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6680092 |
Coating method and products obtained by same
The invention concerns a method for producing high resolution patterns on a support comprising the following steps: high resolution printing of a varnish on the support; treating the support by...
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6680441 |
Printed wiring board with embedded electric device and method for manufacturing printed wiring board with embedded electric device
A printed wiring board having an embedded electric device is manufactured as follows. A first resin film having an opening or a sheet member having a recess is piled with a plurality of second...
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6677668 |
Configuration for testing a substrate mounted with a most performance-demanding integrated circuit
The present invention discloses a method for mounting multiple integrated circuit (IC) chips on a top surface of a substrate. The method includes a step forming a first footprint to include a...
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6677028 |
Retroreflective articles having multilayer films and methods of manufacturing same
Retroreflective articles having multilayer films are useful for commercial graphics and retroreflective products, such as roll-up signs for highway transportation safety. The articles comprise...
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6673420 |
Inorganic sheet carrying symbols for making pigments
Inorganic sheets ( 10 ) of at least two surperposed layers are provided with one or more symbols ( 20 ) which have a size of between 1 and 10 μm. The inorganic sheet is made up into pigment flakes...
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6673424 |
Devices based on molecular electronics
Molecular electronic devices and method of making molecular electronic devices having a self-assembled ordered insulating molecular electronic film having insulating molecules attached at one end...
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6670024 |
Glass-silicon column
A glass-silicon column that can operate in temperature variations between room temperature and about 450° C. The glass-silicon column includes large area glass, such as a thin Corning 7740...
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6667090 |
Coupon registration mechanism and method
A registration coupon is provided for a printed circuit board or other substrate. The registration coupon may be used to determine a hole-to-outer layer feature registration and a solder mask...
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6666943 |
Film transfer method
A device is formed by transferring a film onto a substrate when the film requires but the substrate is not adapted to a high temperature heat treatment process. The film having layers and formed on...
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6667493 |
Thin-film magnetic element capable of effectively orienting magnetization direction of magnetic layer and manufacturing method thereof
A thin-film magnetic element comprises a substrate and a magnetoresistive multilayer film provided on the substrate. The multilayer film includes at least one magnetic layer. Bias underlayers...
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6663946 |
Multi-layer wiring substrate
An object of the invention is to satisfy all of a high-density wiring package, soldering thermal resistance, an insulating property and high-frequency transmission characteristics. The invention is...
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6663964 |
Heat dissipating structure
A heat dissipating structure is provided which lowers the thermal contact resistance between a heat generating electronic component and a heat dissipating component, and markedly improves the heat...
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6660665 |
Platen for electrostatic wafer clamping apparatus
A platen for electrostatic wafer clamping apparatus comprising a platen body of dielectric material and grains of electrically conductive material diffused in the dielectric material so that the...
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6660391 |
Low &kgr dielectric inorganic/organic hybrid films and method of making
A method of depositing a dielectric film exhibiting a low dielectric constant in a semiconductor and/or integrated circuit by chemical vapor deposition (CVD) is provided. The film is deposited...
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6656571 |
Cube corner cavity based retroreflectors and methods for making same
Retroreflective sheeting includes a body layer having a structured surface with recessed faces and top surfaces, the recessed faces forming cube corner cavities. The recessed faces have a high...
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6652993 |
Cooper clad laminate with cooper-plated circuit layer, and method for manufacturing printed wiring board using the copper clad laminate with cooper-plated circuit layer
The object of the present invention is to provide a copper clad laminate with a copper-plated circuit layer, and a method for manufacturing a printed wiring board that excels the conventional ones...
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6645389 |
Method of demetallizing a web in an etchant bath and web suitable therefor
A variety of etching bath-based demetallizing processes for making various products involve immersing a web of metal-containing material in a bath of aqueous etchant. The metal-containing material...
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6645606 |
Electrical device having metal pad bonded with metal wiring and manufacturing method thereof
A substrate has a first surface and a second surface. A plurality of pads is formed on the first surfaces. Each pads has a Cu plating layer and an Au plating layer that is directly formed on the Cu...
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6632511 |
Manufacture of prepregs and laminates with relatively low dielectric constant for printed circuit boards
The present invention is directed to filled prepregs, laminates, printed circuit boards comprising a reinforcing material impregnated with a cured polymeric resin, the cured polymeric resin...
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6627331 |
Electroluminescent display based on electrochemically deposited polymer films and a method for constructing
A display device and a method for fabricating the display device. A display device according to the present invention is fabricated from an electrode layer that includes a plurality of electrodes...
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6627286 |
Embossing foil, especially hot embossing foil
Proposed are stamping foils and processes for the production thereof, which make it possible to form on a carrier film patches which are completely separate from each other and which can be...
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6627332 |
Organic electroluminescent device
An organic EL device including: a substrate; a pair of electrodes having electrode lines and overlying the substrate; and an organic film including at least one light emitting layer disposed...
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6623843 |
Resin composition for wiring circuit board, substrate for wiring circuit board, and wiring circuit board
The present invention provides a resin composition for a wiring circuit board; a substrate for a wiring circuit board in which a base insulating layer has been formed from the resin composition for...
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6623842 |
Surface electrode structure on ceramic multi-layer substrate and process for producing the same
In a surface electrode structure on a ceramic multi-layer substrate having on the surface SAW device mounting surface electrodes for mounting flip chips as surface-acoustic-wave devices by...
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6623844 |
Multi-layer wiring board and method of producing the same
Disclosed is a multi-layer wiring board comprising insulating layers of a thermosetting resin having through-holes formed therein, conductor wiring layers buried in the surfaces of said insulating...
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6618939 |
Process for producing resonant tag
A process for producing a resonant tag, wherein a metal foil having a thermal adhesion adhesive applied to at least one face thereof is stamped out into a circuit-like shape and is adhered to a...
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6617010 |
Semiconductor thin film and thin film device
A semiconductor thin film which is deposited by using a chemical vapor deposition method at an underlying layer temperature of 400° C. or less, and contains, as main component elements, a Group IV...
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6610430 |
Method of attaching a device to a circuit board
A method of soldering a ball grid array device onto a circuit board which includes: positioning a solder paste brick on top of a contact pad of the circuit board, said solder past brick defining an...
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6607812 |
Key sheet
The present invention is a key sheet comprising a resin film wherein a mirror-like evaporation deposit layer is provided on a part or all of the back, and further a colored layer is provided at the...
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6607832 |
Ultraviolet/infrared absorbent glass, an ultraviolet/infrared absorbent glass plate, a colored film-coated ultraviolet/infrared absorbent glass plate and a window glass of a vehicle
An ultraviolet/infrared absorbent glass plate includes base glass including 65 to 80 wt. % SiO 2 ; 0 to 5 wt. % Al 2 O 3 ; 0 to 10 wt. % MgO; 5 to 15 wt. % CaO; 10 to 18 wt. % Na 2 O; 0 to 5 wt. %...
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6605340 |
Camouflage structure
To ensure that a camouflage structure will not lose its effectiveness even in changing temperatures (day/night, sunshine/clouds) when protecting against reconnaissance in the IR range, the...
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6605324 |
Liquid crystal resin laminated film, method for manufacturing the same, and circuit board comprising liquid crystal resin laminated film
Disclosed are a liquid-crystalline resin laminated film comprising a liquid-crystalline resin layer and a non-liquid-crystalline thermoplastic resin layer laminated on at least one surface of the...
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6602583 |
Liquid crystalline polymer bond plies and circuits formed therefrom
A multi-layer circuit board comprises a liquid crystalline polymer bond ply disposed between two circuit layers wherein the liquid crystalline polymer bond ply is formed by treating a film...
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6602584 |
Flexible printed circuit board with reinforcing plate
A flexible printed circuit board with a reinforcing plate, which comprises: a flexible printed circuit board including i) a conductive circuit pattern layer, and ii) an insulating layer made of a...
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6599562 |
Rigid-printed wiring board and production method of the rigid-printed wiring board
The present invention is for providing a rigid-printed wiring board capable of preventing the burst or void phenomenon of a copper paste, and a production method of the rigid-printed wiring board....
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6600230 |
Seedlayer for plating metal in deep submicron structures
A process for plating metal in submicron structures. A seedlayer is deposited on surfaces of submicron structures. The seedlayer is annealed at a temperature of about 80° C. to about 130° C....
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6599617 |
Adhesion strength between conductive paste and lands of printed wiring board, and manufacturing method thereof
Copper foil lands provided with a through-hole filled with a copper paste are provided with ring-formed hollow portions in the periphery of the through-hole where exfoliation between the copper...
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6599613 |
Primitive display plate and method of manufacturing display plate and display apparatus
A primitive display plate includes a supporting portion having a positioning structure formed to be positioned by engagement with another member, a display plate shape portion formed to have a...
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6596406 |
Wiring board prepreg and manufacturing method thereof
A wiring board prepreg manufacturing method of the present invention includes the step of depositing and adhering a porous layer made of aromatic polyamide or polyimide onto a heat resistant base...
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6596382 |
Multilayered board and method for fabricating the same
A multilayered board includes a laminate including a plurality of glass-containing insulating layers, each glass-containing insulating layer being provided with an electrode on the surface thereof....
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6592965 |
Ductile ceramic composite electrolyte
A ductile, solid electrolyte composite comprising a continuous, ordered, repeating ductile metallic array surrounded by and supporting an ionically conductive ceramic matrix such as stabilized...
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6592973 |
Card and process for producing the card
A card sealed by using a composition which includes an acrylate compound polymerizable by an ionizing radiation and 1 to 40 parts by weight of a polyfunctional isocyanate compound per 100 parts by...
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6589662 |
Composite film
A composite film having an excellent heat resistance is disclosed. The composite film according to the present invention comprises a substrate film and polyimide membrane(s) formed on at least one...
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6589639 |
Hole fill composition and method for filling holes in a substrate
A composition usable in hole filling of a metal layer and to planarize the metal layer is provided. The metal layer is part of a substrate which can be part of a multilayer printed circuit board or...
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6582801 |
Signage with opaque and transparent elements and method of making the same
An eye-catching bold sign and method of making same wherein the sign has a digital, near-photographic image applied, using a digital file, to a transparent polymeric substrate. The sign further...
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6583024 |
High resistivity silicon wafer with thick epitaxial layer and method of producing same
A silicon wafer having a thick, high-resistivity epitaxially grown layer and a method of depositing a thick, high-resistivity epitaxial layer upon a silicon substrate, such method accomplished by:...
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6579660 |
Process for direct digital printing of circuit boards
A blank printed circuit board ( 10 ), for creating a circuit pattern thereon by direct imaging with infrared radiation. The blank printed circuit board ( 10 ) includes in sequence an insulating...
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6579600 |
Multilayer capacitor and method
A multilayer capacitor includes a unitary, net-shape molded dielectric ceramic body having first and second cavities molded into at least one side to divide the ceramic body into a plurality of...
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6572954 |
Electromechanical component
The invention relates to an electromechanical component which is configured as a sandwich-type structure. In the interior of said structure, a support layer consisting of foamed plastic is...
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6569513 |
Prepreg and process for manufacturing same
A prepreg exhibiting excellent formability and producing laminated boards and multiple layer circuit boards exhibiting high thickness precision is disclosed. The prepreg comprises an inner layer...
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