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7070864 |
Laminate for electronic materials
This invention relates to a laminate which is excellent in heat resistance after moisture absorption required in a lead-free solder joint, and is suitable for use in flexible printed wiring boards...
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7067193 |
Structure and method for improved adhesion between two polymer films
A method for improving the adhesion between polyimide layers and the structure formed by the method. A silicon oxide-containing layer is formed on the surface of a polyimide layer and a second...
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7067566 |
TRIAZINE RING BASED POLYMERS FOR PHOTOINDUCED LIQUID CRYSTAL ALIGNMENT, LIQUID CRYSTAL ALIGNMENT LAYER CONTAINING THE SAME, LIQUID CRYSTAL ELEMENT USING THE ALIGNMENT LAYER AND METHOD OF MANUFACTURING THE SAME
Triazine ring based polymers for photoinduced liquid crystal alignment introduces photoactive groups for inducing, reinforcing, improving and preserving liquid crystal alignment, for example...
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7060784 |
Polyimide precursor resin solution composition sheet
A polyimide precursor resin solution composition sheet having a solvent content of 1–50% by weight and a thickness of 1–10 microns has improved adhesion, forms a heat resistant polyimide layer...
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7056584 |
Bond layer for coatings on plastic substrates
An article of a plastic substrate and a bond layer of a plasma polymerized cyclosiloxane having select unsaturation and a method of forming same.
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7041378 |
Heating system
A heating system employs a ceramic substrate and a resistive layer. The resistive layer includes a thermally stable resin, which is filled with a conductive material. A method of manufacturing such...
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7041365 |
Static dissipative optical construction
An optical construction that is static-dissipative and includes a static-dissipative layer buried within optical material.
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7041773 |
Polyimide sulfones, method and articles made therefrom
Polyimide sulfone resins are provided with a glass transition temperature of from 200–350° C., residual volatile species concentration of less than 500 ppm and a total reactive end group...
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7033675 |
Polyarlketone resin film and a laminate thereof with metal
A film of a resin composition comprising total 100 parts by weight of a crystalline polyarylketone resin (A) and a noncrystalline polyetherimide resin (B), and 5 to 50 parts by weight of a filler,...
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7034098 |
Photoactive polymer
A photoactive side-chain polymer from the class of polyimides, polyamide acids and esters thereof, comprising as a side-chain a dendritic block incorporating photoactive groups at its surface. The...
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7030170 |
Photosensitive resin composition, dry film, and workpiece using the same
A photosensitive resin composition which contains (A) polyamic acid, (B) (meth)acrylate having at least two photopolymerizable C═C unsaturated double bonds, (C) a photopolymerization initiator...
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7026032 |
Polyimide based compositions useful as electronic substrates, derived in part from (micro-powder) fluoropolymer, and methods and compositions relating thereto
The present invention is a polymeric composite comprising a polyimide component and a fluoropolymer component derived from a micro powder. The fluoropolymer micro powder has a melt point between...
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7026036 |
Single coat non-stick coating system and articles coated with same
Single coat coating systems ( 22 ), as well as articles coated with such non-stick coating systems, are provided. The single coat system includes a fluoropolymer copolymer ( 14 a ), such as...
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7022809 |
Polyimides for anchoring liquid crystals, display devices including same and method for the preparation of said devices
The present invention relates to novel polyimides derived from 6FDA and from 3,3-dihydroxy-4,4′-diaminobiphenyl and novel polyimides derived from PMDA and from Bis-AP-AF, having alkyl, arylalkyl,...
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7022402 |
Dielectric substrates comprising a polymide core layer and a high temperature fluoropolymer bonding layer, and methods relating thereto
An asymmetric multi-layer insulative film of improved internal adhesive strength is made by combining a layer of polyimide and a high-temperature bonding layer, the high-temperature bonding layer...
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7018718 |
Adhesive film for underfill and semiconductor device using the same
An adhesive film for underfill excellent in relaxation effect of the stress generated in the above semiconductor element and the wiring circuit board and in the connecting electrode parts and also...
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7019103 |
Polyamic acid oligomer, polyimide oligomer, solution composition, and fiber-reinforced composite material
A terminal-crosslinkable polyamic acid oligomer having 1) heat resistance indicated by Tg of 300° C. or more and a pyrolysis temperature of 500° C. or more, 2) toughness, and 3) capability of...
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7015304 |
Solvent free low-melt viscosity imide oligomers and thermosetting polyimide composites
This invention relates to the composition and a solvent-free process for preparing novel imide oligomers and polymers specifically formulated with effective amounts of a dianhydride such as...
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7005165 |
Photosensitive polyimides for optical alignment of liquid crystals
The present invention provides novel polyamic acids and polyimide optical alignment layers for inducing alignment of a liquid crystal medium. The novel compositions comprise reactive diamines...
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7005163 |
Organic-inorganic hybrid film material and its fabrication
The present invention relates to an organic-inorganic hybrid film material consisting of polyamide and either polysilsesquioxane or silicon alkoxide and to a process for producing the...
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6997974 |
High strength and ultra-efficient oil coalescer
A coalescing assembly for coalescing entrained oil from a high temperature, high velocity gas stream comprises a coalescing element of compacted high temperature polyamide fibers, such as those...
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6991874 |
Compositions suitable for electrochemical cells
The compositions comprise:
(a) from 1 to 99% by weight of a pigment (I) having a primary particle size of from 5 nm to 100 μm which is a solid Ia or a compound Ib which acts as cathode...
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6991834 |
Materials for inducing alignment of liquid crystals and liquid crystal optical elements
The present invention provides novel polyamic acids and polyimide optical alignment layers for inducing alignment of a liquid crystal medium. The novel compositions comprise crosslinking diamines...
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6984714 |
Siloxane-modified polyimide resin
This invention relates to a siloxane-modified polyimide resin which shows excellent adhesiveness and can be bonded by thermocompression at high temperature even after subjection to thermal...
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6979721 |
Substituted cyclohexene endcaps for polymers with thermal-oxidative stability
This invention relates to polyimides having improved thermal-oxidative stability, to the process of preparing said polyimides, and the use of polyimide prepolymers in the preparation of prepregs...
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6979479 |
Flexible material for lighter-than-air vehicles
A laminate material for lighter-than-air vehicles includes a liquid crystal polymer fiber layer, a polyimide layer secured to the liquid crystal polymer fiber layer; and a polyvinylidene fluoride...
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6974620 |
Polyester film for heat-resistant capacitor, metallized film thereof, and heat-resistant film capacitor containing the same
A polyester film for use in a capacitor having high heat resistance, which consists of a biaxially oriented film containing a polyester (A) as a main component and a polyimide (B) and has a glass...
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6958192 |
Polyimides from 2,3,3′,4′-biphenyltetracarboxylic dianhydride and aromatic diamines
The present invention relates generally to polyimides. It relates particularly to novel polyimides prepared from 2,3,3′,4′-biphenyltetracarboxylic dianhydride and aromatic diamines. These novel...
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6956098 |
High modulus polyimide compositions useful as dielectric substrates for electronics applications, and methods relating thereto
The substrates of the present invention comprise a polyimide base polymer derived at least in part from collinear monomers together with crankshaft monomers. The resulting polyimide material has...
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6949619 |
Phenolic hydroxyl-bearing polyimide resin, making method and polyimide resin composition
A polyimide resin having phenolic hydroxyl radicals in its skeleton is prepared using a diamine bearing an aromatic ring having an amino radical attached thereto and another aromatic ring having a...
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6949296 |
Polyimide substrates having enhanced flatness, isotropy and thermal dimensional stability, and methods and compositions relating thereto
The substrates of the present invention comprise a polyimide base polymer derived at least in part from non-rigid rod monomers together with optionally rigid rod monomers where the substrates are...
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6939614 |
Image-fixing member, image-fixing apparatus and image-forming apparatus using the same
The present invention is directed to an image-fixing member which has excellent heat-resistance, wear resistance, and mold releasability and which performs heating or pressurizing for fixing an...
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6927006 |
Fuser member having fluorocarbon outer layer
A fuser member having a polyimide substrate, and thereover, an outer layer with from about 61 to about 99 volume percent fluorocarbon.
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6924024 |
Copper-clad laminate
A copper-clad laminate is composed of a copper foil and an aromatic polyimide film placed thereon, in which the copper foil is bonded to the polyimide film at a bonding strength of ≧500 N/m and...
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6924348 |
Polyamide acid and polyimide, and optical material
A polyimide excelling in heat resistance, chemical resistance, water repellency, dielectric characteristics, electrical characteristics, and optical characteristics and a polyamide acid useful as...
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6919422 |
Polyimide resin with reduced mold deposit
A polyimide composition and a process to prepare polyimide resins with reduced plate out and mold deposits is described. During resin molding operations the low plate out resins show a longer...
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6916544 |
Laminate type materials for flexible circuits or similar-type assemblies and methods relating thereto
A laminate having improved resistance to separation failure when incorporated into a flexible circuit structure. The laminate comprising a highly bondable polyimide and is preferably formed from a...
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6914019 |
Clothing element
A clothing element includes a carrier of a form that conforms to a portion of a body surface and an adherent coating made of titanium or of a titanium alloy and/or titanium compound located on one...
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6911240 |
Fixing member, method for producing it, and image forming apparatus comprising the fixing member
In a fixing member ( 10 ) in which an elastic layer made of heat-resistance synthetic rubber and a releasing layer made of fluorocarbon resin are sequentially provided on a substrate, a melting...
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6908685 |
Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrate
The invention provides a polyimide film manufactured from a polyamic acid prepared from pyromellitic dianhydride in combination with 10 to 60 mol % of phenylenediamine and 40 to 90 mol % of...
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6887580 |
Adhesive polyimide resin and adhesive laminate
An adhesive polyimide resin which comprises a siloxane polyimide resin obtained from (A) an aromatic tetracarboxylic dianhydride and (B) a diamine ingredient comprising (B1) a diamine having a...
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6887525 |
Insulation material for use in high-frequency electronic parts
To provide an insulating material that has low dielectric constant and low dielectric loss tangent, and is superior in its processability into thin film. An insulating material for use in...
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6875498 |
Transfix component with layer having polymer matrix with small molecules and image forming apparatus with same
A transfix member comprising a heating member and a component film having a surface layer and a polymer matrix layer, wherein the polymer matrix layer contains a polymer and small molecules, and...
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6875519 |
Two-layer copper polyimide substrate
A two-layer copper polyimide substrate includes a modified layer on the surface of a polyimide film having a thickness of not more than 200 Å, and preferably not less than 50 Å, as evaluated by...
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6872457 |
Atomic oxygen-resistant film
An atomic oxygen-resistant film comprising an atomic oxygen-resistant film formed on a polyimide film, wherein the mass reduction rate thereof is no greater than 1.0% when irradiated with atomic...
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6869682 |
Polyolefin polymer and catalyst blend for bonding fluoropolymers
The invention relates to compositions useful for bonding fluoropolymer to substantially non-fluorinated polymer. The compositions of the invention comprise a substantially non-fluorinated polymer...
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6863980 |
Monolithic composite firewall
A ceramic fabric and a resin are combined to form a fire protection sheet capable of being co-cured onto a parent laminate structure. The resulting monolithic composite firewall shows fire...
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6863974 |
Multilayer non-stick coating
A non-stick coating formed on a substrate comprising a primer composition and a topcoat composition, wherein the primer composition is between the topcoat composition and substrate. The primer...
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6861497 |
Polyimides having an unusually low and tunable electrical resistivity useful for electrical and optical applications
A polyimide is disclosed of the formula:
CG1 and CG2 are independently electron-accepting and/or electron-donating groups; x is an integer from about 3 to about 3000; ODAH is any of a...
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6861136 |
Segmented glass laminate
A flexible laminate is disclosed which includes a flexible support as a first layer and glass having a thickness in the range from 10 μm to 500 μm as a second layer and wherein the first or the...
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