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6800357 |
Multilens star box and method for making same
A metallized film exhibiting a star pattern having an illusion of three-dimensions is provided. Methods for making a star-shaped die to manufacture the metallized film and for making a metallized...
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6797345 |
Aromatic liquid-crystalline polyester metal laminate
A laminate obtained by dissolving an aromatic liquid-crystalline polyester in an organic solvent to obtain a solution, casting the solution and removing the solvent to give a film, and laminating...
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6797367 |
Multilayer wiring board, semiconductor device mounting board using same, and method of manufacturing multilayer wiring board
A multilayer wiring board with a high degree of heat resistance, which is capable of low temperature fusion without the occurrence of resin flow, enables high precision, finely detailed conductive...
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6789298 |
Finishing method for producing thin-laminate panels
Provided are thin-laminate panels (i.e., thin-laminate panels having dielectric layers of about 0.006 inches or less and conductive layers on either side of the dielectric layer), wherein the edges...
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6783921 |
Method for etching laminated assembly including polyimide layer
Disclosed is an etching method of a laminated assembly having a metal layer and a non-thermoplastic polyimide layer bonded together via thermoplastic polyimide, which comprises using an etchant at...
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6783840 |
Resist ink composition
The present invention provides a resist ink composition comprising a compound (a) having at least one oxetanyl group and at least one epoxy group within the same molecule and a compound (b) capable...
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6780499 |
Ordered two-phase dielectric film, and semiconductor device containing the same
A porous, low-k dielectric film that has good mechanical properties as well as a method of fabricating the film and the use of the film as a dielectric layer between metal wiring features are...
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6780493 |
Wiring board and a process of producing a wiring board
In a wiring board, predetermined wiring patterns which are formed on both sides of an insulation substrate are electrically connected by an electrically conductive material provided in through...
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6776864 |
Process-for forming metal micro-patterns on plastic substrate
A process, which comprises forming a metal micro-pattern on the surface of an inorganic substrate, surface-treating the surface of the metal micro-pattern and the surface of the plastic substrate...
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6770965 |
Wiring substrate using embedding resin
A wiring substrate includes (1) an insulating substrate having an opening, or a core substrate and a build-up layer wherein at least one of the core substrate and the build-up layer has an opening,...
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6770380 |
Resin/copper/metal laminate and method of producing same
A laminate for use in production of printed circuit boards comprising a metal layer having a first side and a second side; a metallic substrate, one side of the metallic substrate being attached to...
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6770353 |
Co-deposited films with nano-columnar structures and formation process
The invention concerns co-deposited films with nano-columnar structures. A film of the invention is formed upon a substrate, and includes a nano-columnar structure of a first material and a...
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6767616 |
Metal core substrate and process for manufacturing same
A metal core substrate comprises a core layer ( 10 ) consisting of first and second metal plates ( 11, 12 ) layered with a third insulating layer ( 13 ) interposed therebetween; first and second...
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6767644 |
Metallized polyimide film
A metallized polyimide film of the present invention comprises a polyimide film 1 which has undergone surface roughening treatment to produce a surface Ra value of 2 to 10 nm, an intermediate...
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6764746 |
Low temperature-fired porcelain articles and electronic parts
An object of the invention is to provide a low temperature fired porcelain having an optimum firing temperature not higher than 1000° C. a reduced dielectric constant ∈ r, an improved quality...
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6764747 |
Circuit board and method of producing the same
A circuit board comprising a resin molded article which includes a metal powder coated by an insulation film and a metal conductor which is formed by metal deposition over a circuit pattern drawn...
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6764748 |
Z-interconnections with liquid crystal polymer dielectric films
A multilayered stack and method of formation. First and second dielectric layers are formed, respectively including first and second liquid crystal polymer (LCP) dielectric materials, with an...
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6758567 |
One-piece reflective marking sheet
A continuously formed, low profiled reflective pavement marker comprising a multiple, inclined, low profiled reflective portions, which are integrally connected by horizontally, positioned...
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6759112 |
Exposed and embedded overlay structure
The present invention describes a structure for and a method of forming a first set and a second set of features in a substrate; covering the first and second set of features with a material;...
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6756474 |
Aqueous conductive dispersions of polyaniline having enhanced viscosity
The present invention is generally directed to a polyaniline/high molecular weight polymeric sulfonic acid complex made by oxidative polymerization, and aqueous polyaniline dispersions, where the...
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6753277 |
Ceramics having excellent high-frequency characteristics and method of producing the same
Ceramics comprising filler crystal particles having an average particle diameter of not smaller than 2.5 μm and a matrix crystal phase present on the grain boundaries of the filler crystal...
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6753070 |
Insulating ceramic compact, ceramic multilayer substrate, and ceramic electronic device
An insulating ceramic compact is provided which can be obtained by low-temperature firing, has a low relative dielectric constant and superior high frequency characteristics, and can be co-sintered...
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6749928 |
Electronic parts and method producing the same
The invention is to offer electronic parts and a method of producing the same in which a producing time is shortened, crack or warp are hard to occur, and cost-down can be attained. Core substrates...
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6749927 |
Dielectric resin composition and multilayer circuit board comprising dielectric layers formed therefrom
A dielectric resin composition comprising at least one type of epoxy resin and at least one type of cyanate ester which would react with said epoxy resin, together with a metal ion catalyst system,...
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6743499 |
Metal filling method and member with filled metal sections
In the formation of through wirings in a silicon substrate and so forth, there was a need for the development of a technology that would allow metal to be reliably filled particularly in the...
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6743534 |
Self-constrained low temperature glass-ceramic unfired tape for microelectronics and methods for making and using the same
A monolithic self-constrained green body tape for use in low temperature ceramic co-firing is provided. The tape contains at least two layers: one low temperature ceramic layer containing particles...
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6739047 |
Method of making ceramic multilayer circuit boards mounted in a patterned metal support substrate
A package for an electronic component includes a metal support substrate having a pattern of openings therethrough and a body of an insulating material, such as glass or ceramic, on and bonded to...
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6740416 |
Aerogel substrate and method for preparing the same
An aerogel substrate useful for an electrically conductive substrate, a heat insulating substrate, an optical waveguide substrate, a substrate for a light emitting device or a light emitting device...
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6737153 |
Circuit board and method for manufacturing the same, and electronic apparatus comprising it
A circuit board comprising a composite resin and a metal plate, the metal plate forming circuit patterns. The composite resin comprises 70-95 parts by weight of inorganic filler, and 5-30 parts by...
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6733871 |
Process for producing ceramic member for bonding, ceramic member for bonding, vacuum switch, and vacuum vessel
A process for producing a ceramic member for bonding, which comprises: a first step of preparing a lower layer paste with the use of a first mixture comprising nickel, tungsten and molybdenum,...
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6730391 |
Clad board for printed-circuit board, multilayered printed-circuit board, and method of manufacture thereof
In the present invention, which produces a clad sheet for a multilayered printed circuit board capable of being economically manufactured and having excellent performance, a multilayered printed...
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6726996 |
Laminated diffusion barrier
A diffusion barrier that has a low dielectric constant, k, yet resistant to oxygen and/or moisture permeability is provided. The diffusion barrier includes a dielectric stack having at least two or...
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6723420 |
Thick film paste systems for circuits on diamond substrates
This invention relates to the nature of thick film compositions that are specifically designed for the fabrication of circuit elements on diamond substrates, especially resistive elements. The...
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6716081 |
Spacer fabrication for flat panel displays
A multi-layered structure, and method for producing same, which may include at least one glass layer anodically bonded to an intermediate layer. The intermediate layer may function as an anodic...
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6717218 |
Wiring structure formed in contact hole, manufacturing method therefor, and a display apparatus having the same
A contact hole is formed, by etching that uses buffered hydrofluoric acid, in a gate insulating film made of SiO 2 and an interlayer insulating layer, formed on the gate insulating film, which is...
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6716892 |
Urethane oligomer, resin compositions thereof, and cured article thereof
The present invention relates to a new urethane oligomer (A) and a resin composition comprising (A) and an unsaturated group containing polycarboxylic acid resin (B) that can be diluted with water...
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6713163 |
Multilayered printed wiring board
A fire retardant multilayered printed wiring board without halogen compounds, having enhanced thermal conductivity of insulator layers to prevent electronic components from being damaged during...
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6713688 |
Circuit board and its manufacture method
A protective agent 6 for protecting a wiring 1 is dispersed and placed in mottle-like on an interface between a via 3 and a wiring layer 2 . Then, each dimension of interface regions 7 ...
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6713162 |
Electronic parts
Using plural layers selected from among composite resin substrates having a fully high or low dielectric constant, composite resin substrates having a fully high magnetic permeability, and...
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6713161 |
Light-transmitting electromagnetic shielding material and method for manufacturing the same
A light-transmitting electromagnetic wave-shielding material includes a hydrophilic transparent resin layer laminated on a transparent substrate. An electroless plating layer is laminated on the...
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6713198 |
Ceramic laminated article, a method of producing the same and a ceramic laminate
The present invention provides a ceramic structure for improving the resistance against a corrosive substance and to diffuse and supply a fluid over a larger area of the structure. A ceramic...
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6706479 |
Bio-chip, photoluminescent methods for identifying biological material, and apparatuses for use with such methods and bio-chips
A method detects binding of molecules, advantageously without tagging molecules in the sample. A sensor is used in which is included a single stranded nucleic acid sequence and a photoluminescent...
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6703114 |
Laminate structures, methods for production thereof and uses therefor
In accordance with the present invention, there are provided novel assemblies which are useful for a variety of applications. Invention assemblies have low dielectric constant, making them suitable...
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6703113 |
Pb-free solder composition and soldered article
Provided is a Pb-free solder composition having an excellent heat resistance which does not damage a glass substrate and parts on the substrate when the soldering is carried out on to an electrode...
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6699571 |
Devices and methods for mounting components of electronic circuitry
Devices and methods for mounting components of electronic circuitry and these mounting devices are capable of surviving repeated thermal cycling. The devices comprise two metal laminate members...
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6699604 |
Protective coating including porous silicon nitride matrix and noble metal
A turbomachine component includes a silicon nitride substrate and a protective coating on the substrate. The protective coating includes a porous silicon nitride matrix and a noble metal...
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6696139 |
Green sheet and manufacturing method thereof, manufacturing method of multi-layer wiring board and manufacturing method of double-sided wiring board
A green sheet including a binder containing an acrylic resin having no polar group and a ceramics material in powder is prepared, and connection via are formed in the green sheet. Further, a...
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6692816 |
Abrasion resistant electrode and device
The invention provides abrasion resistant electrodes that comprise metal-coated conductive valleys between protrusions having a fractured metal coating thereon; the fractured metal coated...
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6689498 |
Aluminum nitride substrate and thin film substrate therewith, and manufacturing method thereof
An aluminum nitride substrate includes an aluminum nitride sintered body containing a rare earth oxide as a sintering additive component. In the aluminum nitride substrate, a surface thereof is...
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6686029 |
Circuit board and method for manufacturing the same
A circuit board includes an electrical insulator layer formed of a reinforcer sheet with density distribution in its in-plane direction, an electrical conductor filled in a plurality of inner via...
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