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7632535 Smooth surface morphology chlorate anode coating  
The present invention relates to an electrocatalytic coating and an electrode having the coating thereon, wherein the coating is a mixed metal oxide coating, preferably ruthenium, titanium and tin...
7632428 Doped semiconductor nanocrystals and methods of making same  
A method of synthesizing doped semiconductor nanocrystals. In one embodiment, the method includes the steps of combining a metal oxide or metal salt precursor, a ligand, and a solvent to form a...
7597928 Material composition for packaging of light-sensitive components and method of using the same  
The invention pertains to a material composition for packaging. The composition comprises (a) an epoxy resin and (b) a curing agent, wherein the mixing ratio of said epoxy resin to said curing...
7569505 Method for producing an electronic component passivated by lead free glass  
The invention relates to a method for the production of glass-coated electric components, wherein the components are, inter alia, passivated by the application of the glass. The lead-free glass...
7569250 Method, system, and apparatus for protective coating a flexible circuit  
A process for applying a protective coating to a flex circuit comprises providing a flex circuit having conductive traces on one surface and applying a protective coating in substantially a liquid...
7537668 Method of fabricating high density printed circuit board  
A method of fabricating a high density printed circuit board by applying a strippable adhesive layer on a reinforced substrate (rigid substrate or carrier film) used as a base substrate, forming a...
7517553 Adhesive aid composition  
The present invention provides an adhesive aid composition having excellent adhesive strength to polyimide films without decreasing mechanical properties and being useful in the field of electric...
7479653 UV curable protective encapsulant  
The present invention discloses encapsulant materials for use in glob top and/or dam and fill applications comprising base oligomer/monomers preferably having an acrylated/methacrylated or...
7459325 MEMS passivation with transition metals  
Organic surfactants are employed to passivate the surfaces of MEMS devices, such as digital micromirrors. The binding of these surfactants to the surface is improved by first associating with the...
7368491 Phosphorus-containing silazane composition, phosphorus-containing siliceous film, phosphorus-containing siliceous filler, method for producing phosphorus-containing siliceous film, and semiconductor device  
An objective of the present invention is to provide a phosphorous-containing siliceous material having a specific permittivity of not more than 3.5. The phosphorus-containing silazane composition...
7303944 Microelectronic devices having underfill materials with improved fluxing agents  
Microelectronic packages formed by using novel fluxing agents are disclosed. In one aspect, a microelectronic package may include a microelectronic device, a substrate, and an interconnect...
7297370 Curable encapsulant composition, device including same, and associated method  
An encapsulant for encapsulating electronic components and a method of making and/or using the encapsulant may be provided. An electronic device that includes the encapsulant may be provided. The...
7223525 Process for generating a hard mask for the patterning of a layer  
A process for generating a hard mask for the patterning of a first layer includes applying a second layer, which includes carbon, to the first layer that is to be patterned. A third layer, which...
7219421 Method of a coating heat spreader  
A coated heat spreader for a die includes a body and a coating on a surface of the body, wherein the outermost coating is an organic surface protectant. An IC package includes a die thermally...
7201022 Systems and methods for filling voids and improving properties of porous thin films  
Methods of reducing the intrusions or migrations of photolithography materials by introducing a sol-gel layer onto a porous thin film prior to applying the photolithography/photoresist material...
7080447 Method of manufacturing solder mask of printed circuit board  
A solder mask manufacturing method adapted to apply a solder mask on a surface of a substrate of a circuit board, said surface is provided with a conductor pattern having an unsheltered portion and...
7026376 Fluxing agent for underfill materials  
An underfill material, such as a no flow underfill material, containing an anhydride adduct of a rosin compound is disclosed. In one aspect, the anhydride adduct of a rosin compound contains an...
7020959 Method of making conductive stud for magnetic recording devices  
Methods of making a magnetic recording device with an “anchored” conductive stud which is securely attached within its surrounding insulator materials. The conductive stud is formed over a...
6905726 Component having at least two mutually adjacent insulating layers and corresponding production method  
The invention relates to a component having two adjacent insulating layers and to a production process therefore. The component has an activated insulating layer, which can be converted into an...
6761926 Method for compressing viscous material through openings  
A novel apparatus for compressing viscous material through openings in a stencil is disclosed. The novel apparatus has a compression head cap which provides a contained environment to direct and to...
6761790 Wiring board and method of manufacturing the same  
The present invention provides a method of manufacturing a wiring board, including the steps of forming a through hole on a prepreg having a releasing resin film on at least one of its surfaces,...
6754952 Process for manufacturing multiple layer wiring substrate onto which thin film capacitor is incorporated  
A process facilitates manufacturing a multiple layer wiring board having therein a thin-film capacitor The process includes: forming a metallic film layer having a barrier metal layer and a metal...
6752878 Process for treating adhesion promoted metal surfaces  
A method for treating a micro-roughened metal surface to improve bonding between the metal surface and a polymer material. The method involves post-treating the micro-roughened conversion coated...
6753033 Method of manufacturing ceramic thick-film printed circuit board  
A method of printing high-quality high-density circuit pattern in a production of a ceramic thick-film printed circuit board. The method comprises forming a resin layer for prevention of sagging on...
6746710 Screen printing  
A screen printing head for a method of applying a pasty product to a printing screen, the printing head comprising: a main body ( 30 ); wiper blades ( 31, 32 ) disposed to the main body for...
6746708 Disposable plate electrode with biologicalactive film and manufacture method thereof  
A manufacture method for forming a disposable plate electrode with biological active film is used to cooperate with a biological sensor for analyzing composition and measuring concentration of a...
6743477 Method for partially plating on a base  
A base of synthetic resins or other materials is partially plated. The base includes not only a single base but an assembly with a number of chip bases for producing electronic and electric parts...
6743319 Adhesiveless transfer lamination method and materials for producing electronic circuits  
An electronic circuit is made by printing a Parmod® composition on a temporary substrate and curing it to produce a pattern of metal conductors. The conductors are laminated to a substrate under...
6735865 Flexible circuit board and method of fabricating the same  
A process of forming a flexible circuit board for ink jetting is provided. The process includes the steps of: providing an insulation tape; forming conductive traces on the insulation tape; and...
6730802 Silicon carbide precursor  
The compound 2,4,6-trimethyl-2,4,6-trisila heptane, the preparation thereof, and the use thereof as a silicon carbide precursor in chemical vapor deposition and infiltration procedures are disclosed.
6730605 Redistribution of copper deposited films  
A method to redistribute solid copper deposited by PVD on a wafer topography. The deposited copper is solubilized in a fluid for redistribution. The copper redistribution prevents inherent...
6730358 Method for depositing conductive paste using stencil  
A method for depositing a conductive paste is disclosed. The method comprises aligning apertures in a stencil with conductive regions on a circuit structure, and screening conductive paste into...
6730183 Laminated ceramic electronic components and manufacturing method therefor  
A manufacturing method for a laminated ceramic electronic component is performed such that the thickness of the inner electrode is greatly increased, delamination does not occur, and reliability is...
6725528 Microsolenoid coil and its manufacturing method  
A photosensitive material is coated on an insulating material ( 13 ) stacked on a substrate ( 1 ) (FIG. 16 A), and exposed and developed using a mask having a light-shielding film capable of...
6722275 Reservoir stencil with relief areas and method of using  
A stencil comprising two or more layers is disclosed for applying surface mount materials onto printed circuit boards, flexible circuits, wafers or other substrates. The stencil can accommodate...
6723199 Lamination method  
A lamination method, which is a method in which a dry resist film, formed by providing a color resist layer on a base film, is cut based upon the length of a substrate in the feeding direction, and...
6715524 DFR laminating and film removing system  
A DFR laminating and PET removing system which is capable of both laminating a dry film resist (DFR) layer on a semiconductor wafer and removing a DFR support film such as polyethylene terepthalate...
6709806 Method of forming composite member  
Disclosed is a method of manufacturing a composite member in which a conductive portion is selectively formed in an insulator. The method comprises the steps of forming a photosensitive composition...
6703186 Method of forming a conductive pattern on a circuit board  
A method of forming a conductive circuit pattern on a circuit board having a first region, on which a desired conductive circuit pattern is to be formed, and a second region. The method includes...
6699350 Dielectric structure and method of formation  
A method for forming a dielectric structure. A first layer is formed, wherein the first layer includes a first fully cured photoimageable dielectric (PID) material. A sticker lays is nonadhesively...
6695200 Method of producing electronic part with bumps and method of producing electronic part  
Forming solder bumps each having a constant height by surely supplying onto each of electrode pads a solder ball corresponding to a predetermined volume while omitting Au plating performed on the...
6696173 Conducting path structures situated on a non-conductive support material, especially fine conducting path structures and method for producing same  
Described are conductor track structures on a nonconductive support material, especially fine conductor track structures, which are comprised of a base containing a heavy metal and a metallized...
6671950 Multi-layer circuit assembly and process for preparing the same  
A process for fabricating a multi-layer circuit assembly is provided comprising the following steps: (a) providing a perforate electrically conductive core having a via density of 500 to 10,000...
6670022 Nanoporous dielectric films with graded density and process for making such films  
The present invention relates to nanoporous dielectric films and to a process for their manufacture. A substrate having a plurality of raised lines on its surface is provided with a relatively high...
6667073 Leadframe for enhanced downbond registration during automatic wire bond process  
A process for enhancing visual detectability of a leadframe having a die attach pad and a plurality of contacts, during automated wirebonding in the production of an integrated circuit package. At...
6663712 Dual track stenciling system with solder gathering head  
A dual track stencil system includes a first set of rails and a second set of rails, each of the rails being independently controlled for allowing for independent movement of circuit boards through...
6663798 Conductive paste, outer electrode and process for producing the same  
The present invention provides a conductive paste for an outer electrode of an electronic part comprising glass frit, a vehicle and conductive particles, wherein the glass frit comprises (1)...
6656274 Device for the dosing and distribution of hotmelt  
A device for dosing and distribution of hotmelt on a substrate is provided. The device includes substrate throughput, hotmelt supply, at least one hotmelt application position with a stencil,...
6652688 Process for producing semiconductor wafer with adhesive film  
A process for producing a semiconductor wafer having an adhesive film, by adhering an adhesive film onto a bump-formed surface of a semiconductor wafer having formed thereon bumps with a...
6652697 Method for manufacturing a copper-clad laminate  
A method for manufacturing a copper-clad laminate includes the steps of forming first and second metal films on first and second carriers, forming first and second copper films on the first and...
Matches 1 - 50 out of 207 1 2 3 4 5 >