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7194799 |
Process for fabricating a high density multi-layer microcoil
A high density multi-layer microcoil includes a substrate, a multi-layer coil winding, a magnetic core and a dry film photoresist structure. The multi-layer coil winding and the magnetic core are...
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7192810 |
Semiconductor packaging
An electronic component and a method for making an electronic component are disclosed. The electronic component has a silicon package. The silicon package has a recess formed thereon in which a...
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7192801 |
Printed circuit board and fabrication method thereof
The present invention provides a printed circuit board which is capable of air-tightly sealing a functional surface of a device and of preventing excessive stress from acting on the device itself...
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7189593 |
Elimination of RDL using tape base flip chip on flex for die stacking
A flexible film interposer for stacking a flip chip semiconductor die onto a second (bottom) semiconductor die, semiconductor devices and stacked die assemblies that incorporate the flexible film...
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7189594 |
Wafer level packages and methods of fabrication
A wafer level package formed on an integrated circuit chip having bondpads and a fabrication method therefor is disclosed. The wafer level package comprises at least one first, second and third...
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7186586 |
Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities
A packaging substrate ( 310 ) includes a semiconductor interposer ( 120 ) and at least one other intermediate substrate ( 110 ), e.g. a BT substrate. The semiconductor interposer has first contact...
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7186945 |
Sprayable adhesive material for laser marking semiconductor wafers and dies
A sprayable adhesive composition having a viscosity within the range of 0.5 Pa.s to 5.0 Pa.s, containing at least one colored filler present in an amount up to 50% by weight of the adhesive...
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7183133 |
Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices
Microelectronic devices with improved heat dissipation, methods of making microelectronic devices, and methods of cooling microelectronic devices are disclosed herein. In one embodiment, the...
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7183622 |
Module integrating MEMS and passive components
An apparatus may include a first substrate, one or more microelectromechanical systems (MEMS) coupled to the first substrate, a second substrate coupled with the first substrate, and one or more...
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7183658 |
Low cost microelectronic circuit package
A low cost microelectronic circuit package includes a single build up metallization layer above a microelectronic die. At least one die is fixed within a package core using, for example, an...
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7183132 |
Semiconductor device in a recess of a semiconductor plate
A semiconductor device provided with one or more semiconductor pellets arranged on the bottom surface of a recess produced along a surface of a semiconductor plate having wirings arranged on the...
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7183189 |
Semiconductor device, circuit board, and electronic instrument
A semiconductor device with a package size close to its chip size is, apart from a stress absorbing layer, such as to effectively absorb thermal stresses. A semiconductor device ( 150 ) has a...
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7179680 |
Method for producing an optoelectronic component
An optoelectronic component with an optoelectronic transducer is produced with the novel method. The optoelectronic component has a coupling region, which is formed in a radiation-transparent...
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7179681 |
Techniques for packaging multiple device components
Techniques for fabricating multiple device components. Specifically, techniques for fabricating a stacked package comprising at least one I/C module and a multi-chip package. The multi-chip package...
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7179668 |
Technique for manufacturing silicon structures
A technique for manufacturing silicon structures includes etching a cavity into a first side of an epitaxial wafer. A thickness of an epitaxial layer is selected, based on a desired depth of the...
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7179687 |
Semiconductor device and its manufacturing method, and semiconductor device manufacturing system
A method of manufacturing a semiconductor device is provided including depressing a bonding tool having a concave portion toward a wiring board with a semiconductor chip disposed within the concave...
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7176568 |
Semiconductor device and its manufacturing method, electronic module, and electronic unit
A semiconductor device is provided having: a board; a metallization pattern formed on the first face of the board; a first layer formed so as to not cover the first portion of the metallization...
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7176062 |
Lead-frame method and assembly for interconnecting circuits within a circuit module
A lead-frame method and assembly for interconnecting circuits within a circuit module allows a circuit module to be fabricated without a circuit board substrate. Integrated circuit dies are...
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7176055 |
Method and apparatus for manufacturing electronic component-mounted component, and electronic component-mounted component
After a first electronic component is inserted into a base substrate, first circuit patterns are formed on the inserted first electronic component, and then a second electronic component is mounted...
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7176563 |
Electronically grounded heat spreader
Electronically grounded heat spreaders are employed in connection with the dissipation of heat, which is generated by electronic devices, such as semiconductor chips. Also provided is a novel...
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7176582 |
Semiconductor device and method of manufacturing same
In an example embodiment, the semiconductor device comprises a carrier and a semiconductor element, such as an integrated circuit. The carrier is provided with apertures, thereby defining...
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7171744 |
Substrate frame
A substrate frame includes an insulative board ( 10 a ) having a pair of ear portions ( 13 ) extending along its longitudinal edges; a plurality of wiring substrate regions ( 11 ) arranged on the...
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7173332 |
Placement tool for wafer scale caps
A tool is used to hold an array of wafer scale protective caps and place the array onto a semiconductor wafer. The tool comprises a first tool half made from a semiconductor which has a coefficient...
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7172924 |
Semiconductor device having a semiconductor chip mounted on external terminals and fabrication method thereof
An efficient fabrication method of a SON type semiconductor device is to be provided. A plurality of linear leadframes is arranged side by side separately from each other. A plurality of...
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7169649 |
Wafer scale integration of electroplated 3D structures using successive lithography, electroplated sacrificial layers, and flip-chip bonding
Wafer scale fabrication of three dimentional substantially enclosed structures on a MEMS/IC die use a combination of electrodeposition of structural and sacrificial layers and flip-chip alignment...
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7169691 |
Method of fabricating wafer-level packaging with sidewall passivation and related apparatus
A method of fabricating a chip-scale or wafer-level package having passivation layers on substantially all surfaces thereof to form a hermetically sealed package. The package may be formed by...
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7170153 |
Semiconductor device and its manufacturing method
In order to manufacture a thin and small semiconductor device at low cost, the semiconductor device and its manufacturing method are disclosed. The semiconductor device comprises: a film wiring...
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7169640 |
Card manufacturing technique and resulting card
A card manufacturing technique and the resulting card are provided. The card has a ground and/or power layer extending to the edges of a circuit board for electrostatic discharge protection but...
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7168161 |
Manufacturing method of solid-state image sensing device
In a method of manufacturing a camera module having a CMOS image sensor, a semiconductor chip to serve as a light sensor is mounted on a optical-component-mounting face of a wiring substrate mother...
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7167936 |
Circuit board having an integrated circuit for high-speed data processing
Circuit board having a plurality of bus lines ( 6 ), which run on the circuit board ( 1 ) essentially parallel to a preferred direction of the circuit board ( 1 ), and having at least one...
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7166493 |
Package with integrated inductor and/or capacitor
Methods for attaching two wafers are presented along with devices resulting from such methods. In one illustrative embodiment, a first wafer is provided having pillars for conducting an electric...
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7166491 |
Thermoplastic fluxing underfill composition and method
A flip chip having solder bumps and an underfill that is thermoplastic and fluxing, as well as methods for making such a device. The resulting device is well suited for a simple one-step...
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7166492 |
Integrated circuit carrier apparatus method and system
A carrier substrate includes an access region placed within the interior of the substrate that facilitates backside access to an integrated circuit die without damaging electrical integrity of the...
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7163839 |
Multi-chip module and method of manufacture
A multi-chip module and a method for manufacturing the multi-chip module. A first semiconductor chip is mounted to a support substrate and a second semiconductor chip is mounted to the first...
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7159459 |
Multiple microelectromechanical (MEM) devices formed on a single substrate and sealed at different pressures and method therefor
Methods and apparatus are provided forming a plurality of semiconductor devices on a single substrate, and sealing two or more of the devices at different pressures. First and second semiconductor...
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7160755 |
Method of forming a substrateless semiconductor package
A method of forming a substrateless semiconductor package ( 10 ) includes forming a carrier ( 16 ) on a base plate ( 12 ) and attaching an integrated circuit (IC) die ( 32 ) to the carrier ( 16 )....
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7159309 |
Method of mounting electronic component on substrate without generation of voids in bonding material
When an electronic component is mounted on a substrate, the electronic component is first placed on the substrate with a solid support interposed between the electronic component and the substrate....
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7157309 |
Manufacture of microelectronic fold packages
An elongated strip of a sheetlike substrate bearing microelectronic elements such as semiconductor chips is advanced in a downstream direction through one or more folding stations where successive...
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7157308 |
Circuit substrates, semiconductor devices, semiconductor manufacturing apparatus methods for manufacturing circuit substrates, and methods for manufacturing semiconductor devices
A method is provided to control the height of bump electrodes and increase a clearance between edge sections of a semiconductor chip and lead terminals of a tape substrate. By applying suction to a...
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7153723 |
Method of forming a ball grid array device
A method includes: A. providing a substrate having a first surface and a second surface, the first surface being adapted for mounting an electronic device thereon; B. forming a grid of...
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7154169 |
Substrate for IC package
A packaging substrate is formed of an array of packaging units. Each packaging unit includes a chip pad on which a chip is carried, a plurality of pins arranged around the chip pad and spaced from...
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7151012 |
Redistribution layer of wafer and the fabricating method thereof
A wafer comprises a wafer, a conductor, a first passivation layer, a second passivation layer, a redistribution layer, and a third passivation layer. The conductor is disposed on the wafer. The...
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7148078 |
Integrated circuit package provided with cooperatively arranged illumination and sensing capabilities
An integrated circuit package includes an angled one-piece substrate having a light source fixed to one area and a sensor die fixed to a second area, such that the light source is directed to...
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RE39426 |
Thermally enhanced flip chip package and method of forming
A thermally conductive planar member is in thermally conductive communication with a flip chip encapsulated within a dielectric material that surrounds portions of the thermally conductive planar...
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7148083 |
Transfer mold semiconductor packaging processes
In one implementation, a circuit substrate includes a substrate having opposing sides. At least one of the sides is configured for transfer mold packaging and has conductive traces formed thereon....
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7148081 |
Method of manufacturing a semiconductor device
In a semiconductor device in which a plurality of semiconductor chips are stacked on a mounting substrate, an adhesive material formed of resin mainly having a thermosetting property is applied to...
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7148087 |
Electronic package having a folded flexible substrate and method of manufacturing the same
An electronic package is provided and its method of construction. A microelectronic die is mounted to a flexible substrate. A mold cap is injection-molded over the die. The mold cap has a curved...
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7148080 |
Method for joining lead frames in a package assembly, method for forming a chip stack package, and a chip stack package
A method for joining lead frames in a chip stack package or a package stack, a chip stack package, and a method of forming a chip stack package. A joining mediator is formed on joining portions of...
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7148082 |
Method of making a semiconductor chip assembly with a press-fit ground plane
A method of making a semiconductor chip assembly includes providing a semiconductor chip that includes a conductive pad, then electrically connecting a conductive trace that includes a pillar and a...
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7144517 |
Manufacturing method for leadframe and for semiconductor package using the leadframe
In accordance with the present invention, there is provided a method for manufacturing a leadframe. The method comprises the initial step of bonding a primary leadframe to an adhesive tape layer,...
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