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5451484 |
Positive resist composition
A positive resist composition comprising a quinonediazide compound and an alkali-soluble resin containing resin (A) obtainable through a condensation reaction of at least one compound represented...
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5449584 |
Positive photo-sensitive resin composition comprising a photosensitive polybenzoxazole or a mixture of a polybenzoxazole, an organic solvent soluble polymer and a diazoquinone and/or a dihydropyridine compound
The present invention provides a positive photo-sensitive resin composition comprising a polybenzoxazole precursor as a base resin, an organic solvent-soluble polymer or its precursor (e.g., a...
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5447825 |
Method for forming a pattern using a photosensitive composition comprising an alkali-soluble resin made from a phenolic compound and at least two different aldehydes
A photosensitive resin composition comprising an alkali-soluble resin, a quinonediazide-type photosensitive compound and a solvent, as the main components, wherein the alkali-soluble resin is a...
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5441845 |
Photosensitive resin composition comprising a polyimide precursor and a photosensitive diazoquinone
A photosensitive resin composition which is adapted for protecting articles and particularly, electronic parts, therewith comprises a polyimide precursor of the following general formula ##STR1##...
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5437952 |
Lithographic photosensitive printing plate comprising a photoconductor and a naphtho-quinone diazide sulfonic acid ester of a phenol resin
A photosensitive lithographic printing plate comprises a conductive support and provided thereon, a photoconductive layer of a composition comprising a photoconductor and an esterified compound of...
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5436107 |
Positive resist composition
A positive resist composition which comprises, in admixture, an alkali-soluble resin; at least one quinone diazide sulfonate of a polyhydric phenol compound of the formula: ##STR1## wherein R 1 to...
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5434031 |
Positive-working naphthoquinone diazide photoresist composition containing specific hydroxy compound additive
Disclosed is a positive-working photoresist composition suitable for use in the photolithographic fine patterning work in the manufacture of electronic devices such as VLSIs. The composition...
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5429905 |
Positive working photoresist composition containing naphthoquinone diazide sulfonic acid ester of polyhydroxy compound
The present invention relates to a positive-working photoresist composition comprising at least one of the 1,2-naphthoquinonediazido-5- sulfonic acid ester of a polyhydroxy compound represented by...
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5427888 |
Positive photosensitive resin composition comprising a polymer having carbon-carbon double bonds, a maleic acid group and a maleimide group
A positive photosensitive resin composition contains 50 to 95 parts by weight of a resin (a) composed of a high molecular compound (A) having a molecular weight of 300 to 30,000 and an iodine value...
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5424167 |
Positive type quinonediazide resist composition containing alkali-soluble novolac resin and aromatic hydroxy compound additive
A positive type resist composition comprising an alkali-soluble novolac resin, a quinonediazide compound and a compound represented by general formula (I): ##STR1## wherein Y 1 to Y 10 each...
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5422223 |
Silicon-containing positive resist and use in multilayer metal structures
Photosensitive silicon-containing resist compositions comprising hydroxyphenylsilsesquioxanes and siloxanes partially estersified with diazonaphthoquinone sulfonyloxy groups for imageable O 2 RIE...
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5422221 |
Resist compositions
In a resist composition, a novolak resin including at least one recurring unit of the formula (1): ##STR1## wherein n is an integer of 1 to 4 and m is an integer of 0 to 3, having a weight average...
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5419995 |
Photoresist composition with alternating or block copolymer resins and positive-working o-quinone diazide or negative-working azide sensitizer compound
A photoresist comprising a light sensitive component and an alternating copolymer resin formed by condensing a preformed bishydroxymethylated compound and a reactive phenol, in the absence of an...
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5413896 |
I-ray sensitive positive resist composition
An i-ray sensitive positive resist composition: which (A) comprises an alkali-soluble novolak resin obtained by subjecting (a) a phenolic mixture of B to 95 mol % of 2,3-xylenol with 95 to 5 mol %...
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5413899 |
Light-sensitive mixture containing an 0-naphthoquinonediazide-sulfonic acid ester and recording material produced therewith wherein the 0-naphthoquinone diazides are partial esters
A light-sensitive mixture which contains a resinous binder which is insoluble in water but soluble or at least swellable in aqueous-alkaline solutions, and an o-naphthoquinonediazide-sulfonic acid...
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5413895 |
Positive resist composition comprising a quinone diazide sulfonic acid ester, a novolak resin and a polyphenol compound.
A positive resist composition comprising an alkali-soluble resin containing a novolak resin which is obtained by a condensation reaction of a phenol compound and a carbonyl compound and has an area...
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5411836 |
Positive type photoresist composition comprising a polymer having carbon-carbon double bonds with a maleic half ester and a maleimide attached to the backbone
A positive type photoresist composition contains (a) 100 parts by weight of a resin which is a polymer compound (A) including carbon-carbon double bonds and having a molecular weight of 300 to...
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5407780 |
Radiation-sensitive positive resist composition comprising an alkali-soluble resin made from m-cresol, 2-tert-butl-5-methyl phenol and formaldehyde
A positive resist composition containing a 1,2-quinone diazide compound and an alkali-soluble resin which constitutes a resin (I) obtainable through a condensation reaction of a phenol mixture...
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5405720 |
Radiation-sensitive composition containing 1,2 quinonediazide compound, alkali-soluble resin and monooxymonocarboxylic acid ester solvent
A radiation-sensitive resin composition comprising a solution of an alkali-soluble resin and a radiation-sensitive compound in a solvent comprising a monooxymonocarboxylic acid ester. This...
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5403695 |
Resist for forming patterns comprising an acid generating compound and a polymer having acid decomposable groups
Disclosed herein is a resist for forming patterns, which is greatly sensitive to ultraviolet rays an ionizing radiation, and which can therefore form a high-resolution resist pattern if exposed to...
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5401605 |
Positive working photosensitive resin composition containing 1,2-naphthoquinone diazide esterification product of triphenylmethane compound
Proposed is a positive-working photosensitive resin composition suitable as a photoresist in the photolithographic patterning work for the manufacture of, for example, semiconductor devices having...
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5401604 |
Positive-type photosensitive resin compositions with quinone diazide sulfonyl unit
A positive-type photosensitive resin composition containing a resin which results from reactions between a specific polyepoxide compound, a carboxylic acid compound having a specific phenolic...
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5399462 |
Method of forming sub-half micron patterns with optical lithography using bilayer resist compositions comprising a photosensitive polysilsesquioxane
A method is provided for forming a microlithographic relief image having a width of less than one half micron in a bilayer resist composition. The resist composition comprises a single component,...
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5399456 |
Image reversal negative working photoresist containing O-quinone diazide and cross-linking compound
A process for converting a normally positive working photosensitive composition to a negative working composition. One forms a composition containing an alkali soluble resin, a 1,2 quinone...
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5395728 |
Hexahydroxybenzophenone sulfonate esters of diazonaphthoquinone sensitizers and positive photoresists employing same
Positive photoresists formulations for producing positive photoresist images having improved thermal stability yet which allow a wide variation in resin to photoactive sensitizer compound without...
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5395727 |
Positive resist composition containing a novolak resin made from an aldehyde and dimer of isopropenyl phenol
A novolak resin made from a carbonyl compound and a specific phenol compound, which resin has good properties, in particular, as a base resin of a photoresist.
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5393637 |
Photosensitive composition for offset printing comprising a binder, a photosensitive substance and a microgel made from an acrylic resin having carboxyl groups as the emulsifier
Disclosed is a photosensitive composition used for offset printing, which provides an offset printing plate with excellent durability and developability. The photosensitive composition comprises:...
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5389492 |
Resist composition comprising a siloxane or silsesquioxane polymer having silanol groups in a composition with a naphthoquinone compound
A resist composition comprising a compound having an active hydrogen and an alkali-soluble siloxane polymer containing in the molecules thereof at least one unit selected from a unit represented by...
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5384227 |
Image forming materials prepared using 2-diazo-1,2-naphthoquinone compounds having fluorine atom containing substituent groups
A 2-diazo-1,2-quinone compound having a substituent group containing an alkyl group which is substituted by at least one fluorine atom is described. This compound has a capacity to change its...
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5384228 |
Alkali-developable positive-working photosensitive resin composition
A novel alkali-developable photosensitive resin composition, which is suitable for use as a photoresist composition for fine patterning in the manufacture of various electronic devices, is...
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5380622 |
Production of negative relief copies
Negative relief copies are produced by imagewise exposure of a recording plate consisting of a substrate and a photosensitive layer which is applied thereon and contains, as photosensitive...
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5380618 |
Micropattern-forming material having a low molecular weight novolak resin, a quinone diazide sulfonyl ester and a solvent
A micropattern-forming, light sensitive resin composition is disclosed. The composition comprises (a) a novolak resin comprising a condensate between formaldehyde and a mixture of m-cresol and...
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5378584 |
Radiation-sensitive recording material with a positive-working, radiation-sensitive layer having a rough surface containing a surfactant having polysiloxane units
A radiation-sensitive recording material, in particular for producing planographic printing plates, is disclosed. The material is composed of a layer support and a positive-working,...
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5378586 |
Resist composition comprising a quinone diazide sulfonic diester and a quinone diazide sulfonic complete ester
A positive resist composition which comprises in admixture an alkali-soluble resin and, as a sensitizer, first and second quinone diazide sulfonic acid esters of a phenol compound, wherein (a)...
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5376499 |
Highly heat-resistant positive resists comprising end-capped hydroxypolyamides
Cost-effective, highly heat-resistant positive resists based on oligomer and/or polymer polybenzoxazole precursors and diazo quinones possess a high [level of] stability in storage when the...
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5376496 |
Radiation-sensitive mixture, radiation-sensitive recording material produced therewith containing halogenated methyl groups in the polymeric binder
A radiation-sensitive mixture, a radiation-sensitive recording material produced from the mixture, and a process for producing heat-resistant and chemical-resistant relief copies using the...
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5372909 |
Photosensitive resin composition comprising an alkali-soluble resin made from a phenolic compound and at least 2 different aldehydes
A photosensitive resin composition comprising an alkali-soluble resin, a quinonediazide-type photosensitive compound and a solvent, as the main components, wherein the alkali-soluble resin is a...
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5372908 |
Photosensitive composition comprising a polysilane and an acid forming compound
A photosensitive composition comprises a polysilane having a repeating unit represented by formula (1) and a compound which generates an acid upon exposure to light: ##STR1## wherein each of R 1 ...
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5368977 |
Positive type photosensitive quinone diazide phenolic resin composition
A positive type photosensitive resin composition contains (a) a quinone diazido phenolic resin represented by the formula: ##STR1## wherein R 1 is an alkyl group having 1 to 4 carbon atoms, R 2 ...
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5362598 |
Quinone diazide photoresist composition containing alkali-soluble resin and an ultraviolet ray absorbing dye
A photoresist composition which comprises a compound of the general formula: ##STR1## wherein R 1 , R 2 and R 3 are the same or different and represent a hydrogen atom, a hydroxyl group, --OCOR 4...
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5362599 |
Fast diazoquinone positive resists comprising mixed esters of 4-sulfonate and 5-sulfonate compounds
Positive photoresist compositions and methods using the photoresist compositions for making submicron patterns in the production of semiconductor devices are disclosed. The photoresists contain...
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5362597 |
Radiation-sensitive resin composition comprising an epoxy-containing alkali-soluble resin and a naphthoquinone diazide sulfonic acid ester
A radiation-sensitive resin composition comprising: (a) an epoxy group-containing alkali-soluble resin, or a combination of an alkali-soluble resin which may have an epoxy group and an epoxy...
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5362600 |
Radiation sensitive compositions comprising polymer having acid labile groups
The invention provides a radiation sensitive composition having a polymer binder of phenolic and cyclic alcohol units. At least a portion of the phenolic units and/or cyclic alcohol units of the...
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5360693 |
Positive o-quinone diazide photoresist containing base copolymer utilizing monomer having anhydride function and further monomer that increases etch resistance
An aqueous-alkaline developable photoresist suitable for a lithography in deep ultraviolet light and having a structural resolution in the sub-μm range. The photoresist contains a developable base...
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5358823 |
Radiation-sensitive composition containing esterification product of (1,2-naphthoquinone-2-diazide)-sulfonic acid with 2,3,4,4'-tetrahydroxybenzophenone and a di- or tri-hydroxybenzophenone
A radiation-sensitive composition is disclosed comprising a polymeric binder which is insoluble in water, but soluble or at least swellable in aqueous alkaline solution and a...
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5358824 |
Photosensitive resin composition utilizing 1,2-naphthoquinone diazide compound having spirobichroman or spirobiindane ring
The photosensitive resin composition of the present invention comprises an admixture of 5 to 100 weight parts of a photosensitive material having the following general formula (A) and 100 weight...
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5348835 |
Photosensitive resin composition for forming polyimide film pattern comprising an o-quinone diazide photosensitive agent
Disclosed is a photosensitive resin composition, containing a polyamic acid derivative having a repeating unit represented by general formula (1) given below and a photosensitive agent: ##STR1##...
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5346799 |
Novolak resins and their use in radiation-sensitive compositions wherein the novolak resins are made by condensing 2,6-dimethylphenol, 2,3-dimethylphenol, a para-substituted phenol and an aldehyde
An alkali-soluble novolak binder resin made by the condensation reaction of a mixture of phenolic monomers with at least one aldehyde source, said phenolic monomers consisting of: (1) about 2-18%...
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5342727 |
Copolymers of 4-hydroxystyrene and alkyl substituted-4-hydroxystyrene in admixture with a photosensitizer to form a photosensitive composition
A copolymer of (a) an unsubstituted 4-hydroxystyrene monomer and (b) a substituted 4-hydroxystyrene monomer of the formula ##STR1## wherein A, B, C, and D are independently H or C 1 to C 4 alkyl...
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5342734 |
Deep UV sensitive photoresist resistant to latent image decay
A positive working deep UV sensitive photoresist which provides improved critical dimension stability during prolonged periods of post exposure delay before baking comprises an acid stable polymer...
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