Match Document Document Title
7615332 Photosensitive compound, photosensitive composition, resist pattern forming method, and device production process  
A photosensitive compound has two or more structural units, in a molecule, represented by the following general formula (1): wherein R 1 to R 5 are selected from the group consisting of...
7598024 Method and system for enhanced lithographic alignment  
A method for alignment mark preservation includes a step of preparing a lower alignment mark structure on a substrate. In one configuration of the invention, the alignment mark structure includes a...
7598023 Process for fabricating micro-display  
A process for fabricating a micro-display is provided. First, a wafer having a driving circuit thereon is provided. Then, a metallic reflective layer is formed on the wafer. Thereafter, an...
7585614 Sub-lithographic imaging techniques and processes  
A method of patterning which provides images substantially smaller than that possible by lithographic techniques is provided. In the method of the invention, a substrate has a memory layer and a...
7579136 Microfluidic device and method of manufacturing the same  
Provided is a method of manufacturing a microfluidic device in which coating film patterns made of a coupling agent are formed in microchannels. The method includes: forming the coating film...
7572572 Methods for forming arrays of small, closely spaced features  
Methods of forming arrays of small, densely spaced holes or pillars for use in integrated circuits are disclosed. Various pattern transfer and etching steps can be used, in combination with...
7569333 Wiring line structure and method for forming the same  
The wiring line structure comprises a transparent substrate, a barrier layer, a metal layer, and a photosensitive protecting layer. The barrier layer and a metal layer are successively disposed on...
7563148 Method for manufacturing a field emission display  
A method for manufacturing a field emission display, including: providing a cathode module having a plurality of cathode electrodes ( 32 ) and a plurality of electron emitters ( 33 ) arranged on...
7560201 Patterning a single integrated circuit layer using multiple masks and multiple masking layers  
A multiple mask and a multiple masking layer technique can be used to pattern a single IC layer. A resolution enhancement technique can be used to define one or more fine-line patterns in a first...
7553770 Reverse masking profile improvements in high aspect ratio etch  
A method of improving high aspect ratio etching by reverse masking to provide a more uniform mask height between the array and periphery is presented. A layer of amorphous carbon is deposited over...
7537883 Method of manufacturing nano size-gap electrode device  
Provided is a method of manufacturing a nano size-gap electrode device. The method includes the steps of: disposing a floated nano structure on a semiconductor layer; forming a mask layer having at...
7537866 Patterning a single integrated circuit layer using multiple masks and multiple masking layers  
A multiple mask and a multiple masking layer technique can be used to pattern a single IC layer. A resolution enhancement technique can be used to define one or more fine-line patterns in a first...
7524432 Metal pattern forming method  
A method of forming a metal pattern comprising forming a metal film having a lower layer made of a metal and an upper layer made of a metal different from the metal of the lower layer, forming a...
7520284 Apparatus for developing photoresist and method for operating the same  
A first proximity head is configured to define a meniscus of a photoresist developer solution on a substrate. The meniscus is to be defined between a bottom of the first proximity head and the...
7485411 Method for manufacturing printed circuit board with thin film capacitor embedded therein  
In a method for manufacturing a printed circuit board with a thin film capacitor embedded therein, a conductive metal is sputtered via a first mask to form a lower electrode. A dielectric material...
7482111 Negative radiation-sensitive resin composition  
It is an object of the present invention to provide a process capable of precisely producing a plated shaped article of a large thickness such as a bump or a wiring, a negative radiation-sensitive...
7479364 Copolymer for use in chemical amplification resists  
A copolymer is provided for use in a lithographic photoresist composition, particularly a chemical amplification photoresist. In a preferred embodiment, the copolymer is substantially transparent...
7476485 Resist lower layer film material and method for forming a pattern  
There is disclosed a resist lower layer film material for a multilayer-resist film used in lithography which contains, at least, a polymer having a repeating unit represented by the following...
7465523 Method for manufacturing transfer mask substrate, transfer mask substrate, and transfer mask  
To reduce a stress change generated in the production processes of a transfer mask to improve a position accuracy of a mask pattern. A production method of a transfer mask characterized by further...
7435536 Method to align mask patterns  
Alignment tolerances between narrow mask lines, for forming interconnects in the array region of an integrated circuit, and wider mask lines, for forming interconnects in the periphery of the...
7419768 Methods of fabricating integrated circuitry  
The invention includes methods of fabricating integrated circuitry and semiconductor processing polymer residue removing solutions. In one implementation, a method of fabricating integrated...
7419763 Near-field exposure photoresist and fine pattern forming method using the same  
A near-field photoresist for formation of a fine pattern with by near-field exposure includes an alkali-soluble novalac resin, a diazyde-type photosensitizer which is photoreactive by near-field...
7416837 Resist pattern-improving material and a method for preparing a resist pattern by using the same  
The present invention provided an improvement to reduce an edge roughness during forming a small and fine pattern. Such and objective is to accomplish that after patterning a resist film, a coating...
7415761 Method of manufacturing multilayered circuit board  
An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22 , the thickness of which is reduced (to 3 μm) by performing etching to lower the...
7407738 Fabrication and use of superlattice  
This disclosure relates to a system and method for fabricating and using a superlattice. A superlattice can be fabricated by applying alternating material layers on a ridge and then removing some...
7381508 Integrated circuit semiconductor device with overlay key and alignment key and method of fabricating the same  
An integrated circuit semiconductor device including a cell region formed in a first portion of a silicon substrate, the cell region including a first trench formed in the silicon substrate, a...
7381285 Manufacturing method of a device  
In a manufacturing method of a flexible device, when a protective material is adhered onto a surface of a substrate, the adhesion is performed at only a part of the substrate. Since being adhered...
7375308 Garment incorporating functional electrical circuit  
Disclosed is a breathable heater element for a garment or for the lining of a garment such as an outdoor jacket, e.g. a waterproof jacket. The heater element is formed from porous metallised fabric...
7371499 Photoresist resin composition, method of forming a photoresist pattern, and method of manufacturing a display substrate using the same  
A photoresist resin composition comprises about 10 to about 35% by weight of an acryl-based copolymer, about 5 to about 10% by weight of a quinone diazide compound, about 55 to about 80% by weight...
7368227 Method to print photoresist lines with negative sidewalls  
It is very difficult to produce a negative wall angle from either negative or positive-tone chemically amplified resists, especially by e-beam lithography. This problem has now been overcome by...
7368226 Method for forming fine patterns of semiconductor device  
A method for forming fine patterns of a semiconductor device is provided, the method including forming a first lower layer pattern having a width of two minimum line width and a space pattern on a...
7361455 Anti-reflective coatings  
Anti-reflective materials such as bottom anti-reflective coatings (BARC's) and sacrificial light absorbing materials (SLAM) may be made more effective at preventing coherent light or electron beam...
7338750 Resist pattern thickness reducing material, resist pattern and process for forming thereof, and semiconductor device and process for manufacturing thereof  
A resist pattern thickness reducing material has at least one type selected from a water soluble resin and an alkali-soluble resin. A process for forming a resist pattern includes a step for...
7335462 Method of depositing an amorphous carbon layer  
A method of forming an integrated circuit using an amorphous carbon film. The amorphous carbon film is formed by thermally decomposing a gas mixture comprising a hydrocarbon compound and an inert...
7335461 Method of structuring of a subtrate  
The invention relates to a method of structuring of a substrate by providing a polymerization starter layer on the substrate, applying a radiation field on the polymerization starter layer for...
7329479 Process for production of electroluminescent element and electroluminescent element  
A process of producing an electroluminescent element is provided. The production process comprises repeating at least twice a step of forming an electroluminescent layer comprising a buffer layer...
7323401 Semiconductor substrate process using a low temperature deposited carbon-containing hard mask  
A method of processing a thin film structure on a semiconductor substrate using an optically writable mask includes placing the substrate in a reactor chamber, the substrate having on its surface a...
7323292 Process for using photo-definable layers in the manufacture of semiconductor devices and resulting structures of same  
A process and related structure are disclosed for using photo-definable layers that may be selectively converted to insulative materials in the manufacture of semiconductor devices, including for...
7323291 Dual layer workpiece masking and manufacturing process  
The present invention relates to preparation of patterned workpieces in the production of semiconductor and other devices. Methods and devices are described utilizing resist and transfer layers...
7318993 Resistless lithography method for fabricating fine structures  
A resistless lithography method for fabricating fine stiuctures is disclosed. IN an embodiment, a semiconductor mask layer (HM) may be formed on a carrier material (TM, HM′) and a selective ion...
7318992 Lift-off positive resist composition  
A lift-off positive resist composition capable of forming a fine lift-off pattern is provided. This composition comprises a base resin component (A) and an acid generator component (B) generating...
7314834 Semiconductor device fabrication method  
A semiconductor device fabrication method applies a diazo novolac photoresist to a semiconductor wafer, followed by light exposure of its entire surface to form an underlying resist layer; forms a...
7306742 Patterning method, patterning apparatus, patterning template, and method for manufacturing the patterning template  
A template 1 is brought close to or in contact with a surface to be patterned 111 and patterns are formed with liquid 62 on the surface 111 . This method comprises the steps of: bringing the...
7294452 Light emitting element and process for producing the same  
Disclosed are a light emitting element that, in the formation of a plurality of luminescent layers, can effectively suppress color mixing in each luminescent layer and loss in dissolution of the...
7285781 Characterizing resist line shrinkage due to CD-SEM inspection  
A CD-SEM (critical dimension-scanning electron microscope) system may utilize a technique for characterizing and reducing shrinkage carryover due to CD-SEM measurements. The system may identify the...
7279268 Conductive lithographic polymer and method of making devices using same  
A conductive photolithographic film and method of forming a device using the conductive photolithographic film. The method includes depositing a conductive photolithographic film on a top surface...
7276327 Silicon-containing compositions for spin-on arc/hardmask materials  
Antireflective compositions characterized by the presence of an Si-containing polymer having pendant chromophore moieties are useful antireflective coating/hardmask compositions in lithographic...
7270940 Method of structuring of a substrate  
The invention relates to a method of structuring of a substrate by providing a polymerization starter layer on the substrate, applying a radiation field on the polymerization starter layer for...
7268080 Method for printing contacts on a substrate  
A method for printing contacts utilizes photolithographic pattern reversal. A negative of the contact is printed on a resist layer. Unexposed portions of the resist layer are stripped to expose a...
7267859 Thick porous anodic alumina films and nanowire arrays grown on a solid substrate  
The presently disclosed invention provides for the fabrication of porous anodic alumina (PAA) films on a wide variety of substrates. The substrate comprises a wafer layer and may further include an...