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5925444 |
Organic binder for shaping ceramic, its production method and product employing the same
A multilayer ceramic substrate comprising at least one ceramic layer made by laminating at least one ceramic green sheet layer and conductor layers formed on surfaces of the at least one ceramic...
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5924191 |
Process for producing a ceramic-metal substrate
A method of producing a ceramic-metal substrate, in which a cooper foil is superficially attached on at least one surface side of a ceramic layer a first metal layer formed by a metal foil,...
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5922455 |
Holographically enhanced wrapping elements
A novel wrapping element comprising at least two layers in intimate contact is described. This element has a sealing layer which is applied to the element to be wrapped and a forming layer which is...
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5919546 |
Porous ceramic impregnated wiring body
A wiring body, used for manufacturing a substrate, includes a columnar body, having an axis, made of fired porous inorganic insulator impregnated with an organic insulator; and a large number of...
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5916667 |
Ink jet imaging of heavy ink coverage printed articles
With proper control of the surface energy of the press ink and the surface tension of the ink jet ink, an article which has a press ink coverage of greater than 30% screen can be successfully...
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5914179 |
Flexible circuit board and production method therefor
A desired circuit wiring pattern is formed by plating a conductive layer having excellent resistance at least to an etching solution on a metal layer which is removed in the post-process by...
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5912066 |
Silicon nitride circuit board and producing method therefor
A silicon nitride circuit board comprises a silicon nitride substrate having oxide layers at surfaces thereof, and copper system circuit plates directly bonded to the silicon nitride substrate...
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5910255 |
Method of sequential laser processing to efficiently manufacture modules requiring large volumetric density material removal for micro-via formation
A method for forming a blind-via in a laminated substrate by laser drilling a blind-via from a top surface of the substrate toward a bottom surface of the substrate using a first laser and a first...
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5908527 |
Method of double-sided printing of a laminate and product obtained thereby
A method of double-sided printing, in effect, on opposite or both surfaces of a layer on a multi-layered foil laminate. Moreover, also disclosed is the provision of a novel multi-layered foil...
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5908675 |
Glass laminate and method of making same
A glass laminate comprising panes of glass held together by a bonding layer is provided with an edge seal by the drying of an ethylene polymer emulsion such that the emulsion thins out along the...
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5904977 |
Electroset composite articles and process
A process for fabrication of composite articles using electroset materials. Conductive substrates are formed defining the shape of the product to be formed. Electroset material is placed between...
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5904975 |
Printed circuit board
A printed circuit board in accordance with the invention includes an electrically insulated board. A plurality of patterns include electrically conductive members are provided on the board and have...
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5904953 |
Insulated metallic strip and method for producing same
An insulated metallic strip suitable for use in the coils of power transformers and method of producing the same. Following the extrusion of a flat metallic strip of conductive material for winding...
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5902436 |
Method for transferring a metallized holographic image
A holographic image that has been transferred from a conventional polymeric support to an aluminum stock element is described in this invention. A host of images may be envisioned and since this...
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5900308 |
Microstrip line dielectric filter
In a microstrip line dielectric filter, a principal layer of a conductor constituting a microstrip line circuit consists of a Cu plating layer and the thickness of the conductor is 10 μm or less....
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5898044 |
Use of a preparation for insulation/sealing and coating purposes and method for sealing manhole covers
The invention relates to the use of a preparation for insulation/sealing and coating purposes, comprising an apolar, non-setting fluid polymer having a glass transition temperature lower than -60°...
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5897522 |
Flexible thin layer open electrochemical cell and applications of same
An application comprising an electrically operated device and a flexible thin layer open liquid state electrochemical cell for providing the device with electrical power for its operation, the...
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5895581 |
Laser imaging of printed circuit patterns without using phototools
The present invention relates to a method of manufacturing a conducting pattern on a non-conducting substrate, that leads to a printed circuit board (PCB). The method obviates the use of phototools...
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5892291 |
Registration accuracy measurement mark
The present invention includes a first semiconductor element forming member formed in a first layer, a first measurement mark formed by the same manufacturing step as the first semiconductor...
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5891553 |
Crosslinkable polymeric coatings and films and composite structures incorporating same
A film having a width of at least about one foot as defined by the cross machine direction thereof and a substantially uniform average thickness of less than about 10 mils is formed of a...
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5888623 |
Sanitary article or plumbing fitting with a coated surface and a print image applied thereto and a process for making the same
A sanitary article, particularly a sanitary fitting or plumbing fitting, having a coated surface, in which on a coating face and/or below a coating face is provided at least one print image which...
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5888630 |
Apparatus and method for unit area composition control to minimize warp in an integrated circuit chip package assembly
A method of manufacturing a multi-layered structure includes forming first and second layers, patterning the first layer, determining a distribution of material in at least one area of the first...
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5888627 |
Printed circuit board and method for the manufacture of same
It is an object of the present invention to provide a highly reliable printed circuit board subject to little bowing or twisting of the substrate, wherein the substrate and metal wiring are...
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5889233 |
Multilayer wiring structure
A multilayer wiring structure having a flame-retardant property corresponding to the V-0 class in the UL 94 standard is provided without degrading the inherent properties of a benzocyclobutene...
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5888624 |
Data carrier with an electronic module and a method for producing the same
The invention relates to a data carrier comprising a one- or multilayer card body in which an electronic module is embedded. The layers of the card body consist of paper and/or cardboard and are...
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5886615 |
Pressure activated switching device with piezoresistive material
A pressure sensitive sparkless switching device includes a layer of piezoresistive cellular polymer foam, at least two conductive layers, and an insulative spacer element having at least one...
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5885929 |
Reusable donor layer containing dye wells for thermal printing
A reusable thermal dye donor element for a dye transfer thermal printer comprising: a base layer; and a donor layer on said base layer, said donor layer having a plurality of wells which...
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5885930 |
Thin wear resistant and heat conductive slip layer for a reusable thermal dye donor belt
A thermal printing donor sheet comprising a support having first and second opposing surfaces; a transferable dye layer on the first surface of the support; and a thermally conductive layer on the...
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5882771 |
Conformable embossable retroreflective sheeting
The present invention provides a retroreflective sheeting including: optical elements arranged in substantially a monolayer; a spacing layer in which the optical elements are at least partially...
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5879788 |
Low-temperature fired ceramic circuit substrate and thick-film paste for use in fabrication thereof
A low-temperature fired ceramic circuit substrate fired at a temperature ranging between 800° and 1,000° C. includes a plurality of insulating layers each formed of a low-temperature fired...
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5879785 |
Position sensor PCB mounting structure for electric motor
An improved position sensor printed circuit board (PCB) mounting structure for a commutatorless motor which includes a casing forming an outer housing of the motor includes a PCB holder having a...
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5879817 |
Reinforced concrete structure
A metal coating of typically a valve metal, especially a titanium metal coating, is applied by thermal spraying to the surface of concrete, most particularly steel-reinforced concrete. The metal...
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5879787 |
Method and apparatus for improving wireability in chip modules
A method of making a laminated structure includes forming a first lamination having first and second conductive layers having inner and outer surfaces and being spaced apart by a dielectric layer,...
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5876843 |
Magnetoresistive element
A surface structure of a magnetoresistive film includes a magnetosensitive portion surrounded by a peripheral portion including at least an electrode film and a magnetic film underlying the...
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5876838 |
Semiconductor integrated circuit processing wafer having a PECVD material layer of improved thickness uniformity
A semiconductor integrated circuit is made by a process including the formation on a surface of a semiconductor integrated circuit processing wafer of a layer of material applied to the wafer by...
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5876841 |
Conductive paste and conductor and ceramic substrate comprising the same
The present invention provides a conductive paste and a conductor and a ceramic substrate using the conductive paste which, when used as a conductive material for a ceramic substrate, can prevent...
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5876842 |
Modular circuit package having vertically aligned power and signal cores
A modular structure for providing electrical interconnections achieves greatly increased wiring density by forming vias and wiring patterns by chemical (e.g. lithographic) processes rather than by...
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5874152 |
Method of making a composite laminate and a PWB substrate so made
The invention relates to a method of making a composite laminate comprising the steps of providing unidirectionally oriented parallel fibres (UD filaments) (3) with a resin matrix to form a...
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5869906 |
Registration accuracy measurement mark for semiconductor devices
A registration accuracy measurement mark has a first measurement mark, a second measurement mark, and a third measurement mark arranged in different layers in a layered manner. The first...
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5868950 |
Method to correct astigmatism of fourth yag to enable formation of sub 25 micron micro-vias using masking techniques
A method of forming a via in a laminated substrate by placing a first mask between an output optics of a laser and an exposed surface of a laminated substrate. The first mask has a first aperture...
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5868949 |
Metalization structure and manufacturing method thereof
A metalization structure having a first conductor layer on the surface of an underlying layer and, further, a second conductor layer connected conductively with the first conductor layer in which a...
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5866238 |
Ferroelectric thin film device and its process
A first ferroelectric thin film device is provided with a first substrate consisting of polycrystal, amorphous material or metal material and a first ferroelectric thin film formed on the first...
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5866236 |
Article with holographic and retroreflective features
An article is disclosed having both holographic and retroreflective features. The article includes a holographic layer that is perceptible under normal lighting conditions and substantially...
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5863447 |
Method for providing a selective reference layer isolation technique for the production of printed circuit boards
This invention describes a new process for the selective isolation of through holes in the production of a multi-layer printed circuit card which allows for substantially smaller holes through...
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5863666 |
High performance flexible laminate
This invention relates to an improved high performance flexible laminate, comprising: a layer of electrodeposited copper foil overlying a layer of a flexible polymeric material, said copper foil...
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5863624 |
Can-covering polyester film and production process thereof
A can-covering polyester film which is bonded under heat to a metal surface of a can through a thermosetting resin adhesive to form a protective coat, wherein the adhesive layer is formed of a...
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5863638 |
Method for bonding artists' materials to coated architectural panels and article for use in, and produced by the method
Composite architectural panels comprising a substrate composed of a laminate of two metal sheets joined by a thermoplastic core and having a factory-applied polymeric surface coating which is not...
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5856267 |
Transfer printing metal substrates
A process for transfer printing sheet metal which is especially suited for manufacture into three-dimensional articles such as appliance panels and one-piece pictures and frames. A decorative image...
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5855995 |
Ceramic substrate for implantable medical devices
The present invention relates to multi-layer ceramic packaging of hybrid micro-electronic devices, including those for implantable medical devices. The invention permits size reduction and design...
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5855993 |
Electronic devices having metallurgies containing copper-semiconductor compounds
Silicon and germanium containing materials are used at surface of conductors in electronic devices. Solder can be fluxlessly bonded and wires can be wire bonded to these surfaces. These material...
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