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9011649 Thin film deposition method  
The subject of the invention is a process for obtaining a substrate coated on at least part of its surface with at least one film of oxide of a metal M the physical thickness of which is 30 nm or...
9012016 Decorated enamelled part  
The invention relates to an enamelled part (3, 11, 21) for a dial comprising a ceramic substrate (31) coated with a first enamel layer (4′, 12, 24, 33) to improve the appearance of said part....
9013882 High-frequency module  
A high-frequency module has a multilayer board formed by laminating a plurality of sheets made of a thermoplastic resin material and subjecting the laminated sheets to thermocompression bonding,...
9005741 Multi-spectral cloak system  
Fabric has a printed pattern with a base color and at least one design color. The design color has a plurality of irregular, non-repeating spots. The printed pattern is adapted to abate...
9005737 Coated articles and methods of making same  
A coated substrate. The coated substrate includes a unitary substrate having a major surface. A first coating is applied to a first surface segment of the major surface. A second coating applied...
9006625 Method for forming conductive patterns using microwave  
In a method for forming conductive patterns, a substrate is provided, and a pattern is formed on the substrate using a conductive pattern-forming composition and a printing method. The substrate...
8986819 Palladium precursor composition  
A non-catalytic palladium precursor composition is disclosed, including a palladium salt and an organoamine, wherein the composition is substantially free of water. The composition permits the use...
8986817 Nitrided component surface repair  
A plunger for fuel injection assembly is provided. The plunger includes a nitrided surface. The nitrided surface includes a damaged area. An electroless material is coated on the damaged area.
8986816 Decorative decal system for an aircraft  
A method and apparatus comprising a layer of material having a decorative graphic and an electrically conductive material in the layer of material. The layer of material is configured to be...
8981936 Method of manufacturing conductive structures  
The present invention relates to a method of manufacturing a web of a plurality of conductive structures which may be used for example to produce an antenna, electronic circuit, photovoltaic...
8980414 Carrier-attached copper foil  
The present invention provides a carrier-attached copper foil, wherein an ultrathin copper foil is not peeled from the carrier prior to the lamination to an insulating substrate, but can be peeled...
8974893 Artificial microstructure and artificial electromagnetic material using the same  
An artificial microstructure comprises two “I” shaped metal wire structures. The two “I” shaped metal wire structures are separated to each other. The present invention also discloses an...
8956718 Transparent conductor thin film formation  
Substantially transparent conductor layers in touch sensing systems may be formed by forming a barrier layer between an organic layer and a substantially transparent conductive layer. For example,...
8956716 Printed material and method for manufacturing printed metal  
A printed material includes a first printed layer and a second printed layer. The first printed layer is produced by printing using a first curing ink which is provided in a first processing...
8957321 Printed circuit board, mount structure thereof, and methods of producing these  
A printed circuit board of the present invention includes a base body, a through-hole that penetrates through the base body in the thickness direction, and a through-hole conductor that covers an...
8940386 Formed body with curved surface shape, method of producing the formed body, front cover for vehicle lighting device, and method of producing the front cover  
A formed body having a curved surface, a method of producing the formed body, a front cover for a vehicle lighting device, and a method of producing the front cover. A front cover for a vehicle...
8936847 Metallized polymeric film reflective insulation material  
The invention relates to a reflective insulation material product including a metallized polymeric film laminated to an insulation material with the metallized polymeric film having its exposed...
8933773 Laminated layer structure for producing an insulation material  
A layer structure for producing a planar insulation laminate, including the following sequence of planar individual layers arranged one on the other: a B-stage resin, a glass fabric, a core layer...
8927072 Photonic crystal security device  
An optically variable security device comprises a photonic crystal which, upon receipt of incident light, generates a first optical effect, and which, when the device is subjected-to-an external...
8901435 Hybrid wiring board with built-in stopper, interposer and build-up circuitry  
A hybrid wiring board includes an interposer, a stopper, a stiffener and a build-up circuitry. The stopper is laterally aligned with and laterally extends beyond peripheral edges of the interposer...
8889244 Transparent electrode device, information input device, and electronic equipment  
A transparent electrode device includes: a substrate; an electrode region formed on the substrate using a transparent electroconductive film; and an insulating region disposed on the substrate and...
8889250 Plating target material, polyamic solution and polyimide resin solution which are used to form the plating target material, and printed-wiring board using them  
A laminate of the present invention comprises a plating-target material including a layer-A, that is subjected to electroless copper plating and has a surface roughness such that an arithmetic...
8883564 Substrate comprising aluminum/graphite composite, heat dissipation part comprising same, and LED luminescent member  
A process for producing a substrate, which comprises processing an aluminum/graphite composite into plates having a thickness of 0.5-3 mm using a multi-wire saw under the following conditions (1)...
8883273 Photonic crystal security device  
An optically variable security device comprises a photonic crystal of which incident light received by the crystal is selectively reflected or transmitted by the crystal to generate a first...
8871850 Highly dielectric film  
There is provided a highly dielectric film which has high dielectric property, can be formed into a think film and is excellent in winding property (flexibility). The highly dielectric film...
8867219 Method of transferring and electrically joining a high density multilevel thin film to a circuitized and flexible organic substrate and associated devices  
A method is for making an electronic device and includes forming an interconnect layer stack on a sacrificial substrate and having a plurality of patterned electrical conductor layers, and a...
8865298 Article with metal grid composite and methods of preparing  
A laminate donor element can be used to transfer a composite of a metal grid and an electronically conductive polymer to a receiver sheet for use in various devices. The laminate donor element has...
8859910 Circuit board with signal routing layer having consistent impedance  
A circuit board includes a dielectric layer and a signal routing layer on the dielectric layer. The signal routing layer includes chip traces, connector traces, and signal traces connected with...
8853547 Flexible printed board  
A flexible printed circuit board, in particular for the spatial connection of electronic components, includes a carrier foil (1), several bonding surfaces (10) arranged on a solder side (4) of the...
8852728 Conductive film  
There are provided a pattern exposure method, a conductive film producing method, and a conductive film, wherein a photosensitive material is subjected to a proximity exposure through a photomask...
8847206 Surface modifying agent, laminated structure and transistor including the same, and method of manufacturing the laminated structure  
Disclosed is a surface modifying agent including a compound having an ethynyl group at one terminal end, a laminated structure manufactured using the surface modifying agent, a method of...
8846186 Layered product for metamaterial transfer and metamaterial transferred substrate  
Disclosed is a layered product for metamaterial transfer for transferring a metamaterial layer onto a substrate, including: a resin mold having a fine convex-concave structure on a surface; and an...
8828525 Flexible printed circuit board integrated with reinforcing plate, and method for manufacturing flexible printed circuit board integrated with reinforcing plate  
An object of the present invention is to provide (i) a stiffener-integrated flexible printed circuit board in which a defect such as a blistering is not generated during a reflow process even...
8828555 Method for forming patterned conductive film  
The present invention is directed to a method for forming a patterned conductive film, which comprises the step of bringing a substrate having a layer made of platinum microcrystal particles...
8815125 Method of manufacturing a resistor paste  
A method of manufacturing a resistor paste comprising steps of: (a) preparing a basic resistor paste comprising, (i) a conductive powder, (ii) a first glass frit, and (iii) a first organic medium;...
8809696 Method for surface treatment of copper and copper  
An object of the present invention is to provide a copper surface treatment method capable of keeping certainly a bonding strength between a copper surface and a resist, or between a copper...
8808841 Insert sheet and method for manufacturing the same  
The present disclosure relates to insert sheets and a method for manufacturing same. A film of the present invention is applicable to a variety of insert moldings or injection moldings to achieve...
8802997 Multi layer circuit board and manufacturing method of the same  
Disclosed is a PCB having multiple layers of heavy copper. A prepreg having a nonwoven glass web substrate is used alone or together with another prepreg having a glass fabric substrate so that...
8784975 Self-aligned wafer bonding  
A wafer article includes a substrate, two or more hydrophilic areas disposed on the substrate, hydrophobic areas surrounding the hydrophilic areas, and a eutectic bonding material disposed on the...
8777638 Wiring board and method of manufacturing the same  
A wiring board includes a first substrate portion including a first feed-through conductor portion in a vertical direction, a second substrate portion provided on the first substrate portion and...
8778481 Security element and method for the production thereof  
The present invention relates to a security element for protecting valuable articles, having a first and a second authenticating feature. The first authenticating feature comprises a first...
8758885 Lithographic printing plate material  
Provided is a lithographic printing plate material having an excellent balance between printing durability and ink-absorbing capability. The lithographic printing plate material has an...
8749978 Power module  
A power module includes a power module board including an insulating layer and a conductive circuit formed on the insulating layer, a power device provided on the power module board and...
8747579 Solder layer and device bonding substrate using the same and method for manufacturing such a substrate  
A solder layer and an electronic device bonding substrate having high bonding strength of a device and low bonding failure even by a simplified bonding method of a device to a substrate and a...
8747604 Method for manufacturing a microfluidic chip, and related chip and plate  
The invention relates to a method for manufacturing a microfluidic chip, wherein said method comprises the steps of: providing a plate combined with a layer of inorganic silica gel of formula:...
8741424 Transparent conductive element, input device, electronic device, and master for fabrication of transparent conductive element  
A transparent conductive element includes a base having a first surface and a second surface, and a transparent electrode pattern part and a transparent insulating pattern part formed on at least...
8734934 Surface metal film material, method of producing surface metal film material, method of producing metal pattern material, and metal pattern material  
A surface metal film material including, in this order, a substrate, a polymer layer that receives a plating catalyst or a precursor thereof, and a metal film formed by plating, wherein, when x μm...
8734921 Ink composition for continuous deflected jet printing, especially on wet glass  
Ink composition for continuous deflected jet printing, that is liquid at ambient temperature, comprising a solvent containing less than 0.5% by weight of water and less than 0.5% by weight of...
8735309 Mullite-based sintered body, circuit board using same and probe card  
A mullite-based body including mullite, alumina, and titanium manganese oxide is disclosed. The mullite-based sintered body includes mullite of 79.3 to 85.2 mass %, alumina of 14.2 to 19.8 mass %...
8728354 Electrically conducting compositions  
Disclosed herein is an electrically conducting polymer composition and method of making a composition including an organic polymer; and a first filler including at least one ceramic filler, at...