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7528350 |
Process for producing PTC element/metal lead element connecting structure and PTC element for use in the process
The present invention provides a novel method for electrical connection between a polymer PTC device and a metal lead element to thereby prevent the problems of the connection by caulking or...
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7524528 |
Precursor compositions and methods for the deposition of passive electrical components on a substrate
Precursor compositions for the deposition of electronic features such as resistors and dielectric components and methods for the deposition of the precursor compositions. The precursor compositions...
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7434475 |
Fabricated strain sensor
A method of forming a strain sensor from a polymeric film includes the steps of selectively irradiating a surface of the polymer with high energy radiation to change the composition of the polymer...
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7326889 |
PTC element and production process thereof
A method of manufacturing a PTC element comprising a pair of lead terminals bonded together by thermocompression with a matrix held therebetween comprises a matrix preparing step of preparing a...
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7215235 |
Conductive substrate with resistance layer, resistance board, and resistance circuit board
A conductive substrate with a resistance layer comprising a substantially flat high conductivity substrate roughening treated on its surface by a resistance component and provided with a resistance...
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7067324 |
Photon reducing agents for fluorescence assays
The present invention provides a method for reducing undesirable light emission from a sample using at least one photon producing agent and at least one photon reducing agent (e.g. dye-based photon...
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6858270 |
Liquid crystal imprinting
Oriented materials and methods for their formation are disclosed. The oriented material is formed by depositing an oriented component from an oriented liquid crystal medium. Oriented materials...
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6852393 |
Transparent substrate coated with a polymer layer
The invention relates to a transparent substrate coated on at least one of its faces with a polymer layer deposited under vacuum. This polymer layer is provided with an adhesion prelayer of organic...
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6841191 |
Varistor and fabricating method of zinc phosphate insulation for the same
A fabricating method and apparatus of an zinc phosphate coating for a varistor has a insulation formed on a surface of a body which does not include two opposite ends of the body formed two outer...
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6824603 |
Composition and method for printing resistors, capacitors and inductors
A composition of matter comprising a mixture of an oxide powder or powders and a Reactive Organic Medium (ROM) which can be used to create electronic components on a suitable. The materials are...
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6808740 |
Magnetoresistance effect film and method of forming same
A magnetoresistance effect film includes a substrate, a plurality of ferromagnetic particles disposed on the substrate, a nonmagnetic film deposited on the substrate and covering the plurality of...
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6787182 |
Resistor and method for producing the resistor
A method for producing a resistor. The method includes a process for printing, in a prescribed pattern, a mixed solution containing a good solvent having solubility to a binder good solvent, a...
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6725514 |
Method of making thick film pressure and temperature sensors on a stainless steel diaphragm
A method of making a low-cost metal diaphragm sensor that integrates both pressure and temperature sensing in a single sensor assembly utilizes thick-film processing to form a circuit including...
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6403145 |
High voltage thick film fuse assembly
A thick film fuse assembly for high voltage, high amperage, high reliability applications. In a first embodiment the fuse assembly consists of an insulative substrate on which a parallel array of...
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6315853 |
Method for manufacturing an ink jet recording head
A method for manufacturing an ink jet recording head by combining each of the processes to fabricate a heater board comprises (I) the first step of patterning a resistive layer on a substrate, (II)...
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6232144 |
Nickel barrier end termination and method
A method of providing nickel barrier end terminations for a zinc oxide semiconductor device with exposed body surfaces and end terminal regions, in which the device is controllably reacted with a...
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6221612 |
Photon reducing agents for use in fluorescence assays
The present invention provides a method for reducing undesirable light emission from a sample using at least one photon producing agent and at least one photon reducing agent (e.g. dye-based photon...
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6214563 |
Photon reducing agents for reducing undesired light emission in assays
The present invention provides a method for reducing undesirable light emission from a sample using at least one photon producing agent and at least one photon reducing agent (e.g. dye-based photon...
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6200762 |
Photon reducing agents and compositions for fluorescence assays
The present invention provides a method for reducing undesirable light emission from a sample using at least one photon producing agent and at least one photon reducing agent (e.g. dye-based photon...
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6187372 |
Method for producing large area thick film resistors with uniform thickness
A method for creating large area, thick film resistors with improved predictability and uniformity. "Tent poles" are employed during the printing of the large area resistors to prop up the screen...
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6153256 |
Chip resistor and method of making the same
A chip resistor includes a spaced pair of main top electrodes on an insulating substrate, a resistor layer formed on the insulating substrate to bridge between the main top electrodes, an overcoat...
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6146552 |
Zinc oxide ceramics and method for producing the same
Zinc oxide ceramics and a method for producing the same are provided wherein zinc oxide varistors for low and high voltages having excellent electric characteristics and high reliability upon DC...
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6127040 |
Electroceramic component and method of manufacture thereof
Electroceramic component having a component body (10), connection metallization coatings (2, 3) and also a protective encapsulation (15 to 18) made of two different materials on in each case two...
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6120835 |
Process for manufacture of thick film hydrogen sensors
A thick film process for producing hydrogen sensors capable of sensing down to a one percent concentration of hydrogen in carrier gasses such as argon, nitrogen, and air. The sensor is also...
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6090435 |
Electronic component and method for fabricating the same
The electronic component of the present invention includes: an element having an internal electrode therein; an external electrode formed on an end portion of the element where an end face of the...
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5935642 |
Formation of resistor with small occupied area
Resistor material such as polysilicon is deposited on the insulating surface of a substrate and patterned to form resistor layers disposed generally parallel. Another resistor material such as...
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5932280 |
Printed circuit board having printed resistors and method of making printed resistors on a printed circuit board using thermal transfer techniques
Resistors for a printed circuit board and methods for making are provided using thermal transfer techniques to transfer coating material having some degree of electrical conductivity from a thermal...
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5900275 |
Method for reducing haze in tin oxide transparent conductive coatings
The haze in a conductive tin oxide coating deposited on a substrate, particularly glass, can be reduced by applying, to a desired thickness, a solid-state coating, where the solid-state layer is...
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5858452 |
Method for fabricating wiring substrate with subminiature thru-holes
The present invention is an electronic wiring substrate for sensors formed over a subminiature through hole. Because of the small diameter of the through hole, the material that fills the through...
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5837178 |
Method of manufacturing varistor precursors
A method for use in making multilayered varistors including the steps of forming a plurality of interleaved layers of ceramic material and conductive material, confining the conductive material to...
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5702653 |
Thick-film circuit element
A thick-film switch element includes a high-temperature glass frit fused to a non-conductive substrate. A cermet layer having a low-temperature glass matrix is fired in a conventional furnace to...
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5624782 |
Method of manufacturing thick-film resistor elements
To provide a method of manufacturing thick-film resistor elements that forms thick-film resistors having a uniform thickness on a substrate surface with high precision. A method of manufacturing...
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5614074 |
Zinc phosphate coating for varistor and method
A method of providing a semiconductor device with an inorganic electrically insulative layer, the device having exposed semiconductor surfaces and electrically conductive metal end terminations, in...
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5609910 |
Method for forming thermal-ink heater array using rectifying material
A heater array for an ink jet printhead includes an insulating substrate, which can be a layer of ceramic, flexible plastic, insulated flexible metal, polysilicon, or single crystalline silicon. A...
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5589270 |
Processed substrate obtained by a process for effecting suppression of electrification
Electrification is suppressed with a water-soluble electrification-suppressing film having an electron conductivity and comprising a polymer resin. A high electrification-suppressing effect which...
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5548268 |
Fine-line thick film resistors and resistor networks and method of making same
Electrical resistors and resistor networks are provided on an insulative substrate with designated conductive terminations by direct and continuous writing of resistive lines in fine-line patterns...
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5494180 |
Hybrid resistance cards and methods for manufacturing same
A hybrid resistance card (R-Card) is manufactured using a two-step process wherein an electrically conductive ink layer and an electrically resistive ink layer are printed onto a surface, which may...
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5455554 |
Insulating coating
A composition for an insulating collar of a metal oxide varistor, with the composition being applied as a slurry to a green varistor in an unfired state along its periphery for enhancing the...
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5443862 |
Process for the treatment of thin films having properties of electrical conduction and/or reflection in the infrared
A method is provided for generating one or more differentiated zones of electrical conductivity or infrared emissivity in a thin semi-conducting layer of metallic oxide or oxides, comprising: ...
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5346720 |
Palladium thick film resistor containing boron nitride
An electrically resistive film of the type used for forming thick film resistors is formed predominantly of palladium and includes an addition of boron nitride to increase resistance, preferably in...
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5326589 |
Method of protecting electronic or electric part
The invention provides a method of protecting an electronic or electric part by coating the part with a silicone rubber composition comprising an organopolysiloxane, an organohydrogenpolysiloxane,...
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5302412 |
Single atmosphere for firing compatible thick film material
The present invention provides an improved method for firing thick film inks in hybrid circuits which comprises firing different copper compatible thick film materials in a single firing...
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5262195 |
Soluble conducting polymers and their use in manufacturing electronic devices
Soluble conducting polymers from substituted polyanilines and large organic counterions are disclosed and used directly from solution in the manufacture of electronic devices.
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5169679 |
Post-termination apparatus and process for thick film resistors of printed circuit boards
A printed circuit board includes both high and low resistive value thick film resistors interconnected by a copper film. To lower the contact resistance to the thick film resistors of high value,...
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5169493 |
Method of manufacturing a thick film resistor element
A conductive paste layer of less than 5 μm is formed on an insulating substrate. After a drying and a baking treatment of the conductive paste layer, an etching is carried out to form a plurality...
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5169465 |
Thick-film circuit element on a ceramic substrate
A thick-film switch element includes a high-temperature glass frit fused to a ceramic substrate. A cermet layer having a low-temperature glass matrix is fired in a conventional furnace to sink into...
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5116641 |
Method for laser scribing substrates
A method is provided for forming a thick-film circuit having at least one thick-film resistor element upon a substrate and laser scribing the substrate to remove the circuit from the remaining...
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5089293 |
Method for forming a platinum resistance thermometer
A platinum resistance thermometer is formed in a process which includes the defining of a path for the resistance thermometer in an inert material deposited in a layer on the substrate. The...
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5069748 |
Method for forming refractory resistors with etch stop for superconductor integrated circuits
This is a structure of, and method for preparation of, molybdenum resistors in a superconductor integrated circuit. It utilizes a pattern superconductor film; applying a titanium film on the...
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5037670 |
Method of manufacturing a low sheet resistance article
Fine copper and nickel powders are well mixed in a preselected ratio with bonding agents and carriers as appropriate. The composition then may be patterned upon a substrate by screen printing and...
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