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Document Title |
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7601577 |
Work function control of metals
Forming metal gate transistors that have different work functions is disclosed. In one example, a first metal, which is a ‘mid gap’ metal, is manipulated in first and second regions by second...
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7576355 |
Electronic device, field effect transistor including the electronic device, and method of manufacturing the electronic device and the field effect transistor
Provided is an electronic device, a field effect transistor having the electronic device, and a method of manufacturing the electronic device and the field effect transistor. The electronic device...
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7449397 |
Method for annealing silicon thin films and polycrystalline silicon thin films prepared therefrom
Disclosed is a method for annealing a silicon thin film in a substrate in which an insulation layer and the silicon thin film are subsequently formed. The method includes heating or preheating the...
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7402736 |
Method of fabricating a probe having a field effect transistor channel structure
A probe of a scanning probe microscope having a sharp tip and an increased electric characteristic by fabricating a planar type of field effect transistor and manufacturing a conductive carbon...
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7402456 |
PCMO thin film with memory resistance properties
A method is provided for forming a Pr 0.3 Ca 0.7 MnO 3 (PCMO) thin film with crystalline structure-related memory resistance properties. The method comprises: forming a PCMO thin film with a first...
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7195950 |
Forming a plurality of thin-film devices
An aspect of the present invention is a method for forming a plurality of thin-film devices. The method includes coarsely patterning at least one thin-film material on a flexible substrate and...
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7174631 |
Method of fabricating electrical connection terminal of embedded chip
An electrical connection terminal of an embedded chip and a method for fabricating the same are disclosed. An insulating layer is provided on a circuit board integrated with a chip and has a...
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7023097 |
FBGA arrangement
The invention relates to an FBGA arrangement, comprising a substrate on which at least one chip is chip-bonded face-down, which has a central row of bonding pads connected to contact islands...
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6943055 |
Method and apparatus for detecting backside contamination during fabrication of a semiconductor wafer
A method of detecting contamination on a backside of a semiconductor wafer includes the steps of positioning the backside of the wafer in contact with a detection surface of a contaminant sensor,...
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6929983 |
Method of forming a current controlling device
A current-controlling device comprising a first conductor, a second conductor, and a tunneling barrier comprising a first insulating layer between the first conductor and the second conductor. The...
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6855614 |
Sidewalls as semiconductor etch stop and diffusion barrier
Methods and apparatus of forming a semiconductor device using pedestals and sidewalls. The pedestals and sidewalls may provide an etch stop and/or a diffusion barrier during manufacture of a...
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6803651 |
Optoelectronic semiconductor package device
An optoelectronic semiconductor package device includes a semiconductor chip, an insulative housing and a conductive trace, wherein the chip includes an upper surface and a lower surface, the upper...
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6797528 |
Micro probing tip made by micro machine method
A method and apparatus for forming a micro tip for a micro probe utilized in testing semiconductor integrated circuit devices. A thick oxide layer is deposited upon a substrate initially to form...
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6706552 |
Method for making interactive information devices with spacer elements
An interactive information device for use as a touch panel, touch screen, digitizer panel, or pen-input device, and a method for making such a device includes a first, transparent, electrically...
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6701614 |
Method for making a build-up package of a semiconductor
A method for making a build-up package of a semiconductor die and a structure formed from the same. A copper foil with conductive columns is bonded to an encapsulated die by thermal compression,...
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6610598 |
Surface-mounted devices of light-emitting diodes with small lens
The present invention is a surface-mounted device of light-emitting diodes (SMD LED) whose component typically has a plane on the surface. Through the calculation of Snell's Law, most of light...
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6472712 |
Semiconductor device with reduced transistor leakage current
A semiconductor device improved to suppress a leakage current of a transistor is provided. A gate electrode is disposed on a semiconductor substrate. A pair of p type source/drain layers are...
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6346432 |
Semiconductor element having external connection terminals, method of manufacturing the semiconductor element, and semiconductor device equipped with the semiconductor element
External connection terminals ( 25 ) are disposed on side surfaces, a back surface, or both the side surfaces and the back surface of a semiconductor element, especially an optical element ( 20 )...
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6232143 |
Micro probe ring assembly and method of fabrication
A multi-probe ring assembly including integral fine probe tips, conductive lines with terminal connection for testing semiconductor devices and a method of construction of the multi-probe ring...
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6133051 |
Amorphously deposited metal oxide ceramic films
A metal oxide ceramic layer is formed from an amorphous film. The metal oxide ceramic layer comprises, for example, a Bi-based oxide ceramic, The amorphous Bi-based metal oxide layer is annealed to...
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6117704 |
Stackable layers containing encapsulated chips
A method and structure are disclosed which involve the re-wafering of previously processed and tested IC chips. The chips are encapsulated in supporting non-conductive material in a neo-wafer, so...
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5756376 |
Method for removing a diffusion barrier layer on pad regions
A method for removing a diffusion barrier layer on pad regions and diminishing the effect of plasma ions induced when removing a photoresist layer by a plasma asher. A two stage rapid thermal...
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5086014 |
Schottky diode manufacturing process employing the synthesis of a polycrystalline diamond thin film
A schottky diode manufacturing process employing diamond film comprises forming a B-doped p-type polycrystalline diamond film on a low-resistance p-type Si substrate by CVD using a source gas...
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4865999 |
Solar cell fabrication method
A solar cell fabrication method and solar cell made by the method wherein a grid of point electrical connections is made to a transparent first electrode layer of the cell through a layer of a-Si...
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3500144 |
RANDOM WHISKER CONTACT METHOD FOR SEMICONDUCTOR DEVICES
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3469156 |
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
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3458778 |
SILICON SEMICONDUCTOR WITH METAL-SILICIDE HETEROJUNCTION
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3451126 |
METHOD OF MAKING A WOVEN FIBER CIRCUIT ELEMENT
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3426424 |
PRESSURE-RESPONSIVE SEMICONDUCTOR DEVICE
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3360851 |
Small area semiconductor device
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3302266 |
Electrical device
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3293092 |
Semiconductor device fabrication
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3281922 |
Method for assembly of semiconductor devices
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3250964 |
Semiconductor diode device and method of making it
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3237061 |
Semiconductor device having exposed semiconductor surface and method of manufacture
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3223903 |
Point contact semiconductor device with a lead having low effective ratio of length to diameter
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3212161 |
Manufacture of semiconductor valves
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3210623 |
Electronically-conducting semi-conductor devices having a soldered joint with the terminal conductor of a point contact electrode thereof
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3178796 |
Method and device for the machine assembling of crystal diodes
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3165812 |
Method of manufacturing glass diodes
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3162556 |
Introduction of disturbance points in a cadmium sulfide transistor
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3127659 |
Method of manufacturing point contact semiconductor devices
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3094766 |
Method of assembling a semi-conductor
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3070477 |
Method of making a gallium sulfide dioxide
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3059321 |
Method of making diode elements
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3057051 |
Article assembly apparatus
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3038241 |
Semiconductor device
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3002134 |
Electrical translator device and method of manufacture
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2987799 |
Mobile particle entrapment method
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2978661 |
Semiconductor devices
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