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7052933 |
Method of manufacturing an electronic device, and electronic device
The invention relates to a method of manufacturing a semiconductor device ( 10 ), whereby an electric element ( 11 ) is attached on or above a carrier plate ( 4 ) which comprises a first layer ( 5...
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7049171 |
Electrical package employing segmented connector and solder joint
An electronic package is provided having a connector and a solder joint that is less susceptible to thermal fatigue. The package includes a die including a first electrically conductive connecting...
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7049172 |
Packaging structure and process of electronic card
A packaging process of an electronic card is provided. Firstly, a first embedding operation is performed to embed a first metal cover into a first surface of a plastic frame. Then, a circuit board...
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7049213 |
Method for producing a contact substrate and corresponding contact substrate
The invention relates to a method for producing a contact substrate ( 10 ) as well as to a contact substrate with through-plating between a connector arrangement ( 21 ) arranged at the top of a...
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7045385 |
Method for fabricating surface acoustic wave filter packages and package sheet used therein
A method for fabricating Surface Acoustic Wave filter packages uses a package sheet having an outline pattern and anti-bur holes. In the package sheet for a Surface Acoustic Wave filter package,...
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7043828 |
Tile-based routing method of a multi-layer circuit board
A routing method for routing a plurality of signal traces out of a plurality of corresponding bumper pads in a multi-layer circuit board. The multi-layer circuit board includes at least a first...
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7041536 |
Semiconductor integrated circuit card manufacturing method, and semiconductor integrated circuit card
A semiconductor integrated circuit card is disclosed in which such a semiconductor integrated circuit chip device comprising a substrate having a circuit pattern formed thereon, a semiconductor...
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7043389 |
Method and system for identifying and locating defects in an integrated circuit
A method and system for detecting and locating defects in an integrated circuit. A time-varying input signal is applied to the integrated circuit, power signals produced at a plurality of...
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7040171 |
Carrier tape vibrator module
A vibrator module adapted for use in a taper apparatus for advancing carrier tape having a plurality of compartments and for placing parts in the compartments. The vibrator module includes a motor...
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7041611 |
Enhancement of fabrication yields of nanomechanical devices by thin film deposition
A protective film is applied onto a nanostructural feature supported on a sacrificial layer by energy beam assisted deposit of material from a vapor through which the beam passes. A wet etchant is...
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7041532 |
Methods for fabricating interposers including upwardly protruding dams
A method for fabricating an interposer includes providing an interposer substrate with at least one slot or aperture therethrough and forming at least one upwardly protruding dam on the interposer...
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7041531 |
Method of fabricating flip chip ball grid array package
A method of fabricating a flip chip ball grid array (FC-BGA) package is provided. First, a substrate including a first surface and a second surface is provided, wherein the first surface includes a...
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7037844 |
Method for manufacturing a housing for a chip having a micromechanical structure
A method for manufacturing a chip housing includes a first basis having a photolithograpically structurable layer on a main face, structured into a cover. A chip has the structure at a main face...
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7037804 |
Wafer bonding using a flexible bladder press for three dimensional (3D) vertical stack integration
A three-dimensional (3-D) integrated chip system is provided with a first wafer including one or more integrated circuit (IC) devices; a second wafer including one or more integrated circuit (IC)...
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7037758 |
Semiconductor device, method of manufacturing the same, circuit board and electronic apparatus
The invention provides a method of manufacturing a semiconductor that improves the productivity and the yield of a product, and grinds a semiconductor substrate so that it has almost uniform...
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7037750 |
Method for manufacturing a package
A method of manufacturing a package is disclosed. The manufacturing method includes the steps of providing a substrate having an opening, disposing a metal slice on a bottom surface of the...
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7037744 |
Method for fabricating a self-aligned nanocolumnar airbridge and structure produced thereby
A method for fabricating a low k, ultra-low k, and extreme-low k multilayer interconnect structure on a substrate in which the interconnect line features are separated laterally by a dielectric...
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7033858 |
Method for making Group III nitride devices and devices produced thereby
A method is for making at least one semiconductor device including providing a sacrificial growth substrate of Lithium Aluminate (LiAlO 2 ); forming at least one semiconductor layer including a...
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7034403 |
Durable electronic assembly with conductive adhesive
An electronic assembly comprising a first electronic element, a second electronic element, and a durably flexible bond therebetween. The bond comprises an anisotropic conductive adhesive that...
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7030494 |
Semiconductor package having built-in micro electric mechanical system and manufacturing method thereof
A semiconductor package includes a semiconductor structure having a plurality of electrodes for external connection which are provided on a semiconductor substrate, an insulation layer provided on...
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7029946 |
Method for manufacturing semiconductor device and semiconductor device
A method for manufacturing a semiconductor device includes the steps of forming a stress relief layer on a wafer such that the stress relief layer is away from at least part of electrodes formed on...
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7026233 |
Method for reducing defects in post passivation interconnect process
A method of forming post passivation interconnects for an integrated circuit is disclosed. A passivation layer of a non-oxide material is formed over the integrated circuit. A buffer layer is then...
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7026706 |
Method and packaging structure for optimizing warpage of flip chip organic packages
An electronic packaging structure and method of forming thereof wherein the structure is constituted of a modular arrangement which reduces stresses generated in a chip, underfill, and ball grid...
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7026176 |
Mold making method for wafer scale caps
Disclosed is a method for fabricating a mold. The mold is used for protective caps which will be applied to a wafer. The method comprises the steps of fabricating first and second cooperating mold...
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7026208 |
Methods of forming integrated circuit devices including cylindrical capacitors having supporters between lower electrodes
An integrated circuit device includes a semiconductor substrate that has a cell region and a peripheral region that surrounds the cell region. A plurality of capacitors that include a plurality of...
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7022546 |
Method and device for protecting micro electromechanical systems structures during dicing of a wafer
A wafer cap protects micro electromechanical system (“MEMS”) structures during a dicing of a MEMS wafer to produce individual MEMS dies. A MEMS wafer is prepared having a plurality of MEMS...
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7022551 |
Quad flat flip chip packaging process and leadframe therefor
A quad flat flip chip packaging process and a leadframe therefor are provided. A sacrificial film is attached on the leads of the leadframe for limiting the extent of bumps when formed and saving...
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7022548 |
Method for making a semiconductor die package
A method for processing a semiconductor substrate is disclosed. The method includes providing a mask having an aperture on a semiconductor substrate having a conductive region. An aperture in the...
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7023097 |
FBGA arrangement
The invention relates to an FBGA arrangement, comprising a substrate on which at least one chip is chip-bonded face-down, which has a central row of bonding pads connected to contact islands...
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7023084 |
Plastic packaging with high heat dissipation and method for the same
The present invention provides a high heat dissipation plastic package and a method for making the same that provides an inexpensive, thin high heat dissipation plastic package with good bonding...
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7018871 |
Solder masks for use on carrier substrates, carrier substrates and semiconductor device assemblies including such solder masks, and methods
A carrier substrate includes at least one die-attach location and one or more terminals that protrude from a surface of the carrier substrate so as to prevent adhesive material from contaminating...
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7018865 |
Method of protecting an element of an integrated circuit against the formation of a metal silicide
A semiconductor material is protected against the formation of a metal silicide by forming a layer of a silicon/germanium alloy on the material. The material which is protected belongs to a...
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7015075 |
Die encapsulation using a porous carrier
A process for encapsulating an integrated circuit die ( 403 ) using a porous carrier ( 101 ). In one example, an adhesive structure (e.g. tape) is applied to a porous carrier. Integrated circuit...
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7015064 |
Marking wafers using pigmentation in a mounting tape
Wafer level techniques for marking the back surfaces of integrated circuit devices are described. A wafer mounting tape is provided that includes releasable pigments. The pigments can be released...
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7015065 |
Manufacturing method of ball grid array package
A manufacturing method of a ball grid array package mainly comprises providing a carrier unit with an upper surface and a lower surface, mounting a plurality of solder balls on the lower surface of...
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7015063 |
Methods of utilizing a back to back semiconductor device module
A back-to-back semiconductor device module includes two semiconductor devices, the backs of which are secured to one another. Each bond pad of both semiconductor devices is disposed adjacent a...
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7013557 |
Method of packaging electronic components without creating unnecessary solder balls
A method of packaging an electronic component having electrodes soldered on lands on a printed circuit board uses a mask pattern that corresponds to the lands onto which solder paste is deposited....
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7011985 |
Method for producing miniature amplifier and signal processing unit
A method for producing miniature amplifier and signal processing unit includes the steps of:
producing arrays of individual integrated circuits on a side of a wafer, where each circuit has a...
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7011986 |
Method for manufacturing a housing for a chip with a micromechanical structure
In a housing manufacturing method a base is provided with first contact elements with a photolithographically patternable layer that is patterned for exposing the contact elements. A chip with a...
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7008819 |
Method of fabricating an array of wafer scale polymeric caps
A method of fabricating an array of wafer scale polymeric caps is provided. The method includes forming, in a two part mold, a plurality of first hollow molded caps from a layer of thermoplastic...
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7008817 |
Method for manufacturing micro electro-mechanical systems using solder balls
A method for manufacturing micro electro-mechanical systems includes forming an insulation layer on an upper surface of a semiconductor substrate, forming a structure layer on an upper surface of...
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7009308 |
Methods and apparatus for improving high frequency input/output performance
A circuit that eliminates an off-chip inductive component connected between an integrated circuit (IC) arranged on a package and an external load comprises a package and an IC that is arranged on...
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7008818 |
Flip chip packaging process employing improved probe tip design
The present invention provides a novel probe tip suited for flip-chip packaging process. The probe tip comprises a needle body; and a stop cylinder having a recess for fittingly accommodating the...
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7005316 |
Method for package reduction in stacked chip and board assemblies
A method and apparatus for assembling semiconductor die-carrying interposer substrates in a stacked configuration. Each interposer substrate bears at least one die mounted by its active surface to...
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7005318 |
Mounted circuit substrate and method for fabricating the same for surface layer pads that can withstand pad erosion by molten solder applied over a plurality of times
A mounted circuit substrate has at least one conductive layer. The side faces of a component mounting pad is formed on a surface of the substrate, and includes at least a columnar pattern made of a...
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7005317 |
Controlled fracture substrate singulation
Methods and apparatus for separating dice from a substrate are described herein.
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7005748 |
Flip chip interface circuit of a semiconductor memory device
A flip chip interface circuit for combining two identical semiconductor chips on upper and lower surfaces of an assembling lead frame into one flip chip package includes at least first and second...
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7002282 |
Surface acoustic wave device and method of fabricating the same
A surface acoustic wave device includes a surface acoustic wave filter element having a piezoelectric substrate on which comb-like electrodes are formed, and a package having a first cavity in...
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7001793 |
Method of protecting microfabricated devices with protective caps
A method of using protective caps ( 160 ) applied to a first side of a wafer ( 150 ) in the production of microfabricated devices ( 152 ), such as micro-electro-mechanical systems (MEMS) devices....
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7002225 |
Compliant component for supporting electrical interface component
An apparatus in one example includes a compliant component for supporting an electrical interface component that serves to electrically and mechanically couple a die with a separate layer. In one...
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