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8916675 Polymer and polymerization method  
A method for forming a polymer comprising the polymerization of a plurality of monomers, wherein at least one of the plurality of monomers is one or both of: a charge transporting unit and a...
8822045 Passivation of aluminum nitride substrates  
The present invention provides methods of protecting a surface of an aluminum nitride substrate. The substrate with the protected surface can be stored for a period of time and easily activated to...
8766107 Through-hole-vias in multi-layer printed circuit boards  
Example multi-layer printed circuit boards (‘PCBs’) are described as well as methods of making and using such PCBs that include layers of laminate; at least one via hole traversing the layers of...
8658911 Through-hole-vias in multi-layer printed circuit boards  
Example multi-layer printed circuit boards (‘PCBs’) are described as well as methods of making and using such PCBs that include layers of laminate; at least one via hole traversing the layers of...
8647485 Process kit shield for plasma enhanced processing chamber  
Apparatus for processing substrates is disclosed herein. In some embodiments, an apparatus includes a first shield having a first end, a second end, and one or more first sidewalls disposed...
8618795 Sensor assembly for use in medical position and orientation tracking  
A sensor assembly is provided for use in tracking a medical device. The sensor assembly comprises a magnetoresistance sensor capable of providing position and orientation information. In certain...
8614007 Thin film semiconductor material produced through reactive sputtering of zinc target using nitrogen gases  
The present invention generally comprises a semiconductor film and the reactive sputtering process used to deposit the semiconductor film. The sputtering target may comprise pure zinc (i.e.,...
8580092 Adjustable process spacing, centering, and improved gas conductance  
Embodiments of the invention generally provide a process kit for use in a physical deposition chamber (PVD) chamber. In one embodiment, the process kit provides adjustable process spacing,...
8518561 Antireflection structures with an exceptional low refractive index and devices containing the same  
Nanoporous polymers with gyroid nanochannels can be fabricated from the self-assembly of degradable block copolymer, polystyrene-b-poly(L-lactide) (PS-PLLA), followed by the hydrolysis of PLLA...
8404359 Solder layer and electronic device bonding substrate and submount using the same  
A solder layer and an electronic device bonding substrate using the layer are provided which avoid deteriorating qualities of the electronic device to be bonded. In a solder layer 14 free from...
8241421 Epitaxial wafer and production method thereof  
The epitaxial layer defects generated from voids of a silicon substrate wafer containing added hydrogen are suppressed by a method for producing an epitaxial wafer by: growing a silicon crystal by...
8222171 Method for the production of a ceramic substrate, and a ceramic substrate  
A method for the production of a ceramic substrate for a semiconductor component, includes the steps of producing paper containing at least cellulose fibers, as well as a filler to be carbonized...
8182929 Solar absorptive material for a solar selective surface coating  
The present invention provides a solar absorptive material for a solar selective surface of an absorber of solar radiation. The solar absorptive material comprises a dispersed metallic material...
8143164 Formation of a zinc passivation layer on titanium or titanium alloys used in semiconductor processing  
Embodiments of the current invention describe methods of processing a semiconductor substrate that include applying a zincating solution to the semiconductor substrate to form a zinc passivation...
8138303 Polymers  
The present invention relates to novel polymers comprising a repeating unit of the formula (I) and their use in electronic devices. The polymers according to the invention have excellent...
7972683 Wafer bonding material with embedded conductive particles  
A material for bonding a first wafer to a second wafer, which includes an insulating adhesive with conductive particles embedded in the adhesive substance. When the adhesive is applied and melted...
7935430 Bonding structure of substrate and component and method of manufacturing the same  
A bonding structure and method of manufacturing the same are provided. The bonding structure of a substrate and a component include an electrode formed of metal powder and a resin component on the...
7927713 Thin film semiconductor material produced through reactive sputtering of zinc target using nitrogen gases  
The present invention generally comprises a semiconductor film and the reactive sputtering process used to deposit the semiconductor film. The sputtering target may comprise pure zinc (i.e.,...
7879455 High-temperature solder, high-temperature solder paste and power semiconductor using same  
The present invention intends to provide a power semiconductor device using a high-temperature lead-free solder material, the high-temperature lead-free solder material having the heat resistant...
7776993 Underfilling with acid-cleavable acetal and ketal epoxy oligomers  
A reworkable thermoset epoxy-containing material that allows for a reworkable assembly such as a reworkable waferlevel underfilled microelectronic package. A method for using the reworkable...
7722962 Solder foil, semiconductor device and electronic device  
A solder foil formed from a material comprising particles of Cu, etc. as metal particles and Sn particles as solder particles by rolling is suitable for solder bonding at a high temperature side...
7648775 Ceramic substrate, ceramic package for housing light emitting element  
A ceramic substrate comprising a metallic layer on its surface, wherein said metallic layer includes: a silver layer containing silver; a gold layer containing gold; and a nickel layer containing...
7632352 Spin-coating apparatus and coated substrates prepared using the same  
Provided is a spin coating apparatus having a ring-shaped or polygonal auxiliary member for use in manufacture of a coated substrate via spin coating, wherein the auxiliary member is positioned...
7560172 Low voltage CMOS structure with dynamic threshold voltage  
A method for dynamically varying a threshold voltage of a complimentary metal oxide semiconductor (CMOS) includes providing a substrate pickup formed a semiconductor material type which is...
7547412 Composite material, method for producing same and member using same  
A composite material is a Mo—Cu based composite material having a Cu content of 30 to 70 weight % and containing a copper pool phase and an Mo—Cu based composite phase. The copper pool phase is...
RE40725 Magnetic body formed by quantum dot array using non-magnetic semiconductor  
A practically realizable semiconductor magnetic body having a flat-band structure is disclosed. The semiconductor magnetic body is formed by semiconductor quantum dots arranged on lattice points...
7534488 Graded core/shell semiconductor nanorods and nanorod barcodes  
Disclosed herein is a graded core/shell semiconductor nanorod having at least a first segment of a core of a Group II-VI, Group III-V or a Group IV semiconductor, a graded shell overlying the...
7521122 Laminated sheet  
A laminated sheet for adhering to a circuit side of a projected electrode-mounting wafer in a step of grinding a backside of the wafer, wherein the laminated sheet comprises at least a layer...
7416789 Refractory metal substrate with improved thermal conductivity  
A substrate for semiconductor and integrated circuit components including: a core plate containing a Group VIB metal from the periodic table of the elements and/or an anisotropic material, having...
7413974 Copper-metallized integrated circuits having electroless thick copper bond pads  
A metal structure (100) for a contact pad of a semiconductor, which has interconnecting traces of a first copper layer (102). The substrate is protected by an insulating overcoat (104). The first...
7390568 Semiconductor nanocrystal heterostructures having specific charge carrier confinement  
A semiconductor nanocrystal heterostructure has a core of a first semiconductor material surrounded by an overcoating of a second semiconductor material. Upon excitation, one carrier can be...
7361963 Optical film  
An optical film which enables desired optical properties to be obtained easily, and enables the durability to be improved. A metal film 32 is formed on an inner major surface 12a of a glass...
7354649 Semiconductor workpiece  
The present invention provides an apparatus and method for use in processing semiconductor workpieces. The new apparatus and method allows for the production of thinner workpieces that at the same...
7329896 Polymerizable charge transport compounds  
The invention relates to polymerizable charge transport compounds, their use as semiconductors or charge transport materials, in optical, electrooptical or electronic devices like for example...
7276292 Insulating substrate boards for semiconductor and power modules  
An insulating substrate board for a semiconductor of the present invention comprises a ceramic substrate board (2) and a metal alloy layer (3) consisting of aluminum formed on one surface portion...
7268021 Lead frame and method of manufacturing the same  
A lead frame having a structure that can discharge hydrogen adsorbed during deposition and can reduce a galvanic potential difference between plating layers and a method of manufacturing the same...
7189795 Poly(arylene ether)s bearing grafted hydroxyalkyls for use in electrically conductive adhesives  
A poly(arylene ether) polymer includes polymer repeat units of the following structure: —(O—Ar1—O—Ar2)m—(O—Ar3—O—Ar4)n— where Ar1, Ar2, Ar3, and Ar4 are identical or different aryl radicals, m is...
7141310 Metal matrix composite structure and method  
Compound preforms are provided having a first region, including a porous ceramic and a second region including a porous or solid ceramic in which the two regions differ in composition. The...
7095125 Semiconductor encapsulating epoxy resin composition and semiconductor device  
A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, (D-i) an organopolysiloxane, (D-ii)...
7087316 Low-expansion unit, method of manufacturing the same and semiconductor provided with the same  
A low-expansion unit includes a plate member and an iron-nickel layer. Upper and lower surface layers of the plate member each have the iron-nickel layer thereon and/or therein. While the plate...
7078109 Heat spreading thermal interface structure  
The thermal interface structure of the present invention is suited for use in a non-referenced die system between a heat source and heat sink spaced up to 300 mils apart and comprises a plurality...
7074480 Porous body and method of manufacturing the same  
A nanostructure is a porous body comprising a plurality of pillar-shaped pores and a region surrounding them, said region being an oxide amorphous region formed so as to contain C, Si, Ge or a...
7067200 Joined bodies and a method of producing the same  
A joined body and method of producing the joined body are provided. A first member containing at least a ceramic and a second member containing at least one of a metal and a metal composite are...
7049004 Index tunable thin film interference coatings  
According to various embodiments and aspects of the present invention, there is provided a dynamically tunable thin film interference coating including one or more layers with thermo-optically...
7037559 Immersion plating and plated structures  
A first metal is plated onto a substrate comprising a second metal by immersing the substrate into a bath comprising a compound of the first metal and an organic diluent. The second metal is more...
7037597 Copper foil for printed-wiring board  
It is an object of the present invention to provide a surface-treated copper foil wherein a surface layer which is situated on a side being not bonded to a resin in a copper foil for a...
7037581 Conductive silicon composite, preparation thereof, and negative electrode material for non-aqueous electrolyte secondary cell  
A conductive silicon composite in which particles of the structure that silicon crystallites are dispersed in silicon dioxide are coated on their surfaces with carbon affords satisfactory cycle...
7037399 Underfill encapsulant for wafer packaging and method for its application  
A curable underfill encapsulant composition that is applied directly onto semiconductor wafers before the wafers are diced into individual chips. The composition comprises a thermally curable...
7006354 Heat radiating structure for electronic device  
A heat radiating structure for an electronic device, for cooling an electronic part by transferring the heat generated in the electronic part to a heat spreader has a grading layer, which is...
6998180 Package with a substrate of high thermal conductivity  
A package is configured as a composite component with a substrate, at least one semiconductor component, and an enclosure, which are joined to one another. The heat-dissipating substrate is a...