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7416789 Refractory metal substrate with improved thermal conductivity  
A substrate for semiconductor and integrated circuit components including: a core plate containing a Group VIB metal from the periodic table of the elements and/or an anisotropic material,...
7413815 Thin laminate as embedded capacitance material in printed circuit boards  
The invention concerns multilayered structures useful for forming capacitors, which may be embedded within printed circuit boards or other microelectronic devices. The multilayered structure...
7393596 Aluminum/ceramic bonding substrate and method for producing same  
When an aluminum plate is bonded directly to a ceramic substrate by cooling and solidifying molten aluminum which is injected into a mold so as to contact the ceramic substrate arranged in the...
7338717 Tool and a method for creating the tool  
A method 10 and a laminated tool 31 which is created by the method 10 and which is formed by the selective coupling or attachment of sectional members, such as members 14, 16 . The formed...
7306860 Protective coating for oxide ceramic based composites  
A layered structure includes a substrate comprising a layer of an oxide/oxide ceramic based composite material, a first oxide layer disposed directly on the substrate and formed from a material...
7297412 Fabrication of stacked microelectronic devices  
Manufacture of stacked microelectronic devices is facilitated by producing subassemblies wherein adhesive pads are applied to the back surfaces of a plurality of microelectronic components in a...
7279230 Hybrid composite materials  
A fiber-reinforced metal-ceramic composite material having a hot ceramic side and a cool metal side and a graded ceramic-metal zone therebetween, wherein the ceramic content of said composite...
7276292 Insulating substrate boards for semiconductor and power modules  
An insulating substrate board for a semiconductor of the present invention comprises a ceramic substrate board ( 2 ) and a metal alloy layer ( 3 ) consisting of aluminum formed on one surface...
7261951 Copper based sintered contact material and double-layered sintered contact member  
With the objectives of alleviating the property of attacking on the mating member by scratching-off of local agglutinates on the sliding contact surface, achieving improved wear resistance, and...
7261942 Photocatalytically-active, self-cleaning aqueous coating compositions and methods  
Method for producing novel photochemically-active metal oxide-containing aqueous compositions such as TiO 2 compositions coated or sprayed and dried under ambient conditions to form novel...
7232615 Coating stack comprising a layer of barrier coating  
A coating composition that contains at least one degradable coating layer and at least one layer of barrier coating is disclosed. The coating composition can be used to make a coated substrate...
7223481 Method of producing ultra-thin copper foil with carrier, ultra-thin copper foil with carrier produced by the same, printed circuit board, multilayer printed circuit board and chip on film circuit board  
An object of the present invention is to produce an ultra-thin copper foil with a carrier which has few pinholes and small surface roughness and which has an the thickness of less than 5 μm, and...
7175938 Battery case employing ring sandwich  
The invention includes a brazed ceramic ring that separates the positive and negative ends of the battery while still providing a leak-tight seal. The ceramic is aluminum oxide or zirconium oxide...
7172820 Strengthened bond coats for thermal barrier coatings  
A strengthened bond coat for improving the adherence of a thermal barrier coating to an underlying metal substrate to resist spallation without degrading oxidation resistance of the bond coat. The...
7166372 Thermal barrier coating utilizing a dispersion strengthened metallic bond coat  
The present invention relates to an overlay coating which has improved strength properties. The overlay coating comprises a deposited layer of MCrAlY material containing discrete nitride particles...
7160631 Zinc-based coated steel sheet having excellent anti-peeling property, frictional property, and anti-galling property and method of manufacturing the same  
The present invention provides for a zinc-based coated steel sheet having a zinc-based coating layer and a lubricant film, which is formed on the zinc-based coating layer, containing zinc phosphate...
7157151 Corrosion-resistant layered coatings  
In general, the present invention provides coating systems and processes for applying a selected coating system on a metallic substrate. The coating system includes two or more coating layers. A...
7147926 Corrosion-resistant and stain-resistant component and method for manufacturing same  
A multi-layer corrosion protection system and a method for applying the multi-layer corrosion protection system. The system comprises a corrosion-resistant layer plated onto a metallic substrate....
7141310 Metal matrix composite structure and method  
Compound preforms are provided having a first region, including a porous ceramic and a second region including a porous or solid ceramic in which the two regions differ in composition. The compound...
7132173 Self-centering braze assembly  
Braze and electrode wire assemblies, e.g., used with an implantable microstimulator, include a wire welded in the through-hole of an electrode, which electrode is brazed to a ceramic case that is...
7129194 Catalyst system with improved corrosion resistance  
An improved catalyst system that includes a metal support structure and an anti-corrosive layer on the metal support structure, and has improved resistance to corrosion and other degradation under...
7087318 Copper based sintered contact material and double-layered sintered contact member  
With the objectives of alleviating the property of attacking on the mating member by scratching-off of local agglutinates on the sliding contact surface, achieving improved wear resistance, and...
7067200 Joined bodies and a method of producing the same  
A joined body and method of producing the joined body are provided. A first member containing at least a ceramic and a second member containing at least one of a metal and a metal composite are...
7056598 Copper based sintered contact material and double-layered sintered contact member  
With the objectives of alleviating the property of attacking on the mating member by scratching-off of local agglutinates on the sliding contact surface, achieving improved wear resistance, and...
7045220 Metal casting fabrication method  
A metal casting fabrication method is provided. In accordance with the method, first a metal plate is disposed in the cavity of molding dies. This metal plate includes a first surface formed with a...
7026059 Copper foil for high-density ultrafine printed wiring boad  
The present invention is to provide an ultra-thin copper foil with a carrier which comprises a release layer, a diffusion preventive layer and a copper electroplating layer laminated in this order,...
7026057 Corrosion and abrasion resistant decorative coating  
A new article of manufacture, for example a faucet or other article of hardware, has a specified decorative color, and is resistant to corrosion, abrasion and attack by chemicals. The article...
7022418 Fabrication of stacked microelectronic devices  
Manufacture of stacked microelectronic devices is facilitated by producing subassemblies wherein adhesive pads are applied to the back surfaces of a plurality of microelectronic components in a...
7022415 Layered sphere braze material  
The invention is a method of bonding a ceramic part ( 6 ) to a metal part ( 4 ) by heating a component assembly ( 2 ) comprised of the metal part ( 4 ), the ceramic part ( 6 ), and a thin laminated...
6998180 Package with a substrate of high thermal conductivity  
A package is configured as a composite component with a substrate, at least one semiconductor component, and an enclosure, which are joined to one another. The heat-dissipating substrate is a...
6989200 Ceramic to noble metal braze and method of manufacture  
The invention is a method of bonding a ceramic part to a metal part by heating a component assembly comprised of the metal part, the ceramic part, and a compatible interlayer material such as...
6984456 Flexible printed wiring board for chip-on flexibles  
There is provided a flexible printed wiring board including an insulating layer having a high optical transmittance, a high adhesion strength and a high migration resistance, and suitable for a...
6982047 Surface-treated ultrafine metal powder, method for producing the same, conductive metal paste of the same, and multilayer ceramic capacitor using said paste  
The present invention improves the oxidation resistance of an ultrafine metal powder for use in the internal electrode of a multilayer ceramic capacitance and suppresses an increase in the...
6979497 Electro-conductive metal plated polyimide substrate  
An electro-conductive metal plated polyimide substrate is composed of an aromatic polyimide substrate, a subbing metal layer of Mo—Ni alloy (in which a weight ratio of Mo to Ni is 75/25 to 99/1,...
6974635 Package for electronic component, lid material for package lid, and production method for lid material  
A lid material is provided which comprises: a core layer composed of an Fe—Ni alloy or an Fe—Ni—Co alloy; a nickel-based (Ni-based) metal layer press- and diffusion-bonded onto the core layer...
6967183 Electrocatalyst powders, methods for producing powders and devices fabricated from same  
Electrocatalyst powders and methods for producing electrocatalyst powders, such as carbon composite electrocatalyst powders. The powders have a well-controlled microstructure and morphology. The...
6933059 Electrostatic shielding, low charging-retaining moisture barrier film  
A film material for use in packaging electrostatically sensitive components and corrosion sensitive components. The film material includes a static dissipative polymer attached to a first moisture...
6896976 Tin antimony solder for MOSFET with TiNiAg back metal  
A semiconductor device is disclosed containing a semiconductor die having a trimetal electrode soldered to a substrate by a Sn—Sb solder.
6887561 Methods and producing conductor layers on dielectric surfaces  
A method for producing conductor coating on dielectric surface may be used in many areas of industry for preparation of dielectric surfaces for selective electroplating. Using this method,...
6884522 Metal matrix composite structure and method  
Compound preforms are provided having a first region, including a porous ceramic and a second region including a porous or solid ceramic in which the two regions differ in composition. The compound...
6881499 Bonded member comprising different materials and production method thereof  
A bonded member includes a ceramic base material and a metal member solid-phase bonded via a soldering material. An active metal is placed on a surface of the ceramic base material and the...
6881498 Surface process involving isotropic superfinishing  
A surface processing method and power transmission component includes refining a surface region of a metal from a first roughness to a second roughness less than the first roughness. A solid...
6869689 Joined structures of metal terminals and ceramic members, joined structures of metal members and ceramic members, and adhesive materials  
A joined structure of a metal terminal and a ceramic member has a joining layer between the terminal and the ceramic member. The joining layer has a metal adhesive layer containing at least indium...
6866943 Bond pad structure comprising tungsten or tungsten compound layer on top of metallization level  
A bond pad structure formed over a predetermined area of an IC substrate comprising quickly and easily removable redundancy and passivation layers upon lithography and plasma etching in a plasma...
6858050 Reducing metals as a brazing flux  
The present invention comprises a method of manufacturing a brazed body. The method comprises forming a multi-layer assembly comprising: a first material capable of forming a first oxide and having...
6846574 Honeycomb structure thermal barrier coating  
A device having an improved thermal barrier coating ( 46 ) and a process for manufacturing the same. A support structure ( 28 ) for retaining a ceramic insulating material ( 46 ) on a substrate (...
6844085 Copper based sintered contact material and double-layered sintered contact member  
With the objectives of alleviating the property of attacking on the mating member by scratching-off of local agglutinates on the sliding contact surface, achieving improved wear resistance, and...
6830827 Alloy coating, method for forming the same, and member for high temperature apparatuses  
Disclosed is an alloy coating which can be advantageously applied to members for high temperature apparatuses so as to prolong the service life of the members. The alloy coating comprises an alloy....
6828039 Magnetoresistive sensor and manufacturing method therefor  
A magnetoresistive sensor including a lower electrode layer, a nanotube structure film composed of an insulator matrix and a plurality of nanotubes dispersively arranged in the insulator matrix, a...
6818320 Welding method for welded members subjected to fluoride passivation treatment, fluoride passivation retreatment method, and welded parts  
A welding method for materials to be welded which are subjected to fluoride passivation treatment, and a fluoride passivation retreatment method, wherein, when fluoride passivation retreatment is...
Matches 1 - 50 out of 523 1 2 3 4 5 6 7 8 9 10 11 >