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7381442 |
Porogens for porous silica dielectric for integral circuit applications
The invention relates to the production of nanoporous silica dielectric films and to semiconductor devices and integrated circuits comprising these improved films. The nanoporous films of the...
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7381441 |
Low metal porous silica dielectric for integral circuit applications
The invention relates to the production of nanoporous silica dielectric films and to semiconductor devices and integrated circuits comprising these improved films. The nanoporous films of the...
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7374977 |
Droplet discharge device, and method for forming pattern, and method for manufacturing display device
It is an object of the present invention to improve the usability of a material, and to provide a display device which can be manufactured by simplifying the manufacturing process and a...
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7356905 |
Method of fabricating a high frequency ultrasound transducer
Techniques for fabricating high frequency ultrasound transducers are provided herein. In one embodiment, the fabrication includes depositing a copperclad polyimide film, a layer of epoxy on the...
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7351357 |
Printing of organic conductive polymers containing additives
Additives to organic conducting polymers are described which enhance adhesion and resolution of printed films while retaining adequate electrical conductivity. The conductive polymer films are...
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7350297 |
Method of manufacturing a wiring substrate
A first plating foundation layer is formed by printing on a front face of a sheet-shaped insulating substrate. By inserting a punch into the sheet-shaped insulating substrate having the first...
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7338689 |
Composition for forming low dielectric thin film including siloxane monomer or siloxane polymer having only one type of stereoisomer and method of producing low dielectric thin film using same
Disclosed herein is a composition for forming a low dielectric thin film, which includes silane monomers having only any one of stereoisomer, or a siloxane polymer produced by polymerizing the...
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7311937 |
Method for forming a line pattern, line pattern, and electro-optic device
The invention provides a method for forming a uniform conductive-film interconnecting pattern via simplified processes. In particular, the invention provides: a method for forming an...
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7297361 |
In-line deposition processes for circuit fabrication
A method for circuit fabrication includes positioning first and second webs of film in proximity to each other, wherein the second web of film defines a deposition mask, and deposition material on...
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7297360 |
Insulation film
An insulation film comprising an organosilicon polymer and an organic polymer such as polyarylene, polyarylene ether, polyimide, and fluororesin is disclosed, wherein the organosilicon polymer has...
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7293691 |
Electronic substrate printing
A system for depositing solder paste on a print window of a printed circuit board through a stencil includes a housing providing a printing chamber, a depositor configured to move relative to the...
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7276267 |
Method for the manufacture of an injection molded conductor carrying means
A method making possible the production of an injection molded conductor carrying means composed of a first supporting substrate and a second supporting substrate. The first supporting substrate...
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7267839 |
Method of and apparatus for applying liquid material
Disclosed is a method, in which when a liquid material is applied to the application surface of an object of application by using a liquid material supply device having a syringe containing the...
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7238306 |
Conformal tribocharge-reducing coating
Tribocharging-reducing conformal coating are provided for a flexible circuit, which reduce tribocharge voltage of a coated flexible circuit to less than about 15V, preferably less than about 10 V....
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7232496 |
Multilayer ceramic electronic part, circuit board and method for producing ceramic green sheet used for manufacturing those part and circuit board
The present invention provides a method for manufacturing an electronic part that can cope with downsizing, improvement in performance and quality of a multilayer electronic part. A ceramic green...
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7229502 |
Method of forming a silicon nitride layer
A method of forming a silicon nitride layer is provided. A deposition furnace having an outer tube, a wafer boat, a gas injector and a uniform gas injection apparatus is provided. The wafer boat is...
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7226634 |
Designing a plated pattern in printed writing board
The plating method comprises the steps of dividing a region, to be plated, into a group of mesh-like zones, measuring a plating area of each of the zones, comparing the measurement values of the...
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7213334 |
Method for manufacturing double-sided flexible printed board
A double-sided flexible printed board is manufactured by: (a) forming a polyimide precursor layer on a metal layer; (b) forming an upper circuit layer on the polyimide precursor layer by a...
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7211205 |
High conductivity inks with improved adhesion
Conductive ink compositions which can be cured to highly conductive metal traces by means of “chemical welding” include adhesion promoting additives for providing improved adhesion of the...
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7201022 |
Systems and methods for filling voids and improving properties of porous thin films
Methods of reducing the intrusions or migrations of photolithography materials by introducing a sol-gel layer onto a porous thin film prior to applying the photolithography/photoresist material...
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7189302 |
Multi-layer printed circuit board and fabricating method thereof
A fabricating method for a multi-layer printed circuit board is provided. The method may include attaching a releasing film at upper and lower surfaces of a center layer and attaching a first metal...
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7179503 |
Method of forming thin metal films on substrates
A solution containing a metal component of composite ultrafine metal particles each having a core substantially made of metal component and a covering layer made of an organic compound chemically...
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7175876 |
Patterned coating method employing polymeric coatings
Patterned articles can be prepared by applying a release polymer to a substrate in a desired pattern, applying a substrate-adherent polymer over the pattern and substrate, and mechanically removing...
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7172925 |
Method for manufacturing printed wiring board
There is provided a method for manufacturing a flat printed wiring board in which spaces between circuit patterns are filled with a resin. The method comprises: laminating via a mold release film a...
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7141184 |
Polymer conductive composition containing zirconia for films and coatings with high wear resistance
A resistive composition for screen printing onto a substrate to form a cured film. The resistive composition, based on total composition, has a) 5–30 wt. % of polymer resin, b) 10–30 wt. %...
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7135204 |
Method of manufacturing a wiring board
A method of manufacturing a wiring board is provided. The method includes performing a plating process to a land, in a condition that a resist film having an opening for exposing at least the...
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7132219 |
Polymeric antireflective coatings deposited by plasma enhanced chemical vapor deposition
An improved method for applying polymeric antireflective coatings to substrate surfaces and the resulting precursor structures are provided. Broadly, the methods comprise plasma enhanced chemical...
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7107668 |
Method of manufacturing a longitudinal microsolenoid
A photosensitive material is coated on an insulating material ( 13 ) stacked on a substrate ( 1 ) (FIG. 16 A), and exposed and developed using a mask having a light-shielding film capable of...
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7087292 |
Solid electrolytic capacitor and method for producing the same
A solid electrolytic capacitor comprises an electrically conducting polymer composition formed on the surface of an oxide film which is formed on a valve-acting metal, by specifying the viscosity...
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7081421 |
Lanthanide oxide dielectric layer
A ruthenium gate for a lanthanide oxide dielectric layer and a method of fabricating such a combination gate and dielectric layer produce a reliable structure for use in a variety of electronic...
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7081304 |
Surface conductive resin, process for forming the same and wiring board
The present invention aims to provide a surface-conductive resin suitable for wiring boards, and the like, a process for forming the resin efficiently, and a wiring board using the...
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7080447 |
Method of manufacturing solder mask of printed circuit board
A solder mask manufacturing method adapted to apply a solder mask on a surface of a substrate of a circuit board, said surface is provided with a conductor pattern having an unsheltered portion and...
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7063762 |
Circuitized substrate and method of making same
A method of making a circuitized substrate such as a laminate chip carrier in which a polymer, e.g., Teflon, is used as a dielectric layer and a promotion adhesion layer of a polymer is used to...
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7056448 |
Method for forming circuit pattern
A method for forming a circuit pattern includes at least a step (a) of subjecting a non-conductor to electroless copper plating to form a copper film and a step (b) of etching the copper film so as...
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7041331 |
Electronic device manufacture
Compositions suitable for use as underfill materials in an integrated circuit assembly are provided. Also provided are methods of preparing integrated circuit assemblies containing certain...
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7037448 |
Method of producing a conductor paste
The present invention provides a conductor composition that can form a conductor pattern having a good shape precision and a method for producing an electronic component using the composition. This...
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7037447 |
Conductive ink compositions
The present invention provides a thermoset conductive ink for use in through hole interconnections or similar electric and electronic applications to provide stable electrical connections. The...
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7028400 |
Integrated circuit substrate having laser-exposed terminals
An integrated circuit substrate having laser-exposed terminals provides a high-density and low cost mounting and interconnect structure for integrated circuits. The laser-exposed terminals can...
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7022373 |
Method of forming composite insulating layer and process of producing wiring board
A method of forming a composite insulating layer in which a thin and uniform adhesive layer can be formed, and an adhesive strength between an adhesive layer and a porous layer is sufficient, a...
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7017265 |
Method for manufacturing multilayer wiring board, and multilayer wiring board manufactured thereby
A method is provided for manufacturing a multilayer wiring board wherein good adhesion is achieved between an insulating layer and a wiring pattern. The multilayer wiring board has a laminar...
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7014727 |
Method of forming high resolution electronic circuits on a substrate
A method of forming high resolution electronic circuits ( 10 ) on a substrate ( 12 ) is provided. The method includes the steps of laminating a dielectric layer ( 14 ) on a substrate ( 12 ), laser...
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7011862 |
Method for producing wiring substrate
An object of the invention is to prevent the color on a surface of a plated metal layer from changing. The invention is a wiring substrate obtained by forming a wiring conductor made of a metal...
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6998148 |
Porous materials
Porous thermoset dielectric materials having low dielectric constants useful in electronic component manufacture are provided along with methods of preparing the porous thermoset dielectric...
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6996901 |
Production method of wired circuit board
A production method of a wired circuit board can prevent corrosion of a first thin metal film inwardly of a conductor layer, due to the forming of an undercut portion caused by a skirt portion of a...
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6996883 |
Method of manufacturing a multi-piezoelectric layer ultrasonic transducer for medical imaging
A transducer is tuned to a desired impedance by building piezoelectric assemblies of multiple layers, each layer acting as a parallel capacitor. Piezoelectric layers are preferably constructed by...
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6962726 |
Method for preparing substrate for flexible print wiring board, and substrate for flexible print wiring board
A method for preparing a substrate for a flexible print wiring board having a polyimide based resin layer wherein a solution of a polyimide based resin precursor is directly applied on an...
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6960540 |
Film formation method, semiconductor element and method thereof, and method of manufacturing a disk-shaped storage medium
Relative movement occurs between the in-process substrate and the dropping section. While the substrate is rotated, the dropping section is relatively moved from an approximate center of the...
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6959471 |
Method of manufacturing a droplet deposition apparatus
A method of manufacturing an ink jet print head includes the steps of bonding a body of piezoelectric material to a base plate and cutting channels into the piezoelectric material to form ink...
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6952871 |
Method for manufacturing printed circuit boards
It consists of making a first engraving over a first face of a panel of electro-conducting material to form some reliefs and depressions corresponding to future tracks and intermediate tracks;...
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6936302 |
Electroless Ni-B plating liquid, electronic device and method for manufacturing the same
There is provided an electroless Ni—B plating liquid for forming, a Ni—B alloy film on at least part of the interconnects of an electronic device having an embedded interconnect structure, the...
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