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8158449 |
Particle emission analysis for semiconductor fabrication steps
A structure and a method for operating the same. The method includes providing a detecting structure which includes N detectors. N is a positive integer. A fabrication step is simultaneously...
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8153451 |
System and method for performing semiconductor processing on target substrate
A semiconductor process system (10) includes a measuring section (40), an information processing section (51), and a control section (52). The measuring section (40) measures a characteristic of a...
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8129745 |
Method of manufacturing an instant pulse filter using anodic oxidation and instant pulse filter manufactured by said method
The instant pulse filter according to the present invention, which may cause a malfunction or a short life span of a semiconductor device, is made using an aluminum anodic oxidation, comprising—a f...
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8129202 |
Plasma doping method and apparatus
It is intended to provide a plasma doping method and apparatus which are superior in the controllability of the concentration of an impurity that is introduced into a surface layer of a sample. A...
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8097473 |
Alignment method, exposure method, pattern forming method, and exposure apparatus
An alignment method is provided in which a substrate including first and second layers is aligned in forming a second pattern in the second layer. The method includes storing first alignment...
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8053898 |
Connection for off-chip electrostatic discharge protection
A method and apparatus for off-chip ESD protection, the apparatus includes an unprotected IC 22 stacked on an ESD protection chip 24 and employing combinations of edge wrap 32 and through-silicon...
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8048689 |
Semiconductor chip with backside conductor structure
Various semiconductor devices and methods of testing such devices are disclosed. In one aspect, a method of manufacturing is provided that includes forming a bore from a backside of a semiconductor...
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8030117 |
Image sensor and method for manufacturing the same
A method for manufacturing an image sensor includes forming first to third photodiodes and first to third color filters corresponding thereto; forming a photoresist film including photosensitive...
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8017526 |
Gate profile control through effective frequency of dual HF/VHF sources in a plasma etch process
A method of processing a wafer in a plasma, in which target values of two different plasma process parameters are simultaneously realized under predetermined process conditions by setting...
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8000519 |
Method of metal pattern inspection verification
A method of evaluating an inline inspection recipe compares the capture rate of metal pattern defects in bounding boxes arising from failed electrical test vectors to the capture rate after the...
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8000928 |
Methods and apparatus for data analysis
A method and apparatus for data analysis according to various aspects of the present invention is configured to automatically select one or more outlier identification algorithms for identifying...
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7993937 |
DC and RF hybrid processing system
The invention can provide apparatus and methods for processing substrates and/or wafers in real-time using at least one Direct Current (DC)/Radio Frequency (RF) Hybrid (DC/RFH) processing system...
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7989227 |
Method of manufacturing semiconductor chip and semiconductor module
An FOM (figure of merit) enabling evaluation from a cost aspect, as well as evaluation of electrical performance, is newly proposed to provide a method of manufacturing based on the FOM a...
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7981700 |
Semiconductor oxidation apparatus and method of producing semiconductor element
A semiconductor oxidation apparatus is provided with a sealable oxidation chamber defined by walls, a base provided within the oxidation chamber and configured to support a semiconductor sample, a...
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7972874 |
Semiconductor process evaluation methods including variable ion implanting conditions
Semiconductor process evaluation methods perform multiple scans of a test semiconductor substrate (e.g., test wafer) using ion beams under different ion implanting conditions. Parameters of the...
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7963026 |
Method of forming an electrical heating element
A method for forming an electrical heating element by flame spraying a metal/metallic oxide matrix, wherein a flame sprayed metal/metallic oxide matrix is deposited onto an insulating or conductive...
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7960188 |
Polishing method
A method for polishing a substrate having a metal film thereon is described. The substrate has metal interconnects formed from part of the metal film. The polishing method includes performing a...
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7955986 |
Capacitively coupled plasma reactor with magnetic plasma control
A plasma reactor includes a vacuum enclosure including a side wall and a ceiling defining a vacuum chamber, and a workpiece support within the chamber and facing the ceiling for supporting a planar...
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7955886 |
Apparatus and method for reducing interference
A method and apparatus is provided for use in an integrated circuit or printed circuit board for reducing or minimizing interference. An inductance is formed using two or more inductors coupled...
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7955943 |
High voltage sensor device and method therefor
In one embodiment, a high voltage element is formed overlying a doped semiconductor region that can be depleted during the operation of the high voltage element includes a conductor overlying a...
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7948015 |
Methods and apparatus for measuring analytes using large scale FET arrays
Methods and apparatus relating to very large scale FET arrays for analyte measurements. ChemFET (e.g., ISFET) arrays may be fabricated using conventional CMOS processing techniques based on...
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7943401 |
Detection and reduction of dielectric breakdown in semiconductor devices
Methods for detecting the breakdown potential of a semiconductor device having a thin dielectric layer are disclosed. The method includes measuring a spectroscopy of the thin dielectric layer and...
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7935549 |
Seminconductor device
The present invention provides a signal transmitting/receiving method comprising: disposing a ferromagnetic film between a semiconductor device having an inductor and an external device which...
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7932105 |
Systems and methods for detecting and monitoring nickel-silicide process and induced failures
Systems and methods for detecting and monitoring Nickel-silicide process and induced failures. In a first method embodiment, a method of characterizing a Nickel-silicide semiconductor manufacturing...
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7927892 |
Thermal treatment apparatus, thermal treatment method and method of manufacturing semiconductor device
A thermal treatment apparatus having a first light source emitting a first light having light diffusion property, a reflectance measuring unit irradiating a treatment target with the light from...
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7901952 |
Plasma reactor control by translating desired values of M plasma parameters to values of N chamber parameters
The invention concerns a method of processing a wafer in a plasma reactor chamber by controlling plural chamber parameters in accordance with desired values of plural plasma parameters. The method...
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7871830 |
End point detection method for plasma etching of semiconductor wafers with low exposed area
A method for controlling the plasma etching of semiconductor wafers determines the impedance of a plasma chamber using values representing voltage, current, and the phase angle between them, as...
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7871833 |
Determining chip separation by comparing coupling capacitances
A semiconductor die includes proximity connectors proximate to a surface of the semiconductor die. This semiconductor die is configured to communicate signals with another semiconductor die via...
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7851233 |
E-chuck for automated clamped force adjustment and calibration
The present disclosure provides a semiconductor manufacturing method. The method includes performing a first process to a wafer; measuring the wafer for wafer data after the first process; securing...
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7851234 |
System and method for enhanced control of copper trench sheet resistance uniformity
A method is disclosed for controlling the sheet resistance of copper trenches formed on semiconductor wafers. The method includes forming a plurality of copper-filled trenches on a wafer, measuring...
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7844857 |
Writing data processing control apparatus, writing method, and writing apparatus
A writing data processing control apparatus includes an assignment part configured to assign processing of a plurality of pieces of writing data of predetermined divided writing regions, stored in...
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7820987 |
Predicting dose repeatability in an ion implantation
An approach for predicting dose repeatability in an ion implantation is described. In one embodiment, an ion source is tuned to generate an ion beam with desired beam current. Beam current...
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7816152 |
In situ, ex situ and inline process monitoring, optimization and fabrication
Methods and systems for in situ process control, monitoring, optimization and fabrication of devices and components on semiconductor and related material substrates includes a light illumination...
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7803643 |
Method of forming a high voltage sense element
In one embodiment, a method of forming a high voltage element includes forming a sense element overlying at least a portion of a semiconductor substrate, and also includes operably coupling a first...
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7790478 |
Manufacturing method of semiconductor integrated circuit device
In remote plasma cleaning, it is difficult to locally excite a plasma because the condition is not suitable for plasma excitation different from that at the time of film formation and a method...
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7781234 |
Semiconductor process evaluation methods including variable ion implanting conditions
Semiconductor process evaluation methods perform multiple scans of a test semiconductor substrate (e.g., test wafer) using ion beams under different ion implanting conditions. Parameters of the...
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7781294 |
Method for producing an integrated circuit including a semiconductor
A method for producing an integrated circuit including a semiconductor is disclosed. In one embodiment, crystal defects are produced by irradiation in the material of the underlying semiconductor...
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7772015 |
Observation method of wafer ion implantation defect
An analysis method of wafer ion implant is presented, the steps of the method comprises: (a) cleave a wafer for analysis, and (b) from these pieces of wafers determine which ones are wafer with...
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7768269 |
Method of multi-location ARC sensing with adaptive threshold comparison
A method of responding to voltage or current transients during processing of a wafer in a plasma reactor at each of plural RF power applicators and at the wafer support surface. For each process...
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7767472 |
Substrate processing method and substrate processing apparatus
A substrate processing method is used to polish a substrate. The substrate processing method includes rotating a substrate 13 by a motor 12, polishing a first surface of a peripheral portion of the...
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7759135 |
Method of forming a sensor node module
A method of manufacturing a sensor node module includes forming a protruding structure on a carrier. A sensor die is applied onto the protruding structure with an active sensing surface of the...
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7754518 |
Millisecond annealing (DSA) edge protection
A method and apparatus for thermally processing a substrate is provided. A substrate is disposed within a processing chamber configured for thermal processing by directing electromagnetic energy...
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7755066 |
Techniques for improved uniformity tuning in an ion implanter system
Techniques for uniformity tuning in an ion implanter system are disclosed. In one particular exemplary embodiment, the techniques may be realized as a method for ion beam uniformity tuning. The...
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7750644 |
System with multi-location arc threshold comparators and communication channels for carrying arc detection flags and threshold updating
A plasma reactor system for processing a wafer in which respective comparators are coupled to the respective RF transient sensors which are coupled in turn to respective RF power application...
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7750645 |
Method of wafer level transient sensing, threshold comparison and arc flag generation/deactivation
A method for processing a semiconductor wafer in a plasma reactor comprises sensing transient voltages or currents on a conductor coupled to the wafer and providing a first comparator for comparing...
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7749868 |
Process of forming a curved profile on a semiconductor substrate
A semiconductor substrate shaped to have a curved surface profile by anodization. Prior to being anodized, the substrate is finished with an anode pattern on its bottom surface so as to be...
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7749778 |
Addressable hierarchical metal wire test methodology
A method of monitoring and testing electro-migration and time dependent dielectric breakdown includes forming an addressable wiring test array, which includes a plurality or horizontally disposed...
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7737049 |
Method for forming a structure on a substrate and device
In one aspect, a method of forming a structure on a substrate is disclosed. For example, the method includes forming a first mask layer and a second mask layer, modifying a material property in...
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7737702 |
Apparatus for wafer level arc detection at an electrostatic chuck electrode
Wafer level arc detection is provided in a plasma reactor using an RF transient sensor sensing voltage at an electrostatic chucking electrode, the RF sensor being coupled to a threshold comparator,...
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7736915 |
Method for neutralizing trapped charge in a charge accumulation layer of a semiconductor structure
A method for neutralizing trapped charges in a buried oxide layer. The method includes providing a semiconductor structure which includes (a) a semiconductor layer, (b) a charge accumulation layer...
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