|
Match
|
Document |
Document Title |
|
|
7601425 |
Corrosion resistant coatings containing carbon
A coating composition comprising an effective corrosion-inhibiting amount of a carbon pigment is provided. In one embodiment, the corrosion-inhibiting carbon pigment is further comprising other...
|
|
|
7572506 |
Aqueous primer surfacer compositions
The invention relates to aqueous coating compositions for producing primer and/or filler layers in a multi-layer coating, in particular in vehicle coating, comprising the following components:
A)...
|
|
|
7541093 |
Coating composition
A coating composition containing an epoxy resin and a curing agent comprising a trimer fatty triamine and/or higher oligomeric amine. The coating composition is particularly suitable for use as a...
|
|
|
7527863 |
Functionalized polyphenylene ether
An object of the invention is to provide a functionalized polyphenylene ether useful for polymer alloys or electrical or electronic materials such as printed boards or insulating sealants. The...
|
|
|
7524394 |
Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same
Provided is a flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) a nitrogen-containing...
|
|
|
7521120 |
Non-halogen flame retardant epoxy resin composition, and prepreg and copper-clad laminate using the same
Provided are a non-halogen flame retardant epoxy resin composition comprising (A) a silicon-containing, phosphorus-modified epoxy resin, (B) a multifunctional epoxy resin, (C) a mixed curing agent...
|
|
|
7521116 |
Pressure sensitive adhesive tapes from cationic cure adhesives
Pressure sensitive adhesive tapes produced by a process where cationic cure is conducted against a paper film substrate and an optional second film substrate, both having low moisture content. The...
|
|
|
7491290 |
Two-pack type adhesive
Disclosed is a two-component adhesive used for electrically and mechanically interconnecting two objects for bonding. The two-component adhesive is made up by first and second adhesive materials...
|
|
|
7485362 |
Nanoporous laminates
A process of making a nanoporous substrate, such as the matrix in an electrical laminate, by grafting onto an organic resin backbone a thermolabile functionality by reacting hydrogen active groups...
|
|
|
7482056 |
Transparent conductor
The present invention provides a transparent conductor comprising a substrate, and a conductive layer containing conductive particles and a conductive polymer.
|
|
|
7468205 |
Multilayer composite materials with at least one aerogel-containing layer and at least one other layer, process for producing the same and their use
Multilayer composite materials with at least one aerogel-containing layer and at least one other layer, a process for producing the same and their use are disclosed. The aerogel-containing layer(s)...
|
|
|
7449526 |
Oligomeric, hydroxy-terminated phosphonates
Epoxy resins that are suitable for forming epoxy laminates that meet a UL-94 rating of V-0 comprise a hydroxy-terminated oligomeric phosphonate comprising the repeating structure...
|
|
|
7446137 |
Thermosetting resin and thiocyanato-containing organohydrocarbonoxysilane
A curable organic resin composition comprising (A) 100 parts by weight of a curable organic resin and (B) 0.01 to 100 parts by weight of a thiocyanato-containing organohydrocarbonoxysilane or an...
|
|
|
7371459 |
Electrical devices having an oxygen barrier coating
An electrical device includes two electrodes and a conductive polymer layer, containing a mixture of a polymer and a conductive filler, separating the electrodes. A oxygen barrier material...
|
|
|
7348370 |
Metal oxides and hydroxides as corrosion inhibitor pigments for a chromate-free corrosion resistant epoxy primer
A corrosion resistant epoxy primer comprises a epoxy resin, a curing agent, and a non-chromate containing corrosion-inhibiting pigment.
|
|
|
7348061 |
Slip-resistant coatings and substrates coated therewith
A slip-resistant coating composition comprising
(i) a binder comprising a polyepoxide and a polyamine; (ii) a micaceous pigment selected from the group consisting of mica and micaceous iron...
|
|
|
7338989 |
Aqueous coating material, method of producing the same and use thereof
An aqueous coating material comprising at least one epoxy resin as binder and at least one polyamine as curing agent, wherein said epoxy resin or at least one of the epoxy resins
(i) is solid per...
|
|
|
7323289 |
Bottom anti-reflective coatings derived from small core molecules with multiple epoxy moieties
Novel anti-reflective coatings comprising small molecules (e.g., less than about 5,000 g/mole) in lieu of high molecular weight polymers and methods of using those coatings are provided. In one...
|
|
|
7318956 |
One way bullet-resistant transparent panel
Transparent panels having unidirectional bullet-resisting characteristics contain at least one sheet of glass, several intermediate sheets formed of an acrylic resin or further glass sheets, and an...
|
|
|
7312261 |
Thermal interface adhesive and rework
A reworkable conductive adhesive composition, and method of making such, comprising an epoxy based conductive adhesive containing conductive metal filler particles dispersed in a solvent-free...
|
|
|
7312104 |
Resin composition for encapsulating semiconductor device
A resin composition usable for encapsulating a semiconductor, comprising (A) an epoxy resin having two or more epoxy groups in one molecule; (B) a curing agent; and (C) inorganic composite oxide...
|
|
|
7311974 |
Concrete floor finishing system and method
An initial surface is provided. An overlay of colored grout is provided. The colored grout is on the initial surface. In this manner an intermediate surface is created. An acid stain is provided....
|
|
|
7311973 |
Adhesive with multistage curing and the utilization thereof during the production of composite materials
The invention relates to an adhesive containing two components A and B, whereby component A comprises both a functional group which can be polymerized by means of irradiation with UV beams as well...
|
|
|
7311961 |
Method of making coated articles and coated articles made thereby
An article includes a first substrate, a functional coating deposited over at least a portion of the substrate, and a protective coating deposited over the functional coating. The functional...
|
|
|
7297406 |
Lead-free electrodeposition coating composition and coated article
The present invention relates to a cationic electrodeposition coating composition substantially free of lead compounds, which is excellent in curability and can be finish-coated with a splendid...
|
|
|
7282266 |
Corrosion and alkali-resistant compositions and methods for using the same
A corrosion resistant, alkali resistant coating composition is disclosed. The composition comprises a binder comprising a reaction product of an epoxy-containing material and a...
|
|
|
7279223 |
Underfill composition and packaged solid state device
An underfill composition with enhanced adhesion and improved resistance to cracking comprising an epoxy resin in combination with a difunctional siloxane anhydride epoxy hardener and optional...
|
|
|
7271224 |
Composition for coating having a gas barrier property, coating and coated film having a gas barrier property used the same
A composition for coating having a gas barrier property comprising coating-forming components of an epoxy resin and an amine curing agent, wherein said amine curing agent is a reaction product of...
|
|
|
7261938 |
Surface modification of substrates
The present invention is directed to a practically universal surface modification process and the materials thereby obtained. In general, the process includes initial epoxy modification of a...
|
|
|
7247381 |
Adhesive for bonding circuit members, circuit board, and method of producing the same
An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing 100 parts by weight of an adhesive resin...
|
|
|
7229686 |
Antireflection film and making method
A high refractive index layer of a cured first coating composition comprising (A) metal oxide fine particles selected from among titanium oxide, aluminum oxide, zirconium oxide, cerium oxide, iron...
|
|
|
7229671 |
Method for coating package with a filter profile
Method for packaging a photo detector integrated circuit (IC) and a pigment filter and resulting package are described. An encapsulated package (e.g., an epoxy-encapsulated package) that includes a...
|
|
|
7213739 |
Underfill fluxing curative
The invention is directed to a fluxing curative for curing an underfill that comprises an epoxy resin and for fluxing a solder during a solder assembly of an electronic component to an electronic...
|
|
|
7202304 |
Anhydride polymers for use as curing agents in epoxy resin-based underfill material
An underfill material is presented that may be used between an electrical component and a substrate. The underfill material may be a cured epoxy resin composition comprising a liquid or semisolid...
|
|
|
7179552 |
Resin composition for interlayer insulation of multilayer printed wiring board, adhesive film and prepreg
Resin compositions which comprise the following components (A) to (E) are useful for interlayer insulation of a multilayer printed wiring board:
(A) an epoxy resin having 2 or more epoxy...
|
|
|
7157313 |
Epoxy resin composition and semiconductor device using thereof
The present invention provides an epoxy resin composition for packaging a semiconductor device, characterized in having improved mold releasability during a molding process, continuous-moldability...
|
|
|
7157143 |
Two-component epoxy adhesive formulation for high elongation with low modulus
Two-component epoxy adhesive compositions, and methods of using the same, are described. The compositions include an epoxy resin component, including at least one epoxy resin and at least one...
|
|
|
7150902 |
High Tg coatings
Articles are coated by applying a coating composition of a high T g phenoxy-type material having a T g of at least about 75° C. to at least a portion of a surface of an article, and forming a...
|
|
|
7147920 |
Wafer dicing/die bonding sheet
In a wafer dicing/die bonding sheet comprising a backing member, an adhesive layer, and a protective member, the adhesive layer is made of an adhesive composition comprising a phenolic hydroxyl...
|
|
|
7146719 |
Multilayer circuit component and method for manufacturing the same
A multilayer circuit component and a method for manufacturing the same, in which the difference of the amounts of baking shrinkages between each of the glass-containing layers is small, and the...
|
|
|
7144631 |
Method for achieving primerless windshield sealant adhesion over a carbamate clearcoat
A method for adhering windshield sealants directly over a basecoat/clearcoat finish in which the clearcoat comprises a carbamate polymer or oligomer.
|
|
|
7144544 |
Ultraviolet light curing compositions for composite repair
An ultraviolet (UV) light curable formulation useful for repairing composite materials, comprising: an acrylic oligomer, an acrylic monomer, and a photoinitiator. This formulation may include...
|
|
|
7141303 |
Protective articles
The invention provides protective articles comprising a backing that comprises a fluorinated polymer and a curable adhesive on at least one layer of the backing. The protective articles of the...
|
|
|
7132168 |
Resin curable with actinic radiation, process for the production thereof, and photocurable and thermosetting resin composition
A printed circuit board that includes a solder resist has a photocurable and thermosetting resin composition which comprises (A) an actinic energy ray-curable resin having at least one structure...
|
|
|
7112372 |
Pigmented panel assembly
Panel assemblies that include a core sandwiched between face sheets made from composite material. A pigmented topcoat layer is applied directly to the composite material without the need for a...
|
|
|
7108920 |
Reworkable compositions incorporating episulfide resins
This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays...
|
|
|
7090920 |
Poly(arylene ether) adhesive compositions
A laminate, comprises a thermoplastic substrate, a conductive metal foil at least partially disposed on at least one side of the substrate, and an adhesive disposed between the substrate and the...
|
|
|
7087304 |
Polysulfide-based toughening agents, compositions containing same and methods for the use thereof
In accordance with the present invention, there are provided toughening agents which are useful for improving the performance properties of epoxy-based adhesive formulations. For example,...
|
|
|
7060346 |
Resin sheets, processes for producing the same, and liquid crystal displays
Resin sheets which are thin and lightweight and have an antiglare function for preventing the so-called ghost phenomenon in which an illuminating light, such as fluorescent light or sunlight, or...
|
|
|
7048997 |
Production of optical elements
A method of making an optical element that includes a thermoplastic power portion, the method including laminating a first thermoplastic sheet to one side of a functional film, laminating a second...
|