Match Document Document Title
7615331 Photosensitive resin composition, production method of cured relief pattern using the same and semiconductor device  
A photosensitive resin composition contains: a polymer represented by the formula (I) as defined herein, in which 0.5 mol % or more of A in the polymer represented by the formula (I) is a...
7615324 Photosensitive composition, and cured relief pattern production method and semiconductor device using the same  
A photosensitive resin composition includes (a) a resin comprising a repeating unit represented by a following formula (1); (b) a photosensitive agent; (c) a thermo-acid generator; and (d) a...
7604911 Mask pattern for semiconductor device fabrication, method of forming the same, method for preparing coating, composition for fine pattern formation, and method of fabricating semiconductor device  
A mask pattern for semiconductor device fabrication comprises a resist pattern formed on a semiconductor substrate, and an interpolymer complex film formed on the resist pattern, wherein the...
7598009 Photosensitive resin composition, production method for cured relief pattern using it, and semiconductor device  
According to the present invention, there is provided: a photosensitive resin composition comprising a polyamide resin having a specific structure, a photosensitive agent, and a compound having at...
7592119 Photosensitive polyimide resin composition  
The developability of a photosensitive polyimide resin composition with a weakly alkaline aqueous solution is improved without reduction in the solubility in general-purpose organic solvents even...
RE40728 Acid functional polymers based on benzocyclobutene  
The invention is a curable cyclobutarene based polymer comprising acid functional pendant groups. The cured polymer displays excellent qualities of toughness, adhesion, dielectric constant, and low...
7524594 Photosensitive dielectric resin compositions, films formed therefrom and semiconductor and display devices encompassing such films  
Some embodiments in accordance with the present invention relate to norbornene-type polymers and to photosensitive dielectric resin compositions formed therefrom. Other embodiments relate to films...
7521167 Ester group-containing poly (imide-azomethine) copolymer, ester group-containing poly (amide acid-azomethine) copolymer, and positive photosensitive resin composition  
Provided are an ester group-containing poly(imide-azomethine)copolymer having low linear thermal expansion coefficient; a production method thereof; an ester group-containing poly(amide...
7507518 Photosensitive resin precursor composition  
The present invention relates to a positive photosensitive resin precursor composition which exhibits good storage stability after exposure. A photosensitive resin precursor composition comprises...
7462436 Positive photoresist composition and method of forming resist pattern  
There is provided a positive photoresist composition capable of forming a pattern with excellent resolution, excellent resistance to reflection off the substrate, and excellent perpendicularity....
7455948 Photosensitive resin composition  
This invention relates to a positive photosensitive resin composition allowing development with an alkaline aqueous solution and excellent in resolution, photosensitivity and pattern form even if...
7452657 Resist composition, method of forming resist pattern, semiconductor device and method of manufacturing thereof  
The resist composition of the present invention contains at least one of a tannin and a derivative thereof. The method of forming a resist pattern of the present invention includes: forming a...
7439005 Styrene derivative, styrene polymer, photosensitive resin composition, and method for forming pattern  
There is disclosed a photosensitive resin composition for interlayer insulating films, surface protection films or the like, which exhibits excellent resolution and can be developed with an aqueous...
7435525 Positive photosensitive resin composition, method for forming pattern, and electronic part  
Provided is a positive photosensitive resin composition which is advantageous not only in excellent sensitivity, resolution and adhesion, but also in excellent heat resistance even when the...
7419763 Near-field exposure photoresist and fine pattern forming method using the same  
A near-field photoresist for formation of a fine pattern with by near-field exposure includes an alkali-soluble novalac resin, a diazyde-type photosensitizer which is photoreactive by near-field...
7416830 Photosensitive resin compositions  
A positive-working photosensitive composition comprising one or more polybenzoxazole precursor polymers, a diazonaphthoquinone photoactive compound which is the condensation product of a compound...
7416822 Resin and resin composition  
Disclosed is a hydroxy polyamide represented by the following general formula (1) and having a 5-amino isophthalic acid derivative structure in the main chain structure. (1) (In the formula, m and...
7387872 Solution and method for the treatment of a substrate, and semiconductor component  
An embodiment of the invention provides a method for the treatment of a substrate made of paper or a substrate containing paper as support material for a semiconductor component. In an embodiment,...
7378230 Photoresist composition for multi-micro nozzle head coater  
The present invention relates to a photoresist composition for an MMN (multi-micro nozzle) head coater, more particularly to a photoresist composition comprising a novolak resin with a molecular...
7378215 Positive photoresist composition  
A positive photoresist composition comprising an alkali-soluble resin, a 1,2-quinonediazide compound, an organic solvent, and a fluorinated organosilicon compound of formula (1) serving as a...
7374856 Positive type photo-sensitive siloxane composition, cured film formed from the composition and device incorporating the cured film  
A positive photosensitive siloxane composition having high photosensitivity and having such properties as high heat resistance, high transparency and low dielectric constant may be used to form a...
7371501 Photosensitive resin composition and method for manufacturing semiconductor apparatus using the same  
A photosensitive resin composition comprises: a polybenzoxazole precursor (A); a naphthoquinone diazide photosensitizer (B); and a specific phenolic hydroxyl group-containing compound (C).
7371500 Positive photosensitive insulating resin composition and cured product thereof  
Positive photosensitive insulating resin compositions of the invention contain at least (A) an alkali soluble resin having a phenolic hydroxyl group, (B) a compound having a quinonediazido group,...
7371499 Photoresist resin composition, method of forming a photoresist pattern, and method of manufacturing a display substrate using the same  
A photoresist resin composition comprises about 10 to about 35% by weight of an acryl-based copolymer, about 5 to about 10% by weight of a quinone diazide compound, about 55 to about 80% by weight...
7368216 Photosensitive resin composition and manufacturing method of semiconductor device using the same  
A positive photosensitive resin composition, which contains a polybenzoxazole precursor, a quinonediazide photosensitizer and a carbonate solvent, and a method of manufacturing a semiconductor...
7368205 Polyamide resin, positive-working photosensitive resin composition, method for producing pattern-formed resin film, semiconductor device, display device, and method for producing the semiconductor device and the display device  
The invention provides a polyamide resin having a structure represented by the formula (1), wherein about 0.1 mol % to about 30 mol % of the total amount of Y in the formula (1) has a structure...
7361445 Positive-working photosensitive resin composition, method for producing pattern-formed resin film, semiconductor device, display device, and method for producing the semiconductor device and the display device  
A positive-working photosensitive resin composition containing an alkali soluble resin (A), a diazoquinone compound (B) and a compound (C) which contains a —CH 2 OH group but not a phenolic...
7348122 Photosensitive resin composition and method for manufacturing semiconductor device using the same  
A photosensitive resin composition comprising: a quinone diazide sulfonic acid ester of a phenol compound represented by formula (I) as defined in the specification; and a polybenzoxazole...
7338737 Photosensitive resin composition, thin film panel made with photosensitive resin composition, and method for manufacturing thin film panel  
A photosensitive resin composition includes an alkali-soluble resin, a quinone diazide, a surfactant, and a solvent. The solvent includes a diethylene glycol dialkyl ether that includes an alkyl...
7303859 Photoresist, photolithography method using the same, and method for producing photoresist  
There is provided a positive photoresist for near-field exposure excellent in light utilization efficiency even with small layer thickness of the photoresist layer for image formation, and allowing...
7279263 Dual-wavelength positive-working radiation-sensitive elements  
A positive-working radiation-sensitive composition for use with a radiation source comprises one or more polymers capable of being eluted in an alkaline aqueous solution and a development-enhancing...
7255972 Chemically amplified positive photosensitive resin composition  
A photosensitive resin composition suitable for forming a thick film and an ultra-thick film used for forming a thick resist pattern used in the process of forming a magnetic pole on a magnetic...
7255970 Photoresist composition for imaging thick films  
The present invention provides for a light-sensitive photoresist composition useful for imaging thick films, comprising a polymer which is insoluble in an aqueous alkali developer but becomes...
7214455 Photosensitive resin composition and process for producing heat-resistant resin film  
The present invention is directed to a photosensitive resin composition comprising (a) a resin having a specific structure, (b) a photosensitive agent, and (c) an organic solvent having a boiling...
7214454 Positively photosensitive insulating resin composition and cured object obtained therefrom  
Positive photosensitive insulating resin compositions of the invention contain at least (A) an alkali soluble resin having a phenolic hydroxyl group, (B) a compound having a quinonediazido group,...
7195854 Photoresist composition  
The present invention provides a photoresist composition and more particularly, a photoresist composition comprising a) a novolak resin, b) a diazide compound, and c) a solvent containing propylene...
7189488 Polyimide precursor, manufacturing method thereof, and resin composition using polyimide precursor  
A polyimide precursor in accordance with the present invention contains amide acid ester units, either imide units or amide acid units, and fluorine atoms bonded to some of these structural units....
7175960 Positive resist composition and patterning process  
A positive resist composition comprising a mixture of an alkali-soluble novolak resin prepared using m-cresol, p-cresol and 2,5-xylenol as starting reactants and a phenolic compound, wherein the...
7144662 Photoresist composition having a high heat resistance  
The present invention relates to a photoresist composition having high heat resistance used in the production process of an LCD, and more particularly, to a photoresist composition having high heat...
7132213 Positive photoresist composition and method of forming resist pattern  
A positive photoresist composition comprising an alkali-soluble novolak resin (A) containing a structural unit (a1) represented by a general formula (I) shown below, and a structural unit (a2)...
7108951 Photosensitive resin composition  
The photosensitive resin composition comprising: (A) a resin containing (A1) a repeating unit having at least two groups represented by the specific general formula; and (B) a compound...
7101652 Photosensitive resin compositions  
New photosensitive PBO precursor polymers which contain diazoquinone moieties attached to its backbone and in which all amino end groups are converted into amide groups. The photosensitive...
7101650 Photosensitive resin composition for photoresist  
The present invention relates to a photosensitive resin composition for use as a photoresist, and more particularly, to a photosensitive resin composition for a photoresist comprising an acrylate...
7090958 Positive photoresist compositions having enhanced processing time  
Novel compositions comprising photoactive polymers comprising a dinitrobenzyl group in conjunction with a photoacid generator are disclosed. In one embodiment, the photoacid generator is a diazide...
7063939 Method for high aspect ratio pattern transfer  
The present invention relates a method for high aspect ratio pattern transfer, by using combination of imprint and Step and Flash techniques to transfer high aspect ratio pattern. The present...
7060410 Novolak resin solution, positive photoresist composition and preparation method thereof  
There is provided a method of producing a resist composition which yields a resist composition with good storage stability, and no fluctuation in characteristics between production lots. There are...
7026091 Positive photoresist composition and patterning process using the same  
A positive photoresist with uniform reactivity for use in a thick film lithography process, includes thermal curing during soft-baking and photo dissociation through UV exposure. The positive...
7026080 Positive photosensitive polyimide resin composition  
The invention provides a positive photosensitive resin composition which is free from film reduction, swelling or peeling at the time of development with an aqueous alkaline solution and which...
7008883 Photoresist composition for forming an insulation film, insulation film for organic electroluminescence devices and process for producing the insulation film  
A photoresist composition comprising (A) a resin soluble in an alkali, (B) an ester of a quinonediazidesulfonic acid, (C) a thermosetting component and an organic solvent; an insulation film for...
7001705 Positively photosensitive resin composition and method of pattern formation  
The present invention provides a positive photosensitive resin composition which can be developed with a tetramethylammonium hydroxide aqueous solution with a usual concentration, has high...