|
Match
|
Document |
Document Title |
|
|
7622067 |
Apparatus and method for manufacturing a semiconductor device
An apparatus for manufacturing a semiconductor device includes an upper mold ( 21 ), a lower mold ( 22 ), and a plate ( 30, 130, 230 ) that includes at least one cavity ( 31 ) that receives resin...
|
|
|
7618249 |
Memory card molding apparatus and process
A molding system for provided which is configured for molding a substrate comprising a plurality of individual carriers each of which is pre-cut into a shape of a memory card device and connected...
|
|
|
7534385 |
Method and apparatus for demolding a golf ball
An apparatus and method for demolding golf balls from a mold cavity are disclosed. More specifically, an apparatus and method for demolding a golf ball from a mold cavity subsequent to forming a...
|
|
|
7523914 |
High-hardness and corrosion-tolerant integrated circuit packing mold
A high-hardness and corrosion-tolerant integrated circuit packing mold comprises a package mold including at least one filling channel, at least one mold cavity, and at least one channel between...
|
|
|
7510383 |
Device for forming foamed product integral with trim cover assembly
A foaming die device is provided, which has a closure element rotatably provided therein. The foaming die device allows a three-dimensional trim cover assembly with an opening defined therein to be...
|
|
|
7482700 |
Semiconductor device having projection on surface thereof, and method of identifying semiconductor package
A technique of accurately recognizing a semiconductor device and of specifying a package type thereof. By forming, on the package surface, projections having a geometric pattern such as a circle...
|
|
|
7448861 |
Resin molded semiconductor device and mold
To provide an excellent image by reducing buckling of a CCD device having one-dimensional CCD elements mounted thereon due to changes in temperature. Blackening treated iron or iron-based alloy is...
|
|
|
7427193 |
Method and apparatus for forming a golf ball
Molding equipment and related techniques for forming a golf ball are disclosed. The golf ball comprises a core and a cover layer, wherein the cover layer provides one or more deep dimples that...
|
|
|
7425122 |
Method of manufacturing an in-mold laminate component
A method is provided for manufacturing a painted plastic component such as painted air bag covers, side cladding or exterior bumpers, which includes a painted film sheet and a one-piece...
|
|
|
7416397 |
Waterproof slide fastener and apparatus for manufacturing the same
A waterproof slide fastener and a manufacturing apparatus thereof are disclosed, wherein each fastener element has a coupling head, a neck portion, a body portion, and leg portions which are...
|
|
|
7407832 |
Method for manufacturing semiconductor package
A die for encapsulating an IC structural body having bonding wires with a molten resin is provided with at least one first half having an ejector-pin-through-hole and at least one second half...
|
|
|
7396222 |
Insert molding die and method for molding hollow component
A molding die includes an upper die, upper-die pins arranged in the upper die to be movable up and down, springs arranged in the upper die to urge the upper-die pins downwardly, a lower die,...
|
|
|
7393489 |
Mold die for molding chip array, molding equipment including the same, and method for molding chip array
Provided are a mold die for molding a chip array, molding equipment including such a mold die and a molding method utilizing such molding equipment. The mold die provides for the selective...
|
|
|
7381041 |
Injection mold assembly
A method and assembly for molding golf balls is disclosed herein. The invention includes an injection mold assembly ( 20 ) with a first mold half ( 22 a ) having a plurality of cavities and at...
|
|
|
7347963 |
Method of molding resin to protect a resolver winding
At least a winding of a stator stack 2 is molded by injecting a fused resin molding material into a space formed between a top mold and a bottom mold member. When the stator stack 2 of the...
|
|
|
7335006 |
In-mould labelling
An In-Mould Labelling process comprising: clamping a label within a mould void of an injection moulding tool; and injecting material into the mould void while the label is clamped. An In-Mould...
|
|
|
7326041 |
Lead frame, resin sealing mold and method for manufacturing a semiconductor device using the same
The preferred embodiments provide a lead frame wherein a first air vent 29 and a second air vent 30 are formed in an air vent forming region 32 . When resin-molding, one end of this first air...
|
|
|
7311868 |
Injection moulding tool, method of injection moulding and a packaging container provided with an injection-moulded opening arrangement
The disclosure relates to a tool ( 1 a, 1 b, 2 )for injection moulding of an opening arrangement ( 20 ) of plastic in a hole in a packing material ( 9 ), the hole defining a hole edge ( 8 ) and...
|
|
|
7297232 |
Production method and device for fiber molding
A method for producing a fiber molded article comprising the step of transferring a fiber molded article 10 formed in a papermaking mold 2 composed of splits 20 and 20′ to a split 30′ ...
|
|
|
7281915 |
Overmould with anti-intrusion ribs
Overmould comprising a base having a central section, from a first side of which hooks project which form the male part of a self-gripping member, two sections forming selvages, laterally from each...
|
|
|
7270780 |
Molding mold, molding method and tape cartridge
A molding mold and a molding method are disclosed, for molding a flange configuration in which a flange of a reel hub portion can be maintained in a predetermined configuration. Also a tape...
|
|
|
7265453 |
Semiconductor component having dummy segments with trapped corner air
A semiconductor component includes a leadframe, a die, upper and lower body segments encapsulating the die, and dummy segments on the leadframe. The dummy segments are configured to vent trapped...
|
|
|
7264456 |
Leadframe and method for reducing mold compound adhesion problems
An integrated circuit leadframe has a pair of leadframe rails that are specially treated to adhere to injection mold compounds to a lesser or greater degree than portions of the leadframe rails...
|
|
|
7252499 |
Apparatus for unidirectional infiltration of preform with molten resin or pitch
Molding apparatus for rapid transfer of molten resin or pitch in an infiltration molding process. The apparatus includes e.g. an extruder ( 4 ) for melting and conveying a resin or pitch and a mold...
|
|
|
7252488 |
Forming mold
A mold used to form a rubber or resin article which includes a shaping surface for shaping a surface of an object to be molded, and a vent structure for releasing air between the shaping surface...
|
|
|
7247267 |
Mold and method of molding semiconductor devices
A mold for molding semiconductor devices mounted on a package substrate is provided. The mold comprises a top mold and a bottom mold. The top mold has a top runner, at least a first dummy runner...
|
|
|
7238014 |
Manufacturing method of an electronic device package
A method is for forming a plastic protective package for an electronic device integrated on a semiconductor and comprising an electronic circuit to be encapsulated in the protective package. The...
|
|
|
7232301 |
Machine for the manufacture of flexible moulds, in particular for the obtainment of lipsticks or the like
A machine for the manufacture of flexible moulds is described, in particular for the obtainment of lipsticks or the like, which comprises a female mould including at least one moulding cavity...
|
|
|
7223085 |
Apparatus and method for molding golf balls
The present invention is directed to a mold and method for forming a golf ball with at least a core. The mold and method comprise or use members with projections for forming multiple dimples on the...
|
|
|
7204683 |
Molding die for covering optical fiber and optical fiber cover forming device
A mold is provided in which a molding portion, formed between joint surfaces of upper and lower molds superimposed one upon the other, is filled with UV curable resin after arranging a coating...
|
|
|
7195955 |
Technique for protecting photonic devices in optoelectronic packages with clear overmolding
This disclosure describes a clear overmolding cap for protecting the photonic devices in optoelectronic packages from damage due to handling, module assembly, board assembly, and environmental...
|
|
|
7189070 |
Device for impregnating an insulation of a winding bar of an electrical machine
A device for impregnating an insulation of a winding bar of an electric machine includes a container accommodating the winding rod and connected to a tank containing an impregnation agent. The...
|
|
|
7178779 |
Resin molding die and production method for semiconductor devices using the same
A resin molding die includes: a cavity; a resin inlet through which a liquid resin to be cured is injected into the cavity; and an air vent through which air is released to an exterior space of the...
|
|
|
7175405 |
Compression molding machine
A compression molding machine capable of maintaining dies parallel while precisely clamping work pieces and improving quality of molded products and productivity. The compression molding machine...
|
|
|
7172408 |
Rapid densification of porous bodies (preforms) with high viscosity resins or pitches using a resin transfer molding process
A resin transfer molding (RTM) process is disclosed for rapidly filling a fibrous preform and/or a rigid, porous body with high viscosity resin or pitch. The process is suitable for impregnated...
|
|
|
7170158 |
Double-sided circuit board and multi-chip package including such a circuit board and method for manufacture
A multi-chip package comprises a double-sided circuit board having first and second surfaces. Each surface has a package area and a peripheral area. Each package area has a chip mounting area on...
|
|
|
7169345 |
Method for integrated circuit packaging
According to one embodiment of the invention, a system for packaging integrated circuits includes a mold tool for packaging integrated circuits. The mold tool includes a first mold plate that...
|
|
|
7156633 |
Apparatus for encapsulating a multi-chip substrate array
A mold apparatus for encapsulating IC chips mounted on a substrate. In an exemplary embodiment a mold is provided with an upper mold platen having a plurality of cavities for encapsulating wire...
|
|
|
7156632 |
Injection mold for display panel of washing machine
Disclosed is an injection mod for a display panel of a washing machine, by which the display panel can be simply formed in one body. The present invention includes a first mold having a first film...
|
|
|
7153116 |
Resin molding machine
The resin molding machine has a simple molding die, which can be easily maintained, and is capable of molding a work without pretreatments. The resin molding machine for molding the work with...
|
|
|
7150845 |
Mould with turnable middle section
A method and molding tool for the molding of both one- or multi-component parts preferably comprising plastic material which may be integrated together with parts of another material, such as steel...
|
|
|
7150618 |
Mold for golf ball
A mold for a golf ball includes an upper portion ( 1 ) and a lower portion ( 3 ). A large number of projections ( 7 ) for dimple formation are provided on a cavity surface ( 5 ) of each of the...
|
|
|
7147447 |
Plastic semiconductor package having improved control of dimensions
A device with a semiconductor chip ( 801 ) assembled on a planar substrate ( 802 ) and encapsulation compound ( 810 ) surrounding the assembled chip and a portion of the substrate near the chip;...
|
|
|
7112048 |
BOC BGA package for die with I-shaped bond pad layout
Semiconductor die units for forming BOC BGA packages, methods of encapsulating a semiconductor die unit, a mold for use in the method, and resulting encapsulated packages are provided. In...
|
|
|
7108496 |
Stack mould assembly
An injection moulding process for making a toothbrush involving a stack mould assembly of at least three mould blocks ( 1, 2, 3, 4 ) arranged for use along a longitudinal stack axis (A—A), with...
|
|
|
7097439 |
Manufacturing device and manufacturing method for synthetic resin hollow molded body
A manufacturing device for a synthetic resin hollow molded body molds a first split assembly member, a second split assembly member, and a third split assembly member by a first injection, and...
|
|
|
7066081 |
Device for making cheese and corresponding production method
The invention concerns a device for making soft cheese or fresh paste cheese comprising at least a first set of perforated cheese-moulds and at least a second set of perforated cheese-moulds...
|
|
|
7048534 |
Molding processes and apparatuses for forming golf balls
Molding equipment and related techniques for forming a golf ball with one or more deep dimples are disclosed. The golf ball comprises a core and a cover layer, wherein the cover layer provides one...
|
|
|
7033157 |
Process and apparatus for producing a golf ball with deep dimples
An apparatus and related techniques for making a golf ball with deep dimples are disclosed. The golf ball comprises a core and a cover layer, wherein the cover layer provides deep dimples that...
|
|
|
7029257 |
Apparatus and method for molding simultaneously a plurality of semiconductor devices
Provided is a molding apparatus for molding simultaneously a plurality of semiconductor devices. The molding apparatus includes a mold, a plurality of plungers, and a plunger block. The mold is...
|