
Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof
A first semiconductor element is mounted on a base plate, and is in a sealed state by the periphery thereof being covered by an insulation member, and the upper surface thereof being covered by an...
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7565637 |
Method of designing package for semiconductor device, layout design tool for performing the same, and method of manufacturing semiconductor device using the same
A package design method for a semiconductor device of designing a package including a package substrate provided with a wiring pattern, a chip mounted on the package substrate, and a sealing resin...
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7563648 |
Semiconductor device package and method for manufacturing same
A lead frame ( 52, 100, 112 ) for a semiconductor device (die) package ( 50, 102, 110 ) is described. Each of the leads ( 60 ) in the lead frame ( 52, 100, 112 ) includes an interposer ( 64 )...
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7560302 |
Semiconductor device fabricating method
To improve the fabrication yield of semiconductor devices. A semiconductor device where a desired number of semiconductor chips are laminated in the thickness direction thereof is fabricated by...
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7556983 |
Thin planar semiconductor device having electrodes on both surfaces and method of fabricating same
A thin, planar semiconductor device having electrodes on both surfaces is disclosed. This semiconductor device is provided with an IC chip and a wiring layer having one side that is electrically...
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7553698 |
Semiconductor package having semiconductor constructing body and method of manufacturing the same
A semiconductor package includes at least one semiconductor constructing body which has a semiconductor substrate and a plurality of external connection electrodes formed thereon. An insulating...
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7552532 |
Method for hermetically encapsulating a component
A method is provided to produce a hermetic encapsulation for an electronic component, which may be an optical and at least partially light-permeable component or a surface wave component, comprises...
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7550315 |
Method for fabricating semiconductor package with multi-layer die contact and external contact
A semiconductor package includes a substrate formed of a board material, a semiconductor die bonded to the substrate, and an encapsulant on the die. The package also includes an array of external...
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7550322 |
Manufacturing method for resin sealed semiconductor device
A semiconductor device manufacturing method comprises etching a front side of a conductive board to form plural sets of a die pad portion and bonding areas, each set corresponding to one...
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7550314 |
Patterned plasma treatment to improve distribution of underfill material
A patterned plasma treatment may be provided on the chip and/or the substrate to enhance the distribution of underfill material between the chip and the substrate. The underfill material is...
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7550326 |
Method for manufacturing thin film device and semiconductor device
The present invention relates to a method for manufacturing a thin film device. The thin film device is manufactured by bonding a second substrate ( 106 ) to a thin film device layer ( 103 )...
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7550320 |
Method of fabricating substrate with embedded component therein
A method of fabricating a substrate with an embedded component therein including the following steps is provided. First, a core layer having a first dielectric layer, a first patterned circuit...
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7547577 |
Method of making circuitized substrate with solder paste connections
A method of making a circuitized substrate assembly in which two or more subassemblies are aligned and bonded together. The bonding, preferably using lamination, results in effective electrical...
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7547576 |
Solder wall structure in flip-chip technologies
A structure and method for forming the same. The semiconductor structure includes a first semiconductor chip and N solder bumps in direct physical contact with the first semiconductor chip, wherein...
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7545027 |
Wafer level package having redistribution interconnection layer and method of forming the same
A wafer level package may include a semiconductor substrate supporting an electrode pad. A first insulating layer may be provided on the semiconductor substrate. The first insulating layer may...
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7544527 |
Method and apparatus for providing optoelectronic communication with an electronic device
An optoelectronic assembly for an electronic system includes a thermally conductive, metallized transparent substrate having a first surface and an opposite second surface. A support chip set is...
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7544537 |
Semiconductor IC-embedded substrate and method for manufacturing same
A semiconductor IC-embedded substrate suitable for embedding a semiconductor IC in which the electrode pitch is extremely narrow. The substrate comprises a semiconductor IC 120 in which stud...
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7544538 |
Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the same
Provided are methods of fabricating semiconductor chips, semiconductor chips formed by the methods, and chip-stack packages having the semiconductor chips. One embodiment specifies a method that...
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