|
Match
|
Document |
Document Title |
|
|
8178156 |
Surface treatment process for circuit board
A surface treatment process for a circuit board is provided. The circuit board includes a substrate, a first circuit layer disposed on an upper surface of the substrate, and a second circuit layer...
|
|
|
8123962 |
***WITHDRAWN PATENT AS PER THE LATEST USPTO WITHDRAWN LIST***
Alternating self-assembling morphologies of diblock copolymers controlled by variations in surfaces
Methods for fabricating sublithographic, nanoscale microstructures arrays including openings and linear microchannels utilizing self-assembling block copolymers, and films and devices formed from...
|
|
|
8114300 |
Multi-layer method for formation of registered arrays of cylindrical pores in polymer films
Methods for fabricating sublithographic, nanoscale polymeric microstructures utilizing self-assembling block copolymers, and films and devices formed from these methods are provided.
|
|
|
8105644 |
Manufacturing method of printed circuit board
A screen plate having a plurality of openings is placed on a suspension substrate in which a plurality of conductive pads are formed. Conductive paste is moved in one direction on an upper surface...
|
|
|
8065798 |
Method of manufacturing printed circuit board
A fabrication method which can improve electrical properties, shorten processing time, and reduce the thickness of a chip package by achieving an ultra-thin fine circuit pattern. The method for...
|
|
|
8003160 |
Wiring substrate
A substrate is provided on which wires can be formed satisfactorily using a dispersion liquid of metal microparticles without causing disconnection or short circuit. The wiring substrate comprises...
|
|
|
7921799 |
Pattern forming apparatus and manufacturing apparatus using the same
A pattern forming apparatus comprises a surface treatment system and an ink jet system 14, where a solvent is sprayed from a solvent spray nozzle of the surface treatment system to surface of a...
|
|
|
7923059 |
Method of enabling selective area plating on a substrate
A method of enabling selective area plating on a substrate includes forming a first electrically conductive layer (310) over substantially all of the substrate, covering sections of the first...
|
|
|
7858147 |
Interconnect structure and method of fabricating the same
A method of fabricating an interconnect structure is described. A substrate is provided. A patterned interfacial metallic layer is formed on the substrate. An amorphous carbon insulating layer or a...
|
|
|
7790219 |
Printed component circuit with fluidic template
A method forms a plurality of pillars, the pillars arranged such that positions of the pillars control flow of a liquid, the plurality of pillars forming a fluidic template, the method dispenses...
|
|
|
7767099 |
Sub-lithographic interconnect patterning using self-assembling polymers
The present invention is directed to the formation of sublithographic features in a semiconductor structure using self-assembling polymers. The self-assembling polymers are formed in openings in a...
|
|
|
7748114 |
Method of forming conductive pattern
The present invention discloses a method of forming a conductive pattern including the steps of a) printing a conductive pattern onto a surface of a base material having a liquid repellent...
|
|
|
7585540 |
Method for manufacturing wiring substrate
A method for manufacturing a wiring substrate includes the steps of: (a) patterning a surface-active agent on a substrate having first and second areas to be remained on the first area; (b)...
|
|
|
7356921 |
Method for forming a conductive layer pattern
A method for forming a conductive layer pattern by selectively depositing droplets containing conductive material onto a porous receiving layer. Much of the conductive material is left on the...
|
|
|
7279195 |
Method of forming metal fine particle pattern and method of forming electroconductive pattern
A method of forming a metal fine particle pattern including forming a polymerization initiation layer on a support, wherein a polymer which has, in its side chain, a cross-linking group and a...
|
|
|
7276267 |
Method for the manufacture of an injection molded conductor carrying means
A method making possible the production of an injection molded conductor carrying means composed of a first supporting substrate and a second supporting substrate. The first supporting substrate...
|
|
|
7147795 |
Method for surface treatment
A method for surface treatment includes: a first step in which a surface treatment apparatus 1 and a substrate 10 in a state where a front surface 102 of the substrate 10 faces the surface...
|
|
|
7125586 |
Kinetic spray application of coatings onto covered materials
Disclosed is a process for applying a kinetic spray coating of powder particles onto a substrate covered in a plastic-type material without first removing the plastic-type material. In one use of...
|
|
|
7063762 |
Circuitized substrate and method of making same
A method of making a circuitized substrate such as a laminate chip carrier in which a polymer, e.g., Teflon, is used as a dielectric layer and a promotion adhesion layer of a polymer is used to...
|
|
|
6887512 |
Method for fabricating printed-wiring substrate
A method for fabricating a component board which includes forming a first main-face-side Au plating layer on surfaces of main-face-side connection terminals and a first back-face-side Au plating...
|
|
|
6875260 |
Copper activator solution and method for semiconductor seed layer enhancement
The present invention is directed to an activator solution and method for activating a copper-seeded surface to facilitate plating of copper onto the copper-seeded surface. The activator solution...
|
|
|
6623803 |
Copper interconnect stamping
A method of patterning a layer of copper on a material surface includes providing a stamp having a base and a stamping surface and providing a copper plating catalyst on the stamping surface. The...
|
|
|
6592943 |
Stencil and method for depositing solder
A method of depositing solder on a conductive region of a substrate comprising providing a substrate having a substrate aperture and a coefficient of thermal expansion. A polymeric stencil is also...
|
|
|
6582767 |
Metal pattern forming method
A method for forming a metal pattern by the micro-stamping process involves the steps of treating a substrate bearing a thin film of a reducing silicon polymer with a solution containing a salt of...
|
|
|
6560863 |
Method of producing wiring board
A method of producing a wiring board having a plurality of wiring layers each being located on an electrical insulation layer, in which an electrical insulation layer is formed on a substrate using...
|
|
|
6555170 |
Pre-plate treating system
The invention relates in general to a method of electroplating substrates where at least a portion of the substrate is coated with a solution containing a film forming amine and sufficient acid to...
|
|
|
6551650 |
Dip formation of flip-chip solder bumps
A process for fabricating a solder bump (113) includes providing an inorganic de-wetting substrate (102). In order to form a composite substrate (20), having the desired wetting/dewetting...
|
|
|
6548106 |
Method of applying corrosion inhibitor to parts mounted circuit board
The invention greatly improves an efficiency of a whole parts mounting process. In a method of applying a corrosion inhibitor to a parts mounted circuit board, a recess portion surrounding a part...
|
|
|
6544584 |
Process for removal of undesirable conductive material on a circuitized substrate and resultant circuitized substrate
A process for removal of undesirable conductive material (e.g., catalyst material and seeped circuit material) on a circuitized substrate and the resultant circuitized substrates disclosed. Such...
|
|
|
6524663 |
Method for selective activation and metallization of materials
An activated substrate surface suitable for electronics and microsystems preparation is prepare by contacting the surface with a surface activation compound, e.g. organometallic based on palladium,...
|
|
|
6521285 |
Method for printing a catalyst on substrates for electroless deposition
Methods for electroless deposition of conductive material on a substrate using in both cases a stamp having a patterned surface which is pressed onto the surface of a substrate for printing the...
|
|
|
6517893 |
Method of manufacture of printed wiring boards having multi-purpose finish
A printed wiring board (PWB) and a method of manufacturing the same. In one embodiment, the PWB includes: (1) a substrate having a conductive trace located thereon and (2) a multi-purpose finish...
|
|
|
6513239 |
Method of fabricating an alloy film on a face of a heat exchanger for an integrated circuit
An alloy film is fabricated, on the face of a heat exchanger for an integrated circuit, by a process that dispenses various liquids onto the heat exchanger's face. To prevent those liquids from...
|
|
|
6495199 |
Method for deposition of a viscous material on a substrate
A method and apparatus for carrying out the deposition of a paste like and/or viscous material, such as solder paste, on a substrate through the apertures or openings of a stencil are provided for...
|
|
|
6485568 |
Apparatus for coating substrates with materials, particularly for lacquering si-wafers
In an apparatus for coating substrates with materials, particularly for lacquering Si-wafers (9) with photosensitive material, comprising a treating chamber (1,16) holding a carrier (10) (chuck)...
|
|
|
6485778 |
Method of applying an adhesive material to lead fingers of a lead frame
A method and apparatus for achieving a level exposed surface of an adhesive material pool for applying the adhesive material to lead fingers of a lead frame by contacting the lead fingers with the...
|
|
|
6485892 |
Method for masking a hole in a substrate during plating
Through-holes in a substrate are masked during plating of the substrate by substantially filling the through-holes with a liquid material, followed by applying a photoimageable material to an...
|
|
|
6475555 |
Process for screening features on an electronic substrate with a low viscosity paste
A process wherein a low viscosity, metal-containing paste is screened onto a ceramic greensheet and then sets up to increase its viscosity. In one method, the low viscosity is caused by excess...
|
|
|
6468582 |
Method of solder pre-coating and solder pre-coated circuit board
The solder pre-coating method including cleaning by dry etching a surface of a gold film on a surface of an electrode formed on a circuit board by covering the surface of the circuit board with a...
|
|
|
6461678 |
Process for metallization of a substrate by curing a catalyst applied thereto
An improved additive process for metallization of substrates is described whereby a catalyst solution is applied to a surface of a substrate. Metallic catalytic clusters can be formed in the...
|
|
|
6458411 |
Method of making a mechanically compliant bump
Mechanically compliant bumps for flip-chip bonding have a base that is deposited, for example, on the contact pad of a semiconductor chip. A thin wall depends from the periphery of the upper...
|
|
|
6355298 |
Placement system apparatus and method
An apparatus and a method are disclosed for placing at least two elements on a surface. The apparatus comprises means for supplying a surface, means for transferring the two elements to the...
|
|
|
6344309 |
Polysilane composition for forming a coating suitable for bearing a metal pattern, metal pattern forming method, wiring board preparing method
A metal pattern is prepared by applying a polysilane composition comprising a polysilane, a carbon functional silane, and a solvent onto a substrate to form a patterned coating of the polysilane...
|
|
|
6344242 |
Sol-gel catalyst for electroless plating
A sol-gel catalyst composition for electroless plating includes a metal alkoxide in a polar organic solvent, an acid, a chloride salt or acid chloride, and a catalytic metallic salt. The sol-gel...
|
|
|
6344234 |
Method for forming reflowed solder ball with low melting point metal cap
A method and structure for a solder interconnection, using solder balls for making a low temperature chip attachment directly to any of the higher levels of packaging substrate is disclosed. After...
|
|
|
6342266 |
Method for monitoring solder paste printing process
The invention relates to a method for monitoring the paste printing process in the setting and soldering of a circuit board. In the paste printing process, solder paste (5) is spread on the circuit...
|
|
|
6326058 |
Device for patterning a substrate with patterning cavities
A patterning device comprises a patterning cavity which has an opening located at the surface of the patterning device within a transfer region, where a substrate during patterning comes into...
|
|
|
6274198 |
Shadow mask deposition
A method of depositing material on a substrate using a shadow mask. The mask includes a plurality of etched features which correspond to a plurality of features in the substrate. Spheres are...
|
|
|
6207220 |
Dual track stencil/screen printer
A dual track stencil system includes a first set of rails and a second set of rails, each of the rails being independently controlled for allowing for independent movement of circuit boards through...
|
|
|
6207351 |
Method for pattern seeding and plating of high density printed circuit boards
The method for forming circuitization of the present invention provides a circuitized product which does not have a blanket seed layer and only has seed layer under the metal circuitization. Thus,...
|