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7615255 |
Metal duplex method
Methods and articles are disclosed. The methods are directed to depositing nickel duplex layers on substrates to inhibit tin and tin alloy surface oxidation and improve solderability of the...
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7604872 |
Corrosion resisting joining area and method between materials of copper and stainless steel or titanium, which are the constituents of permanent cathodes for electrolytic processes and cathodes obtained
This disclosure provides a joining area and method between copper and stainless steel or titanium, as well as the permanent cathode obtained, where said joining area is made of a first zone of a...
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7575814 |
Laminated composite material, production and use thereof
The invention relates to the use of lead-free sliding layers in the laminated composite materials for slide bearings or bushes. According to the invention, the laminated composite material...
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7491449 |
Copper-silver alloy wire and method for manufacturing the same
An exemplary copper-silver alloy wire includes a conductive core containing copper, and a copper-silver cladding layer surrounding the conductive core. A ratio of silver to copper by weight in the...
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7476449 |
Electromagnetic shielding copper foil, method of production thereof and electromagnetic shield
An electromagnetic shielding copper foil superior in electromagnetic shielding ability, high in transmittance, and free from particle shedding comprising a copper foil on at least one surface of...
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7472650 |
Nickel alloy plated structure
A structure. The structure includes a layered configuration including a copper layer, a first layer, and a second layer. The first and second layers are disposed on opposite sides of the copper...
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7393594 |
Laminated metal thin plate formed by electrodeposition and method of producing the same
A laminated metal thin plate produced by electrodeposition is composed of a plurality of metal layers provided by at least two kinds of materials different in composition from each other. The...
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7381475 |
Treated copper foil and circuit board
An object of the present invention is to provide a treated copper foil laminated with a mesomorphic polymer film having low hygroscopicity and superior high thermal resistance to make a circuit...
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7344785 |
Copper foil for printed circuit board, method for fabricating same, and trivalent chromium conversion treatment solution used for fabricating same
A copper foil 1 comprises a roughened plating layer 2 , a Ni—Co alloy plating layer 3 , a zinc galvanized (underlying) layer 4 , a chromate treatment layer 5 , and a silane coupling...
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7341796 |
Copper foil having blackened surface or layer
A copper foil with a blackened surface or layer wherein one or both surfaces of a copper foil is subject to black treatment, and having a color difference ΔL*≦−70 and chroma C*≦15 of a...
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7335428 |
Cooking vessel comprising a base made of a multilayer material and a side wall, and article of multilayer material
The invention relates to a cooking vessel comprising a base made of a multilayer material and a side wall, the said multilayer material comprising, in succession from the outside of the vessel to...
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7296370 |
Electroplated metals with silvery-white appearance and method of making
Metals having a silvery-white appearance and methods of producing the same. In one embodiment, the composite material of the present invention comprises a metallic core, a first layer, and a second...
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7282255 |
Flexible printed circuit board and process for producing the same
The present invention relates to a flexible printed circuit board which has extremely high adhesion performance and on which very fine circuit patterns can be formed by etching, and to a method for...
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7279231 |
Electroless plating structure
The present invention relates to a cobalt electroless plating bath composition. In one embodiment, the present invention relates to cobalt electroless plating in the fabrication of interconnect...
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7268021 |
Lead frame and method of manufacturing the same
A lead frame having a structure that can discharge hydrogen adsorbed during deposition and can reduce a galvanic potential difference between plating layers and a method of manufacturing the same...
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7267861 |
Solder joints for copper metallization having reduced interfacial voids
A metal interconnect structure ( 100 ) comprising a bond pad ( 101 ), which has copper with at least 70 volume percent composed of crystal grains expanding more than 1 μm in their main direction,...
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7247396 |
Highly oriented perpendicular magnetic recording media
A perpendicular magnetic recording medium including an interlayer structure for crystallographically orienting a layer of a hexagonal close-packed (hcp) perpendicular magnetic recording material...
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7220494 |
Metal dusting resistant product
A product resistant or immune to carburization, metal dusting, coking, oxidation, and having sufficient mechanical strength for use at temperatures greater than 400° C. The product consists of a...
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7217464 |
Method of manufacturing electrodeposited copper foil with carrier foil for high-temperature heat-resistance and electrodeposited copper foil with carrier foil for high-temperature heat-resistance obtained by the manufacturing method
The object is to provide a method of manufacturing electrodeposited copper foil with a carrier foil for high-temperature heat-resistance in which the peeling of the carrier foil is easy even by...
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7211340 |
Thin film structures providing strong basal plane growth orientation and magnetic recording media comprising same
A multiple layer structure comprising a pair of spaced-apart crystalline layers of different materials with an intermediate crystalline layer between and in contact with each of the pair of...
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7172818 |
Copper foil for chip-on-film use, plasma display panel, or high-frequency printed circuit board
A copper foil for chip-on-film use, a plasma display panel, or a high-frequency printed circuit board obtained by rolling copper foil to smooth the surface to give a surface area of not more than...
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7132158 |
Support layer for thin copper foil
A composite material useful for the manufacture of a circuit has a support layer, a metal foil layer having opposing first and second sides and a thickness of 15 microns or less and a release layer...
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7108923 |
Copper foil for printed circuit board with taking environmental conservation into consideration
A copper foil for a printed circuit board has a rust preventing layer formed by a trivalent chromium chemical conversion treatment on a surface of the copper foil that the copper foil is bonded to...
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7097915 |
Separator plate for manufacturing printed circuit board components
A separator plate for the production of printed circuit board components by pressing individual layers, which separator plate includes a metallic core layer and a coating on at least one side of...
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7087315 |
Method for forming plating film
A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a...
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7052779 |
Copper foil for fine pattern printed circuits and method of production of same
Copper foil for fine pattern printed circuits having a sufficient bond strength with a resin substrate, eliminating the problems of residual copper, erosion at the bottom portions of the circuit...
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7052781 |
Flexible copper foil structure and fabrication method thereof
A new copper foil structure with enhanced flexibility and its fabrication method thereof are disclosed. This inventive structure includes a copper base foil having a matte side and shiny side, and...
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7029761 |
Bonding layer for bonding resin on copper surface
A bonding layer for bonding resin is provided that is formed on a copper surface, and contains an alloy of: (a) copper; (b) tin; and (c) at least one type of metal (third metal) selected from the...
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7022419 |
Composite plating film and a process for forming the same
A composite nickel and copper alloy plating film ( 3 ) containing nickel and copper. Nickel is of high wear resistance and a nickel alloy improves the wear resistance of the film. Copper is of high...
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6994917 |
Composite material and method for manufacturing the same
A plate of an expanded metal and two metal plates are overlaid on one another. The expanded metal plate has a plurality of meshes. The linear expansion coefficient of the expanded metal is equal to...
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6989199 |
Copper foil for printed-wiring board and copper-clad laminate using copper foil for printed-wiring board
The object is to provide a copper foil excellent in the property of selective etching between a resistor layer and a copper layer required in production of a printed-wiring board, and also...
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6940721 |
Thermal interface structure for placement between a microelectronic component package and heat sink
A multi-layer thermal interface structure for placement between a microelectronic component package and a heat sink so that the structure has a total thermal resistance of no greater than about...
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6939621 |
Plated copper alloy material and process for production thereof
A plated copper alloy material for connecting terminals is provided which comprises a parent material of copper or copper alloy, a nickel layer and a copper-tin alloy layer. The nickel layer has a...
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6939622 |
Chip-on-film use copper foil
A copper foil having a high etching factor, enabling formation of fine patterns excellent in linearity of bottom lines of circuit patterns and without leaving particles of copper foil forming the...
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6911269 |
Lead-free chemical nickel alloy
Lead-free chemically produced nickel alloy containing nickel, phosphorus, bismuth and antimony, process for the production of such a nickel alloy by externally electroless metal deposition in an...
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6905779 |
Sliding material made of copper alloy, method of producing same, sliding bearing material, and method of producing same
A copper-based sliding material comprising sintered copper or sintered copper alloy, and 0.1 to 5 vol. % hard substance particles harder in hardness than said copper or copper alloy, said hard...
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6902824 |
Copper foil and metal foil with carrier foil for printed wiring board, and semi-additive process for producing printed wiring board using the same
This invention provides a metal foil and an etching process which overcomes the problem of etching of the copper foil layer and the plating copper layer formed on a metal clad laminate during the...
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6893738 |
Electrodeposited copper foil for PCB having barrier layer of Zn-Co-As alloy and surface treatment method of the copper foil
An electrodeposited copper foil to be laminated on an insulation substrate for a printed circuit board, comprising a barrier layer of ternary alloy of Zn—Co—As formed on the copper foil, is...
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6893740 |
CPP type magnetoresistive sensor including pinned magnetic layer provided with hard magnetic region
A magnetoresistive sensor and a method of manufacturing the magnetoresistive sensor are provided, which can effectively increase ΔRA, and which can more easily and reliably bring magnetization of...
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6893742 |
Copper foil with low profile bond enhancement
A composite material, comprising a carrier strip the carrier strip comprising a first side the first side comprising a substantially uniform roughness, an electrolytically deposited copper foil...
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6884520 |
Perpendicular magnetic recording medium and method of manufacturing the same and product thereof
A perpendicular magnetic recording medium has a nonmagnetic substrate, a nonmagnetic underlayer, a magnetic layer, a protective film, and a liquid lubrication layer sequentially laminated on the...
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6878461 |
Surface treatment structure, contact, sliding, fitting-in and ornamental members, and method for manufacturing the same
There is provided contact, sliding, fitting-in and ornamental members having a surface treatment structure in which contact resistance is low, and lubricating property and wear resistance are...
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6872465 |
Solder
In a solder that realizes high-temperature-side solder bonding in temperature-hierarchical bonding, a connection portion between a semiconductor device and a substrate is formed of metal balls made...
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6866765 |
Electrolytic copper-plated R-T-B magnet and plating method thereof
An R-T-B magnet (R is at least one kind of rare-earth elements including Y, and T is Fe or Fe and Co) has an electrolytic copper-plating film where the ratio [I(200)/I(111)] of the X-ray...
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6863991 |
Coated biperiodic metallic mesh arrays with molecular monolayers and lipid bilayers thereon
A coated metallic mesh having a molecular layer thereon comprising: (1) a metallic mesh comprising at least one aperture; (2) a coating disposed on the metallic mesh that at least partially fills...
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6855437 |
Decorative coatings having resistance to corrosion and wear
The subject of the invention is a layer system for the decorative coating of galvanizable work pieces. In order to have a layer system which meets strict requirements with regard to corrosion...
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6852427 |
Chromium-free antitarnish adhesion promoting treatment composition
The present invention is directed to an aqueous, antitarnish and adhesion promoting treatment composition, comprising: zinc ions; metal ions selected from the group consisting of tungsten ions,...
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6852426 |
Hybrid anti-ferromagnetically coupled and laminated magnetic media
A high areal recording density longitudinal magnetic recording medium having improved thermal stability and signal-to-medium noise ratio (“SMNR”), comprises:
(a) a non-magnetic substrate...
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6838191 |
Blanch resistant and thermal barrier NiAl coating systems for advanced copper alloys
A method of forming an environmental resistant thermal barrier coating on a copper alloy is disclosed. The steps include cleansing a surface of a copper alloy, depositing a bond coat on the...
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6835464 |
Thin film device with perpendicular exchange bias
A perpendicular exchange biased device comprises a layer of buffer material on a surface of a substrate, a layer of ferromagnetic material on a surface of the buffer layer, wherein the...
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