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7619187 |
Porous ceramic heating element and method of manufacturing thereof
Disclosed herein is a porous ceramic heating element wherein 0.08 to 1.00 wt % of a foaming agent is added in 99.00 to 99.92 wt % of a mixture of an inorganic material, a binder, a conductive...
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7615277 |
Formation method of metal layer on resin layer, printed wiring board, and production method thereof
A printed wiring board having a conductor circuit comprising a copper layer adjacent to an insulating layer and an electroless gold plating, wherein the insulating layer has ten-point mean surface...
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7608929 |
Electrical connector structure of circuit board and method for fabricating the same
An electrical connector structure of circuit board and a method for fabricating the same are proposed. A circuit board having a conductive layer is formed with a first resist layer and a second...
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7608320 |
Container structure
A container includes an image layer, and a main body; the main body is formed in a mold by means of carrying out an injection molding process while the image layer is held in the mold; thus, the...
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RE40947 |
Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole
A multilayer printed wiring board is composed of a substrate provided with through-holes, and a wiring board formed on the substrate through the interposition of an interlaminar insulating resin...
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7602051 |
Thermally conductive resin sheet and power module using the same
A thermally conductive resin sheet includes a thermosetting resin, and a thermally conductive and electrically insulating inorganic filler. The inorganic filler is a mixture of a flat inorganic...
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7601419 |
Printed circuit board and method of manufacturing the same
Disclosed are a printed circuit board and a method of manufacturing the same, in which a fluorine resin coating layer is formed on a resin substrate, and then a copper layer is formed using a dry...
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7599192 |
Layered structure with printed elements
The present invention incorporates electronic components into an electronic core structure that may be readily hot laminated by existing processes. The structure may include multiple desired...
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7595109 |
Electrical-energy-storage unit (EESU) utilizing ceramic and integrated-circuit technologies for replacement of electrochemical batteries
An electrical-energy-storage unit (EESU) has as a basis material a high-permittivity composition-modified barium titanate ceramic powder. This powder is double coated with the first coating being...
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7588835 |
Method of treating the surface of copper and copper
A method of treating the surface of copper is provided to ensure adhesive strength between the surface of copper and an insulating layer without forming irregularities exceeding 1 μm on the...
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7582347 |
Closing mechanism comprising a heating means, and method for producing one such closing mechanism
A closing mechanism ( 1; 101; 201; 301 ) includes a plurality of closing elements ( 2; 102; 202; 302; 302 a ) such as hooks, mushroom heads or loops, and a flat carrier ( 3; 103; 203; 303 ). The...
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7579066 |
Ethylenically unsaturated group-containing isocyanate compound and process for producing the same, and reactive monomer, reactive (meth) acrylate polymer and its use
There are provided a novel ethylenically unsaturated group-containing isocyanate compound, a process for producing the same, and a reactive monomer produced from the isocyanate compound, a reactive...
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7575798 |
Optical element with an opaque chrome coating having an aperture and method of making same
A substrate includes an opaque chrome coating on a surface of the substrate dry-etched to form an aperture, wherein chrome in the aperture is below detectable limit. A method of forming an opaque...
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7575709 |
Tape-cast sensors and method of making
A method of making electrochemical sensors in which an electrolyte material is cast into a tape. Prefabricated electrodes are then partially embedded between two wet layers of the electrolyte tape...
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7572503 |
Method for preparing an insulating resin composition, insulating resin composition, multilayer wiring board and process for producing the same
Directed to an insulating resin composition which comprises (A) a novolak epoxy resin having a biphenyl structure, (B) carboxylic acid-modified acrylonitrile butadiene rubber particles, (C) a...
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7572500 |
Method of manufacturing circuit-forming board and material of circuit-forming board
A conductive portion is formed in a hole formed in a material sheet. A metal foil is placed on a surface of the material sheet to provide a laminated sheet. The laminated sheet is heated and...
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7569162 |
Electrically conductive paste and multilayer ceramic substrate
An electrically conductive paste used for forming wiring conductors, such as via holes disposed on a multilayer ceramic substrate, is provided, wherein the temperature range in which sintering is...
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7559137 |
Method for providing electrically conductive paths in polymer tubing
A method for forming electrically conductive patterns to provide an electrically conductive path on a polymer tube is provided. The method includes the steps of establishing a polymer tube and...
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7553381 |
Crystalline metal film
A metal film according to the present invention has a cubic crystal structure having a periodic pattern of crystal orientation in a plane. The crystal orientation is gradually rotated about a...
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7547849 |
Compositions useful in electronic circuitry type applications, patternable using amplified light, and methods and compositions relating thereto
A light-activatable polymer composition and polymer composite includes a polymer binder selected from epoxy resins, silica filled epoxy, bismaleimide resins, bismaleimide triazines, fluoropolymers,...
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7532481 |
Al/AlN joint material, base plate for power module, power module, and manufacturing method of Al/AlN joint material
A base plate for a power module includes: a metal plate, a ceramic base plate joined to the metal plate, and a release agent which includes boron provided in a joint surface between the metal plate...
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7524552 |
Copper foil provided with dielectric layer for forming capacitor layer, copper clad laminate for formation of capacitor layer using such copper foil with dielectric layer, and method for manufacturing producing such copper foil with dielectric layer for formation of capacitor layer
To provide a dielectric-layer-provided copper foil or the like for extremely improving the product yield while making the most use of the increase effect of an electric capacity of a thin...
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7521115 |
Low temperature bumping process
A method for low temperature bumping is disclosed. A resin capable of being cross-linked by free-radical or cationic polymerization at low temperature is provided. Electrically conductive particles...
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7514781 |
Circuit substrate and manufacturing method thereof
A circuit substrate includes a plurality of dielectric members and a plurality of wiring patterns. The plurality of wiring patterns are stacked on one another through the plurality of dielectric...
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7514379 |
Curable polyvinyl benzyl compound and process for producing the same
A curable polyvinyl benzyl compound represented by the following general formula (1):
wherein R 1 represents a C 2-20 organic group, R 2 represents a hydrogen atom, etc., x is an integer of...
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7510759 |
Electronic part and manufacturing method thereof
An electronic component includes conductive pattern ( 2 ) on insulating substrate ( 1 ), a metal film formed by a plating method on a surface of conductive pattern ( 2 ), and metal oxide layer ( 3...
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7504148 |
Printed circuit board structure and manufacturing method thereof
This invention discloses a manufacturing method and a structure for printed circuit boards. The printed circuit boards are often used for supporting electronic components in circuit and conducting...
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7488543 |
Aluminum nitride conjugate body and method of producing the same
An aluminum nitride joined body comprising two pieces of aluminum nitride sintered body plates joined together without using adhesive, and a metal layer formed on a portion of the junction...
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7488531 |
***WITHDRAWN PATENT AS PER THE LATEST USPTO WITHDRAWN LIST***
Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board
The invention relates to an adhesion assisting agent-bearing metal foil comprising a layer of an adhesion assisting agent containing an epoxy resin as an indispensable component on a metal, wherein...
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7485361 |
Multilayered printed wiring board and manufacturing method thereof
An object of the present invention is to provide a multi-layered printed wiring board which does not require roughening such as black oxide treatment and the like on inner layer circuits. For the...
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7482052 |
Method for processing by laser, apparatus for processing by laser, and three-dimensional structure
A laser processing method where laser beam for processing is irradiated on a processing object and the laser beam for processing directly removes a part of the processing object. The processing...
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7473854 |
Printed circuit board
A ground pattern includes a plurality of integrally formed first to third ground lines. A plurality of first ground lines are arranged parallel to one another at equal intervals. A plurality of...
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7473459 |
Method of manufacturing a film printed circuit board
A method of manufacturing a film printed circuit board is provided. A film substrate consisting of a polyimide substrate, an alloy layer and a first copper layer is provided. A first lithographic...
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7473458 |
Metal foil with resin and metal-clad laminate, and printed wiring board using the same and method for production thereof
The present invention provides a metal clad laminate or a resin coated metal foil having a metal foil whose both surfaces are not substantially roughening-treated and an insulating resin...
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7470461 |
Printed circuit board and method of manufacturing the same
Provided is a method of manufacturing a printed circuit board. In an embodiment, the method includes forming a prepreg layer via a reel method, forming a conductive film for forming a circuit...
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7470460 |
Layered composite materials
Layered composite materials which comprises a substrate made from a thermoplastic polymer, and comprise an intermediate layer arranged thereupon and a decorative layer applied to the intermediate...
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7465488 |
Bow control in an electronic package
A package including a package substrate, a die-substrate assembly including a substrate including a plurality of layers including a layer having a mesh to stiffen the substrate adapted to mount one...
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7462383 |
Labeling with thermally conductive pads
An optical disc includes an optical disc; a thermally conductive material disposed in a pattern of discrete pads on said disc; and a thermochromic material disposed over said pattern of thermally...
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7459202 |
Printed circuit board
A sequentially laminated printed circuit board having highly reliable vias can be fabricated by pattern plating flanges or via lands on a copper foil, laminating the foil to a prepreg so that the...
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7459201 |
Compound for forming wiring conductor, fabrication method of circuit board using the same and circuit board
The present invention sufficiently secures conductor component content ratio in wiring formed on a multilayer circuit board and increases reliability by fabricating the multilayer circuit board by...
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7459200 |
Circuit board design
A circuit board is described where the fiberglass fiber pattern as been modified than what is found in conventional FR4 circuit boards. In one embodiment, the sets of fiberglass fibers are disposed...
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7459104 |
Low temperature fired, lead-free thick film heating element
A lead free, thick film heating element. Known thick film heating elements contain environmentally hazardous material such as lead. This is particularly problematic when manufacturing thick film...
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7438969 |
Filling material, multilayer wiring board, and process of producing multilayer wiring board
A solvent-free filling material comprising a filler, a thermosetting resin, a curing agent, and a curing catalyst, wherein the thermosetting resin is an epoxy resin, and the curing agent is a...
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7438795 |
Electrochemical-mechanical polishing system
Provided is a polishing apparatus and polishing pad, intended for polishing a substrate, and designed for improved flow and distribution of a polishing composition to the area of interaction...
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7429778 |
Methods for forming wiring and electrode
There is provided a method for forming wiring or an electrode by coating a substrate with a composition comprising (A) a complex of an amine compound and a hydrogenated aluminum compound and (B) a...
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7427435 |
Coating composition for adhering metallized layers to polymeric films
A metallized film and a process for making the film are disclosed. In general, the metallized film includes a polymeric film layer that is coated with a polyester coating composition. A metal layer...
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7410551 |
Method of hot marking, and a multilayer structure for implementing such a method
The invention relates to a hot marking method enabling decoration to be made on an article, the method comprising the steps consisting in:
supplying a multilayer structure comprising a layer...
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7405244 |
Solvent-free polyimide silicone resin composition and a resin film composed of the same
A solvent-free resin composition comprising
(a) a polyimide silicone resin having repeating units represented by the following general formulas (1-1) and (1-2),
wherein X is a tetravalent...
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7405180 |
Wireless information recording medium
A wireless information recording medium including a reversible thermal recording medium, a cushioning material layer provided on the reversible thermal recording medium, an information recording...
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7404915 |
Electromagnetic wave shielding material, method of manufacturing the same and electromagnetic wave shielding material for plasma display panel
An objective is to provide an electromagnetic wave shielding material exhibiting an excellent electromagnetic wave shielding property, and also to provide a manufacturing method with quick and...
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