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7560172 |
Low voltage CMOS structure with dynamic threshold voltage
A method for dynamically varying a threshold voltage of a complimentary metal oxide semiconductor (CMOS) includes providing a substrate pickup formed a semiconductor material type which is...
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7547412 |
Composite material, method for producing same and member using same
A composite material is a Mo—Cu based composite material having a Cu content of 30 to 70 weight % and containing a copper pool phase and an Mo—Cu based composite phase. The copper pool phase is...
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RE40725 |
Magnetic body formed by quantum dot array using non-magnetic semiconductor
A practically realizable semiconductor magnetic body having a flat-band structure is disclosed. The semiconductor magnetic body is formed by semiconductor quantum dots arranged on lattice points...
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7534488 |
Graded core/shell semiconductor nanorods and nanorod barcodes
Disclosed herein is a graded core/shell semiconductor nanorod having at least a first segment of a core of a Group II-VI, Group III-V or a Group IV semiconductor, a graded shell overlying the core,...
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7521122 |
Laminated sheet
A laminated sheet for adhering to a circuit side of a projected electrode-mounting wafer in a step of grinding a backside of the wafer, wherein the laminated sheet comprises at least a layer (layer...
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7416789 |
Refractory metal substrate with improved thermal conductivity
A substrate for semiconductor and integrated circuit components including:
a core plate containing a Group VIB metal from the periodic table of the elements and/or an anisotropic material,...
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7413974 |
Copper-metallized integrated circuits having electroless thick copper bond pads
A metal structure ( 100 ) for a contact pad of a semiconductor, which has interconnecting traces of a first copper layer ( 102 ). The substrate is protected by an insulating overcoat ( 104 ). The...
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7390568 |
Semiconductor nanocrystal heterostructures having specific charge carrier confinement
A semiconductor nanocrystal heterostructure has a core of a first semiconductor material surrounded by an overcoating of a second semiconductor material. Upon excitation, one carrier can be...
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7361963 |
Optical film
An optical film which enables desired optical properties to be obtained easily, and enables the durability to be improved. A metal film 32 is formed on an inner major surface 12 a of a glass...
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7354649 |
Semiconductor workpiece
The present invention provides an apparatus and method for use in processing semiconductor workpieces. The new apparatus and method allows for the production of thinner workpieces that at the same...
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7329896 |
Polymerizable charge transport compounds
The invention relates to polymerizable charge transport compounds, their use as semiconductors or charge transport materials, in optical, electrooptical or electronic devices like for example...
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7276292 |
Insulating substrate boards for semiconductor and power modules
An insulating substrate board for a semiconductor of the present invention comprises a ceramic substrate board ( 2 ) and a metal alloy layer ( 3 ) consisting of aluminum formed on one surface...
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7268021 |
Lead frame and method of manufacturing the same
A lead frame having a structure that can discharge hydrogen adsorbed during deposition and can reduce a galvanic potential difference between plating layers and a method of manufacturing the same...
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7189795 |
Poly(arylene ether)s bearing grafted hydroxyalkyls for use in electrically conductive adhesives
A poly(arylene ether) polymer includes polymer repeat units of the following structure:
—(O—Ar 1 —O—Ar 2 ) m —(O—Ar 3...
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7141310 |
Metal matrix composite structure and method
Compound preforms are provided having a first region, including a porous ceramic and a second region including a porous or solid ceramic in which the two regions differ in composition. The compound...
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7095125 |
Semiconductor encapsulating epoxy resin composition and semiconductor device
A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, (D-i) an organopolysiloxane, (D-ii) an...
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7087316 |
Low-expansion unit, method of manufacturing the same and semiconductor provided with the same
A low-expansion unit includes a plate member and an iron-nickel layer. Upper and lower surface layers of the plate member each have the iron-nickel layer thereon and/or therein. While the plate...
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7078109 |
Heat spreading thermal interface structure
The thermal interface structure of the present invention is suited for use in a non-referenced die system between a heat source and heat sink spaced up to 300 mils apart and comprises a plurality...
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7074480 |
Porous body and method of manufacturing the same
A nanostructure is a porous body comprising a plurality of pillar-shaped pores and a region surrounding them, said region being an oxide amorphous region formed so as to contain C, Si, Ge or a...
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7070855 |
Porous material and production process thereof
There are provided a porous material and a process for producing the same. The porous material has a plurality of columnar pores and an area surrounding the pores, and the area is an amorphous area...
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7067200 |
Joined bodies and a method of producing the same
A joined body and method of producing the joined body are provided. A first member containing at least a ceramic and a second member containing at least one of a metal and a metal composite are...
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7049004 |
Index tunable thin film interference coatings
According to various embodiments and aspects of the present invention, there is provided a dynamically tunable thin film interference coating including one or more layers with thermo-optically...
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7037597 |
Copper foil for printed-wiring board
It is an object of the present invention to provide a surface-treated copper foil wherein a surface layer which is situated on a side being not bonded to a resin in a copper foil for a...
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7037581 |
Conductive silicon composite, preparation thereof, and negative electrode material for non-aqueous electrolyte secondary cell
A conductive silicon composite in which particles of the structure that silicon crystallites are dispersed in silicon dioxide are coated on their surfaces with carbon affords satisfactory cycle...
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7037559 |
Immersion plating and plated structures
A first metal is plated onto a substrate comprising a second metal by immersing the substrate into a bath comprising a compound of the first metal and an organic diluent. The second metal is more...
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7037399 |
Underfill encapsulant for wafer packaging and method for its application
A curable underfill encapsulant composition that is applied directly onto semiconductor wafers before the wafers are diced into individual chips. The composition comprises a thermally curable epoxy...
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7006354 |
Heat radiating structure for electronic device
A heat radiating structure for an electronic device, for cooling an electronic part by transferring the heat generated in the electronic part to a heat spreader has a grading layer, which is...
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6998180 |
Package with a substrate of high thermal conductivity
A package is configured as a composite component with a substrate, at least one semiconductor component, and an enclosure, which are joined to one another. The heat-dissipating substrate is a...
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6974531 |
Method for electroplating on resistive substrates
A conductive material is electroplated onto a platable resistive metal barrier layer(s) employing a plating bath optionally comprising a super filling additive and a suppressor, and by changing the...
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6958194 |
Imager with improved sensitivity
An imaging cell reduces recombination losses and increases sensitivity by forming a low resistance lateral path with a silicon germanium layer of a conductivity type that is sandwiched between...
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6935554 |
Metal/ceramic bonding article and method for producing same
There is provided a method for producing a metal/ceramic bonding article, the method including the steps of: arranging a metal plate 12 of an overall-rate solid solution type alloy on a ceramic...
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6919420 |
Acid-cleavable acetal and ketal based epoxy oligomers
Reworkable thermoset acid-cleavable acetal and ketal based epoxy oligomers can be B-staged into a tack free state. Compositions containing the epoxy oligomers are employed in a reworkable assembly...
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6916522 |
Charge-giving body, and pattern-formed body using the same
A main object of the present invention is to provide a charge-giving body capable of forming a pattern having a minute structure on a surface of a semiconductor by a simple process; and a minute...
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6903338 |
Method and apparatus for reducing substrate edge effects in electron lenses
One embodiment disclosed pertains to a method for inspecting a substrate. The method includes inserting the substrate into a holding place of a substrate holder, moving the substrate holder under...
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6893736 |
Thermosetting resin compositions useful as underfill sealants
The present invention provides a thermosetting resin composition useful as a highly filled low CTE underfilling sealant composition which completely fills the underfill space in a semiconductor...
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6884522 |
Metal matrix composite structure and method
Compound preforms are provided having a first region, including a porous ceramic and a second region including a porous or solid ceramic in which the two regions differ in composition. The compound...
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6869702 |
Substrate for epitaxial growth
A substrate for epitaxial growth allowing formation of an Al-containing group III nitride film having high crystal quality is provided. A nitride film containing at least Al is formed on a 6H—SiC...
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6869671 |
Enabling nanostructured materials via multilayer thin film precursor and applications to biosensors
A thin film based nanoporous alumina template has been developed which allows the in situ removal of an electrically insulating alumina barrier layer at the pore bases. This barrier free nanoporous...
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6855952 |
Semiconductor device and semiconductor package
A semiconductor device wherein a resin containing as a cross-linking component a compound having a plurality of styrene group and represented by chemical formula [1] is used as an insulating...
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6844084 |
Spinel substrate and heteroepitaxial growth of III-V materials thereon
A spinel composition of the invention includes a monocrystalline lattice having a formula Mg 1-w α w Al x-y β y O z , where w is greater than 0 and less than 1, x is greater than 2 and less than...
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6841273 |
Silicon/silicon carbide composite and process for manufacturing the same
The present invention provides a silicon/silicon carbide composite and having a high quality in avoiding warp or breakage and in a corrosion resistance, a durability, a heat shock resistance and...
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6835246 |
Nanostructures for hetero-expitaxial growth on silicon substrates
Selected micro- and nanoscale, 1-dimensional and 2-dimensional periodic and random structures generated on silicon and other substrates are expected to perform as compliant, thin films for...
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6833570 |
Structure comprising an insulated part in a solid substrate and method for producing same
A structure having a first part and at least one second part. The second part is electrically insulated from the first part and the parts are formed in the same wafer of a material. The first and...
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6830825 |
Epoxy resin composition and semiconductor device
An epoxy resin composition for encapsulation of semiconductors which contains substantially no halogen-based flame retarding agents or antimony compounds having properties of moldability, flame...
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6818319 |
Diffusion barrier multi-layer structure for thin film transistor liquid crystal displays and process for fabricating thereof
A diffusion barrier multi-layer structure for a TFT LCD by the LTPS process and the process for fabricating thereof are disclosed. By increasing the coarseness between two layers of the diffusion...
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6818318 |
Underfill sealant of epoxy resins, adhesion promotor and curative of N-containing compound and transition metal complex
Thermosetting resin compositions useful as underfill sealants for mounting semiconductor devices onto a circuit board are provided, which include epoxy resins, an adhesion promoter having at least...
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6815084 |
Discontinuous high-modulus fiber metal matrix composite for thermal management applications
The invention includes the use of a high-modulus fiber metal matrix composite material as a backing plate for physical vapor deposition targets, as a lid for microelectronics packages, as a heat...
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6814832 |
Method for transferring element, method for producing element, integrated circuit, circuit board, electro-optical device, IC card, and electronic appliance
A peeling layer 2 is formed on an element-forming substrate 1 , an element-forming layer 3 including an electrical element is formed on the peeling layer, the element-forming layer is joined...
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6811892 |
Lead-based solder alloys containing copper
A tin-lead solder alloy containing copper and optionally silver as its alloying constituents. The solder alloy consists essentially of, by weight, about 55% to about 75% tin, about 11% to about 44%...
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6811671 |
Method of controlling zinc-doping in a copper-zinc alloy thin film electroplated on a copper surface and a semiconductor device thereby formed
A method of fabricating a semiconductor device, having a reduced-oxygen Cu—Zn alloy thin film ( 30 ) electroplated on a Cu surface ( 20 ) by electroplating, using an electroplating apparatus, the...
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