CobaltIP-faceted-search-demo
Match Document Document Title
8182594 Electroless nickel plating liquid  
An electroless nickel plating liquid capable of forming an underbarrier metal for metal bumps or solder bumps by electroless nickel plating with a uniform film thickness on silicon wafers composed...
8173220 Method of producing metal plated material  
The invention provides a method of producing a metal plated material, the method including: preparing a polymer solution containing a polymer; preparing a composition by mixing the polymer solution...
8168258 Method of producing a temperature sensor  
In a method of producing a temperature sensor including at least one lead wire of a non-noble metal or of an alloy containing a non-noble metal, at first a lead wire is attached to the temperature...
8137752 Method and apparatus for the treatment of individual filaments of a multifilament yarn  
A method and apparatus for treating the surfaces of individual filaments in multifilament yarn. The method includes the steps of immersing the yarn into a liquid treatment solution and coating all...
8128987 Apparatus and method for electroless deposition of materials on semiconductor substrates  
A method for electroless deposition from a deposition solution in a working chamber, where the process can include heating the deposition solution to its boiling point and subsequently reducing the...
8124174 Electroless gold plating method and electronic parts  
Part or whole of an electroless gold plating film of a plated film laminate including an electroless nickel plating film, an electroless palladium plating film and an electroless gold plating film...
8104425 Reagent activator for electroless plating  
A method for electroless plating of a substrate is provided that comprises exposing an electroless plating reagent comprising a metal to be plated and at least one reducing agent to a solid phase...
8101243 Method of making sulfur-resistant composite metal membranes  
The invention provides thin, hydrogen-permeable, sulfur-resistant membranes formed from palladium or palladium-alloy coatings on porous, ceramic or metal supports. Also disclosed are methods of...
8070860 Pd menbrane having improved H2-permeance, and method of making  
An H2-permeable membrane system (117) comprises an electroless-deposited plating (115) of Pd or Pd alloy on a porous support (110, 110′). The Pd plating comprises face-centered cubic crystals c...
8057678 Maintenance of metallization baths  
A method for the regeneration of an electrolyte bath used for an electroless metallization process. A partial flow of electrolyte is removed from the process vessel and regenerated by dialysis or...
8052858 Pretreatment method for electroless plating material and method for producing member having plated coating  
A resin material is brought into contact with a first solution containing ozone, and at the same time, ultraviolet rays are irradiated. The activation due to the treatment with ozone water and the...
8039045 Method of manufacturing a disk substrate for a magnetic recording medium  
An object of the present invention is to provide a plating method on a glass base plate. The method allows forming a plating film on a base plate composed of a glass material with excellent...
8034746 Method of manufacturing round wire using superconducting tape and round wire manufactured using the superconducting tape  
Disclosed herein is a method of manufacturing round wire using superconducting tape, including the steps of: slitting superconducting tape into superconducting tape strips; silver-coating the slit...
8021721 Composite coating with nanoparticles for improved wear and lubricity in down hole tools  
A method of modifying a bottomhole assembly that includes metal plating at least a portion of a bottomhole assembly, wherein the metal-plating comprises superabrasive nanoparticles is disclosed.
8007862 Nanowire grid polarizer and method of preparing the same  
Provided are a method of preparing a nanowire grid polarizer, and a nanowire grid polarizer prepared using the same. The method includes: mixing a surfactant and a silica precursor to prepare a...
7964069 Device for galvanic coating of a piston  
A device for galvanic coating of a piston has a pot-shaped interior for accommodating the piston and an electrolyte fluid, a holder device for fixing the piston in place, a cover that is structured...
7943199 Method of producing metal plated material, metal plated material, method of producing metal pattern material, and metal pattern material  
A method of producing a metal plated material, the method including: preparing a polymer solution containing a polymer; preparing a composition by mixing the polymer solution with a monomer at an...
7910164 Bifunctional magnetic core-semiconductor shell nanoparticles and manufacturing method thereof  
Provided are bifunctional magnetic core-semiconductor shell nanoparticles and a manufacturing method thereof. The method includes mixing magnetic core material precursors and a reducing agent for...
7897198 Electroless layer plating process and apparatus  
Electroless plating is performed to deposit conductive materials on work pieces such as partially fabricated integrated circuits. Components of an electroless plating bath are separately applied to...
7875110 Electroless plating bath composition and method of use  
An electroless plating composition comprising succinic acid, potassium carbonate, a source of cobalt metal ions, a reducing agent, and water is provided. An optional buffering agent may also be...
7846503 Process and electrolytes for deposition of metal layers  
The invention concerns an electrolyte for electroless deposition of metal layers with internal compressive stresses containing a metal base salt, a reducing agent, a complexing agent, an...
7833583 Method of recycling electroless nickel waste  
An electroless nickel plating bath is provided that utilizes hypophosphite ions as a reducing agent and is substantially free of sulphate and sodium ions. Spent nickel in the plating bath is...
7829152 Electroless plating method and apparatus  
An electroless plating system is provided. The system includes a first vacuum chuck supporting a first wafer and a second vacuum chuck supporting a second wafer such that a top surface of the...
7829153 Microwave-attenuating composite materials, methods for preparing the same, intermediates for preparing the same, devices containing the same, methods of preparing such a device, and methods of attenuating microwaves  
The present invention provides microwave attenuating, filled composite materials which contain a polymer or ceramic matrix and metallic tubules and processes for making the same and devices which...
7758681 Cobalt-based alloy electroless plating solution and electroless plating method using the same  
A cobalt-based alloy electroless plating solution according to the present invention comprises a cobalt precursor, a tungsten precursor, a phosphorus precursor, a reducing agent, a complexing...
7727596 Method for fabricating a composite gas separation module  
A method for fabricating a composite gas separation module includes depositing a preactivated powder over a porous substrate; depositing a binder metal onto the preactivated powder; and depositing...
7721425 Method for connecting electronic parts  
A method of connecting an electronic part, containing: forming an electroless nickel plating coat containing phosphorous on a substrate metal layer which constitutes a connecting terminal of an...
7704562 Process for improving the adhesion of polymeric materials to metal surfaces  
A process is disclosed for the purpose of increasing the adhesion of a polymeric material to a metal surface. The process comprises plating the metal surface with a layer of electroless nickel,...
7704307 Electroless palladium plating liquid  
An electroless palladium plating liquid, with excellent bath stability, that can provide a film with excellent corrosion resistance, solder bondability, and wire bondability is provided. The...
7691189 Printed wiring board and its manufacturing method  
The present invention is directed to a process for manufacturing multilayer printed circuit boards which is capable of simultaneous via hole filling and formation of conductor circuit and via holes...
7666471 Polyimide substrate and method of manufacturing printed wiring board using the same  
The present invention is directed to an improved method for metallizing polymer substrates, such as polyimides. The present invention comprises the steps of surface treating the polymer substrate...
7648913 Method of electroless deposition of thin metal and dielectric films with temperature controlled stages of film growth  
A film formation method is provided which includes positioning an object within an electroless deposition apparatus having means for instantaneous temperature control of the object and...
7645370 Plating resin molded article and process for producing the same  
The present invention is a plated resin molded article and process of producing the plated resin molded article, wherein metal plating is carried out on the surface of a thermoplastic resin molded...
7641781 Method for coating a substrate  
In a method for coating a substrate, and a coated object, in a first step, in an external current-less or electrolytic manner, nickel and/or cobalt and/or platinum are deposited on a substrate in a...
7611569 Electroless copper compositions  
Electroless copper and copper alloys plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright...
7582334 Method to accelerate wetting of an ion exchange membrane in a semi-fuel cell  
A new treatment method for ion exchange membranes used in semi-fuel cells that accelerates the wetting of the membranes by aqueous electrolyte solutions, thus reducing the start up time for...
7560016 Selectively accelerated plating of metal features  
To make a metal feature, a non-plateable layer is applied to a workpiece surface and then patterned to form a first plating region and a first non-plating region. Then, metal is deposited on the...
7559979 Hydrogen separator and method for production thereof  
A hydrogen separator is provided, including a porous substrate having a large number of pores communicating from a first surface to a second surface thereof, and having a hydrogen-separating layer...
7537799 Methods of forming electrically conductive pathways using palladium aliphatic amine complexes  
An ink-jettable composition including a palladium aliphatic amine complex solvated in a liquid vehicle can be used in formation of electronic devices. The ink-jettable composition containing a...
7531215 Hydrogen transport membrane fabrication method  
A method of forming a hydrogen transport membrane to separate hydrogen from a hydrogen containing feed in which a porous ceramic support is formed to support a dense layer of palladium or an alloy...
7527681 Electroless copper and redox couples  
Electroless copper plating baths are disclosed. The electroless copper baths are formaldehyde free and are environmentally friendly. The electroless copper baths are stable and deposit a bright...
7517555 Copper plating solution and method for copper plating  
A copper plating solution according to the present invention is characterized by that it comprising 0.03 mol/L to 0.5 mol/L of copper sulfate, 0.05 mol/L to 0.7 mol/L of ethylenediaminetetraacetic...
7510744 Process for producing a resin composition and electrophotographic fixing member  
A process for producing a resin composition having a high adhesion between a resin layer and a metallic layer as well as an excellent durability includes providing a porous structure at least on...
7501014 Formaldehyde free electroless copper compositions  
Electroless copper and copper alloy plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright...
7498062 Method and apparatus for applying a voltage to a substrate during plating  
A method for applying a strike voltage to one or more substrates during plating. During this method, the substrates are moved in a planetary manner while being held at their exterior edges by a set...
7476412 Method for the metalization of an insulator and/or a dielectric  
The invention relates to a process for the metallization of an insulator and/or a dielectric, wherein the insulator is firstly activated, it is subsequently coated with another insulator and the...
7476616 Reagent activator for electroless plating  
A method for electroless plating of a substrate is provided that comprises exposing an electroless plating reagent comprising a metal to be plated and at least one reducing agent to a solid phase...
7425256 Selective shield/material flow mechanism  
An apparatus and method for plating a workpiece. The apparatus comprises, generally, an anode, a cathode, and a selective anode shield/material flow assembly. In use, both the anode and the cathode...
7416763 Process for forming metal layers  
A process in which a base metal film is formed on the surface of a plastic film using a dry plating process, and a liquid containing an organic monomer is then brought in contact with the base...
7410650 Method of fabricating nano-silver fibers  
A method of fabricating nano-silver fibers is provided. An organic solution of a dispersant is prepared. Then, a silver salt and a reductant are added into the organic solution. The organic...