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7632428 |
Doped semiconductor nanocrystals and methods of making same
A method of synthesizing doped semiconductor nanocrystals. In one embodiment, the method includes the steps of combining a metal oxide or metal salt precursor, a ligand, and a solvent to form a...
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7611747 |
Insulating material, method for producing insulating material, method for manufacturing multilayer circuit board
This invention provides a material for a multi-layer circuit board, excellent in insulating property and burying properties and free from occurrence of cracks, a production method, and a...
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7604834 |
Formation of dielectric film by alternating between deposition and modification
The present invention discloses a method including: providing a substrate; and sequentially stacking layers of two or more diamond-like carbon (DLC) films over the substrate to form a composite...
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7585541 |
Printed wiring board and method for manufacturing the same
A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film...
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7575776 |
Reflowing of a phase changeable memory element to close voids therein
A phase changeable memory element is formed by conformally forming a phase changeable material film in a contact hole on a substrate so as to create a void in the phase changeable material film in...
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7572480 |
Method of fabricating a multilayer ceramic heating element
A multilayer ceramic structure is formed by building up a plurality of layers by sequentially coating a substrate with a series of suspensions comprising particles in a fluid medium. A composition...
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7572481 |
Pattern forming method and pattern forming apparatus
A pattern forming method, for laminating a layer of a pattern on a base by supplying to the base a material for forming the pattern from a supply section for supplying the material based on...
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7537668 |
Method of fabricating high density printed circuit board
A method of fabricating a high density printed circuit board by applying a strippable adhesive layer on a reinforced substrate (rigid substrate or carrier film) used as a base substrate, forming a...
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7507434 |
Method and apparatus for laminating a flexible printed circuit board
An approach is provided for laminating layers for a flexible printed circuit board. The approach includes a method and apparatus for providing a base substrate and the surface of the base substrate...
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7498064 |
Laser reflowing of phase changeable memory element to close a void therein
A phase changeable memory element is formed by conformally forming a phase changeable material film in a contact hole on a substrate so as to create a void in the phase changeable material film in...
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7479297 |
Method of manufacturing a multi-layered wiring board
There provided a method of manufacturing a multi-layered wiring board having at least two conductor layers, an interlayer insulation layer provided between the conductor layers, and a conductor...
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7459325 |
MEMS passivation with transition metals
Organic surfactants are employed to passivate the surfaces of MEMS devices, such as digital micromirrors. The binding of these surfactants to the surface is improved by first associating with the...
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7455816 |
Support plate for carrying out functional tests on biological cells and method for coating the support plate
The invention relates to a method for coating a support plate for carrying out functional tests on biological cells, to a support plate for carrying out functional tests on biological cells and to...
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7445952 |
Method of forming laminate and method of manufacturing photovoltaic device
A method of forming a laminate and a method of manufacturing a photovoltaic device using the laminate are provided. The laminate forming method includes a first step of forming an intermediate...
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7438945 |
Method of producing multilayer interconnection board
A method of producing a multilayer interconnection board is disclosed that includes the steps of processing a resin member on an interconnection layer by imprinting press, and removing residue of...
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7425346 |
Method for making hybrid dielectric film
A method of forming a hybrid inorganic/organic dielectric layer on a substrate for use in an integrated circuit is provided, wherein the method includes forming a first dielectric layer on the...
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7418780 |
Method for forming stacked via-holes in a multilayer printed circuit board
An exemplary method for forming stacked via-holes in a multilayer printed circuit board includes the steps of: providing a base circuit board; attaching a first copper-coated-substrate having a...
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7416759 |
Wiring pattern formation method, wiring pattern, and electronic device
In a method of forming a wiring pattern, a plurality of electrical wirings deposited to be multilayered are conductively connected to one another through a conducting post. The method has forming...
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7399399 |
Method for manufacturing semiconductor package substrate
A method for manufacturing a semiconductor package is proposed. A circuit board with a circuit layer on at least one surface thereof is provided. The circuit board has at least one free area, and...
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7370412 |
Method for connecting electronic device
An electronic device connecting method according to a first aspect of the present invention includes: mounting an electronic device having at least one electrode portion on a sheet-like porous...
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7337537 |
Method for forming a back-drilled plated through hole in a printed circuit board and the resulting printed circuit board
A method for forming a back-drilled plated through hole in a printed circuit board and the resulting printed circuit board are described herein. In the preferred embodiment, the printed circuit...
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7325304 |
Method of connecting probe pin to circuit board and method of manufacturing probe card
There is provided a method of manufacturing a probe card that electrically connects a testing device and a device under test to transmit a signal between the testing device and the device under...
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7320173 |
Method for interconnecting multi-layer printed circuit board
A method for fabricating a multi-layer printed circuit board can include forming an etching resist layer on a first metal layer having plating grooves that selectively expose the first metal layer,...
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7290332 |
Method of constructing an interposer
According to one aspect of the present invention, a method of constructing an interposer is provided. A conductive layer is formed on a nonconductive layer. The conductive layer has via portions,...
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7285305 |
Multilayered wiring board, method of producing multilayered wiring board, electronic device and electronic apparatus
A method of producing a multilayered wiring board having at least two wiring layers (wiring patterns 17, 31 ), polyamide 22 (an interlayer insulation film) between the wiring layers, and an...
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7281328 |
Method of fabricating rigid-flexible printed circuit board
The present invention is related to a method of fabricating a rigid-flexible printed circuit board. Specifically, this invention relates to a method of fabricating a rigid-flexible printed circuit...
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7240431 |
Method for producing multilayer printed wiring board, multilayer printed wiring board, and electronic device
A plating resist film 2 is formed on a wiring board substrate 1 as a core material of a multilayer printed wiring board, then a through-hole 3 is formed, and through-hole conductor 4 is...
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7229669 |
Thin-film deposition methods and apparatuses
Described are structures useful in microelectronic or MEMS devices such as atomic clocks, sensors, and RF switches, wherein a first material is deposited onto a substrate to define a first material...
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7225536 |
Precasting multi-layer PCB process
A pre-casting multi-layer PCB process has steel plate mold engraved with circuitry and the epoxy coated on the mold for the epoxy to cover up a fiber glass substrate; conductive material coated on...
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7223349 |
Method and apparatus for surface processing of printed wiring board
A printed wiring board having a conductor pattern on which a pre-flux film of a stabilized quality is to be formed using a water-soluble pre-flux liquid. To this end, such an apparatus is used...
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7213334 |
Method for manufacturing double-sided flexible printed board
A double-sided flexible printed board is manufactured by: (a) forming a polyimide precursor layer on a metal layer; (b) forming an upper circuit layer on the polyimide precursor layer by a...
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7214419 |
Conductive paste multilayered board including the conductive paste and process for producing the same
A conductive paste is provided, which has good conductivity and good adhesiveness to substrates and has good long-lasting stability of these properties, and which, when applied to a through-hole of...
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7175876 |
Patterned coating method employing polymeric coatings
Patterned articles can be prepared by applying a release polymer to a substrate in a desired pattern, applying a substrate-adherent polymer over the pattern and substrate, and mechanically removing...
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7140103 |
Process for the production of high-density printed wiring board
Process for producing a high-density printed wiring board, comprising:
providing an ultrathin-copper-foil-clad board having a hole and outermost copper foil thickness of 5 μm or less,...
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7107668 |
Method of manufacturing a longitudinal microsolenoid
A photosensitive material is coated on an insulating material ( 13 ) stacked on a substrate ( 1 ) (FIG. 16 A), and exposed and developed using a mask having a light-shielding film capable of...
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7086138 |
Method of forming a feature having a high aspect ratio
A method for forming high aspect ratio metallization on a wafer is implemented in the formation of a disc drive recording head. The process involves patterning photoresist where metal is to be...
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7045198 |
Prepreg and circuit board and method for manufacturing the same
The present invention provides a prepreg and a circuit board that can achieve, e.g., low interstitial via connection resistance, excellent connection stability, and high durability, regardless of...
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7036222 |
Method for forming a multi-layer circuit assembly
A method of making a multi-layer circuit assembly includes providing a core structure including an inner dielectric element having first and second metal layers on opposite surfaces thereof,...
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7028400 |
Integrated circuit substrate having laser-exposed terminals
An integrated circuit substrate having laser-exposed terminals provides a high-density and low cost mounting and interconnect structure for integrated circuits. The laser-exposed terminals can...
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7017264 |
Method of manufacturing multilayer wiring board
The present invention provides a method of manufacturing a multilayer wiring board comprising the step of impregnating a raw material composition of a thermosetting resin in a porous laminated...
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7011862 |
Method for producing wiring substrate
An object of the invention is to prevent the color on a surface of a plated metal layer from changing. The invention is a wiring substrate obtained by forming a wiring conductor made of a metal...
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6996903 |
Formation of multisegmented plated through holes
A method and structure relating to multisegmented plated through holes. A substrate includes a dielectric layer sandwiched between a first laminate layer and a second laminate layer. A through hole...
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6975453 |
Multilayer electrically conductive anti-reflective coating
The present invention comprises a multilayer inorganic anti-reflective coating with predetermined optical properties, for application on a flexible substrate. The coating comprises a stack...
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6966110 |
Fabrication of liquid emission device with symmetrical electrostatic mandrel
A method of fabricating a liquid emission device includes a chamber having a nozzle orifice. Separately addressable dual electrodes are positioned on opposite sides of a central electrode. The...
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6953600 |
Conductive film forming composition, conductive film, and method for forming the same
There are provided a conductive film forming composition capable of forming wiring or an electrode which can be suitably used in a variety of electronic devices, easily and inexpensively, a method...
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6952871 |
Method for manufacturing printed circuit boards
It consists of making a first engraving over a first face of a panel of electro-conducting material to form some reliefs and depressions corresponding to future tracks and intermediate tracks;...
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6921551 |
Plating method and apparatus for controlling deposition on predetermined portions of a workpiece
The present invention relates to methods and apparatus for plating a conductive material on a workpiece surface in a highly desirable manner. Using a workpiece-surface-influencing device, such as a...
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6899829 |
Conductive polymer colloidal compositions with selectivity for non-conductive surfaces
A conductive polymer colloidal composition that selectively forms a coating on a non-conductive surface. The conductive polymer colloidal composition is composed of a polymer and a sulfonate...
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6889432 |
Method of manufacturing double-sided circuit board
A method for manufacturing a double-sided circuit board from a board material having a first electric conductor layer and a first electrically insulating layer, including the steps of: making...
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6875260 |
Copper activator solution and method for semiconductor seed layer enhancement
The present invention is directed to an activator solution and method for activating a copper-seeded surface to facilitate plating of copper onto the copper-seeded surface. The activator solution...
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