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7635551 |
Poly (imide-azomethine) copolymer, poly (amic acid-azomethine) copolymer, and positive photosensitive resin composition
A poly(imide-azomethine)copolymer that has a low linear thermal expansion coefficient and a method for producing the same copolymer are provided. Also provided are a poly(amic...
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7629091 |
Polyimide compound and flexible wiring board
A polyimide compound has a low coefficient of linear thermal expansion comparable to the coefficient of linear thermal expansion of a conductor to be covered by the polyimide. The polyimide...
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7615331 |
Photosensitive resin composition, production method of cured relief pattern using the same and semiconductor device
A photosensitive resin composition contains: a polymer represented by the formula (I) as defined herein, in which 0.5 mol % or more of A in the polymer represented by the formula (I) is a...
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7615324 |
Photosensitive composition, and cured relief pattern production method and semiconductor device using the same
A photosensitive resin composition includes (a) a resin comprising a repeating unit represented by a following formula (1); (b) a photosensitive agent; (c) a thermo-acid generator; and (d) a...
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7598009 |
Photosensitive resin composition, production method for cured relief pattern using it, and semiconductor device
According to the present invention, there is provided: a photosensitive resin composition comprising a polyamide resin having a specific structure, a photosensitive agent, and a compound having at...
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7592119 |
Photosensitive polyimide resin composition
The developability of a photosensitive polyimide resin composition with a weakly alkaline aqueous solution is improved without reduction in the solubility in general-purpose organic solvents even...
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7524594 |
Photosensitive dielectric resin compositions, films formed therefrom and semiconductor and display devices encompassing such films
Some embodiments in accordance with the present invention relate to norbornene-type polymers and to photosensitive dielectric resin compositions formed therefrom. Other embodiments relate to films...
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7521167 |
Ester group-containing poly (imide-azomethine) copolymer, ester group-containing poly (amide acid-azomethine) copolymer, and positive photosensitive resin composition
Provided are an ester group-containing poly(imide-azomethine)copolymer having low linear thermal expansion coefficient; a production method thereof; an ester group-containing poly(amide...
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7507518 |
Photosensitive resin precursor composition
The present invention relates to a positive photosensitive resin precursor composition which exhibits good storage stability after exposure. A photosensitive resin precursor composition comprises...
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7462436 |
Positive photoresist composition and method of forming resist pattern
There is provided a positive photoresist composition capable of forming a pattern with excellent resolution, excellent resistance to reflection off the substrate, and excellent perpendicularity....
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7455948 |
Photosensitive resin composition
This invention relates to a positive photosensitive resin composition allowing development with an alkaline aqueous solution and excellent in resolution, photosensitivity and pattern form even if...
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7439005 |
Styrene derivative, styrene polymer, photosensitive resin composition, and method for forming pattern
There is disclosed a photosensitive resin composition for interlayer insulating films, surface protection films or the like, which exhibits excellent resolution and can be developed with an aqueous...
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7435525 |
Positive photosensitive resin composition, method for forming pattern, and electronic part
Provided is a positive photosensitive resin composition which is advantageous not only in excellent sensitivity, resolution and adhesion, but also in excellent heat resistance even when the...
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7416830 |
Photosensitive resin compositions
A positive-working photosensitive composition comprising one or more polybenzoxazole precursor polymers, a diazonaphthoquinone photoactive compound which is the condensation product of a compound...
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7416822 |
Resin and resin composition
Disclosed is a hydroxy polyamide represented by the following general formula (1) and having a 5-amino isophthalic acid derivative structure in the main chain structure. (1) (In the formula, m and...
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7378230 |
Photoresist composition for multi-micro nozzle head coater
The present invention relates to a photoresist composition for an MMN (multi-micro nozzle) head coater, more particularly to a photoresist composition comprising a novolak resin with a molecular...
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7378215 |
Positive photoresist composition
A positive photoresist composition comprising an alkali-soluble resin, a 1,2-quinonediazide compound, an organic solvent, and a fluorinated organosilicon compound of formula (1) serving as a...
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7374856 |
Positive type photo-sensitive siloxane composition, cured film formed from the composition and device incorporating the cured film
A positive photosensitive siloxane composition having high photosensitivity and having such properties as high heat resistance, high transparency and low dielectric constant may be used to form a...
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7371501 |
Photosensitive resin composition and method for manufacturing semiconductor apparatus using the same
A photosensitive resin composition comprises: a polybenzoxazole precursor (A); a naphthoquinone diazide photosensitizer (B); and a specific phenolic hydroxyl group-containing compound (C).
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7371500 |
Positive photosensitive insulating resin composition and cured product thereof
Positive photosensitive insulating resin compositions of the invention contain at least (A) an alkali soluble resin having a phenolic hydroxyl group, (B) a compound having a quinonediazido group,...
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7371499 |
Photoresist resin composition, method of forming a photoresist pattern, and method of manufacturing a display substrate using the same
A photoresist resin composition comprises about 10 to about 35% by weight of an acryl-based copolymer, about 5 to about 10% by weight of a quinone diazide compound, about 55 to about 80% by weight...
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7368205 |
Polyamide resin, positive-working photosensitive resin composition, method for producing pattern-formed resin film, semiconductor device, display device, and method for producing the semiconductor device and the display device
The invention provides a polyamide resin having a structure represented by the formula (1), wherein about 0.1 mol % to about 30 mol % of the total amount of Y in the formula (1) has a structure...
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7368216 |
Photosensitive resin composition and manufacturing method of semiconductor device using the same
A positive photosensitive resin composition, which contains a polybenzoxazole precursor, a quinonediazide photosensitizer and a carbonate solvent, and a method of manufacturing a semiconductor...
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7361445 |
Positive-working photosensitive resin composition, method for producing pattern-formed resin film, semiconductor device, display device, and method for producing the semiconductor device and the display device
A positive-working photosensitive resin composition containing an alkali soluble resin (A), a diazoquinone compound (B) and a compound (C) which contains a —CH 2 OH group but not a phenolic...
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7348122 |
Photosensitive resin composition and method for manufacturing semiconductor device using the same
A photosensitive resin composition comprising: a quinone diazide sulfonic acid ester of a phenol compound represented by formula (I) as defined in the specification; and a polybenzoxazole...
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7338737 |
Photosensitive resin composition, thin film panel made with photosensitive resin composition, and method for manufacturing thin film panel
A photosensitive resin composition includes an alkali-soluble resin, a quinone diazide, a surfactant, and a solvent. The solvent includes a diethylene glycol dialkyl ether that includes an alkyl...
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7332254 |
Positive photosensitive insulating resin composition, cured product thereof, and electronic component
Disclosed is a positive photosensitive insulating resin composition including:
(A) an alkali soluble resin, (B) a compound having a quinonediazide group, and (C) an epoxy resin having a...
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7303859 |
Photoresist, photolithography method using the same, and method for producing photoresist
There is provided a positive photoresist for near-field exposure excellent in light utilization efficiency even with small layer thickness of the photoresist layer for image formation, and allowing...
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7279263 |
Dual-wavelength positive-working radiation-sensitive elements
A positive-working radiation-sensitive composition for use with a radiation source comprises one or more polymers capable of being eluted in an alkaline aqueous solution and a development-enhancing...
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7255970 |
Photoresist composition for imaging thick films
The present invention provides for a light-sensitive photoresist composition useful for imaging thick films, comprising a polymer which is insoluble in an aqueous alkali developer but becomes...
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7214455 |
Photosensitive resin composition and process for producing heat-resistant resin film
The present invention is directed to a photosensitive resin composition comprising (a) a resin having a specific structure, (b) a photosensitive agent, and (c) an organic solvent having a boiling...
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7214454 |
Positively photosensitive insulating resin composition and cured object obtained therefrom
Positive photosensitive insulating resin compositions of the invention contain at least (A) an alkali soluble resin having a phenolic hydroxyl group, (B) a compound having a quinonediazido group,...
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7195854 |
Photoresist composition
The present invention provides a photoresist composition and more particularly, a photoresist composition comprising a) a novolak resin, b) a diazide compound, and c) a solvent containing propylene...
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7175960 |
Positive resist composition and patterning process
A positive resist composition comprising a mixture of an alkali-soluble novolak resin prepared using m-cresol, p-cresol and 2,5-xylenol as starting reactants and a phenolic compound, wherein the...
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7132213 |
Positive photoresist composition and method of forming resist pattern
A positive photoresist composition comprising an alkali-soluble novolak resin (A) containing a structural unit (a1) represented by a general formula (I) shown below, and a structural unit (a2)...
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7101652 |
Photosensitive resin compositions
New photosensitive PBO precursor polymers which contain diazoquinone moieties attached to its backbone and in which all amino end groups are converted into amide groups. The photosensitive...
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7101650 |
Photosensitive resin composition for photoresist
The present invention relates to a photosensitive resin composition for use as a photoresist, and more particularly, to a photosensitive resin composition for a photoresist comprising an acrylate...
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7090958 |
Positive photoresist compositions having enhanced processing time
Novel compositions comprising photoactive polymers comprising a dinitrobenzyl group in conjunction with a photoacid generator are disclosed. In one embodiment, the photoacid generator is a diazide...
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7060410 |
Novolak resin solution, positive photoresist composition and preparation method thereof
There is provided a method of producing a resist composition which yields a resist composition with good storage stability, and no fluctuation in characteristics between production lots. There are...
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7026080 |
Positive photosensitive polyimide resin composition
The invention provides a positive photosensitive resin composition which is free from film reduction, swelling or peeling at the time of development with an aqueous alkaline solution and which...
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7015256 |
Composition for forming photosensitive dielectric material, and transfer film, dielectric material and electronic parts using the same
A photosensitive composition for forming a dielectric of the present invention comprising inorganic particles, an alkali developable resin and additives, wherein the additives comprise a compound...
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7001705 |
Positively photosensitive resin composition and method of pattern formation
The present invention provides a positive photosensitive resin composition which can be developed with a tetramethylammonium hydroxide aqueous solution with a usual concentration, has high...
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6984476 |
Radiation-sensitive resin composition, forming process for forming patterned insulation film, active matrix board and flat-panel display device equipped with the same, and process for producing flat-panel display device
The invention provides a radiation-sensitive resin composition, by which a patterned insulation film whose water repellency varies is easily formed with high precision, a process for forming a...
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6964838 |
Positive photoresist composition
A composition includes (A) an alkali-soluble resin, (B) a quinonediazide ester of a compound represented by the following formula:
and (C) a compound represented by the following formula:
...
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6939926 |
Phenol novolak resin, production process thereof, and positive photoresist composition using the same
A phenol novolak resin has a peak intensity ratio of ortho-ortho bond (o-o)/ortho-para bond (o-p)/para-para bond (p-p) in a resin structure not substantially varying in each molecular weight...
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6933100 |
Method of forming a minute resist pattern
A method of forming a minute resist pattern wherein a positive-working photoresist composition containing 3 to 15 parts by weight of a quinone diazide group-containing photosensitizer relative to...
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6933087 |
Precursor composition for positive photosensitive resin and display made with the same
A positive photosensitive resin precursor composition which can be can be developed in an alkaline developer is provided. The positive photosensitive resin precursor composition comprises (a), one...
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6929890 |
Positive-type photosensitive resin composition
Disclosed is a positive-type photosensitive resin composition comprising: (a) an alkali-soluble resin; (b) a quinone diazide compound; (c) a heatsensitive compound which colors upon being heated...
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6927274 |
Resin compositions, processes for preparing the resin compositions and processes for forming resin films
Polyimide precursors contained in resin compositions of the present invention have a polymer structure unit represented by formula (1) below:
wherein chemical structure A 2 includes an...
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6913865 |
Surface modified encapsulated inorganic resist
The present invention describes encapsulated inorganic resists which are compatible with conventional resist processing and development. The encapsulated inorganic materials increase the plasma...
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