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7625523 |
Ga-base alloy and organic function element using the same
There are provided a metal material for electrode formation, which can form an electrode provided in an organic function element without adopting vapor deposition, can easily realize an increase in...
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7617964 |
Solder compositions; method of soldering, and a laminated transparency having bus bars
A low temperature solder including indium in the range of 62-65 weight percent and tin in the range of 31-33 weight percent uses the heat generated during thermal treatment of one or more glass...
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7578966 |
Solders with intermetallic phases, solder bumps made thereof, packages containing same, and methods of assembling packages therewith
A solder composition includes a reflow-wetting element that is an intermetallic both pre-reflow and post-reflow. The intermetallic releases the reflow-wetting element upon heating. The solder...
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7160504 |
Alloy type thermal fuse and fuse element thereof
The invention provides a thermal fuse and a fuse element of the low-melting fusible alloy type. The fuse element has an alloy composition in which a total of 0.01 to 7 weight parts of at least one...
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6740544 |
Solder compositions for attaching a die to a substrate
A method for attaching a die ( 11 ) to a substrate ( 15 ) is provided. In accordance with the method, a die and a substrate are provided which are to be connected to each other across first and...
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6554923 |
Method for providing a low temperature curable gallium alloy for multichip module substrates
A system and method for providing via-hole filling for microelectronic interconnections, is disclosed. Gallium metal is melted and mixed with a measured amount of copper and nickel, thereby...
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6500282 |
Gold-indium intermetallic compound, shape memory alloys formed therefrom and resulting articles
A superelastic alloy exhibiting shape memory or pseudoelastic it properties contains about 46.17 weight percent Au and about 53.83 weight percent In. Such alloys containing the superelastic Au—In...
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6468808 |
Water-soluble luminescent quantum dots and biomolecular conjugates thereof and related compositions and method of use
The present invention provides a water-soluble luminescent quantum dot, a biomolecular conjugate thereof and a composition comprising such a quantum dot or conjugate. Additionally, the present...
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6372060 |
Platinum solder
A solder composition for repairing jewelry having a platinum content of up to about 95% by weight contains about 90% to about 95% by weight platinum and about 5% to about 10% by weight of an alloy...
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6367683 |
Solder braze alloy
The invention, which permits active solder braze technology to be used in a more versatile manner, relates to a solder braze alloy and to a method for joining workpieces by soldering by means of a...
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6319617 |
Oxide-bondable solder
A solder composition that bonds well to oxides and other surfaces to which solder bonding is conventionally difficult is provided. The solder is particularly useful for reliable bonding and...
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6306516 |
Article comprising oxide-bondable solder
The invention provides an article comprising a solder that bonds well to oxides and other surfaces to which solder bonding is problematic. The solder composition contains one or more rare earth...
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6273969 |
Alloys and methods for their preparation
The present invention relates to an alloy comprising a first element A, a second element B, a third element C, and a fourth element D. In the alloy, first element A and second element B are present...
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6253988 |
Low temperature solder
The present invention includes a low temperature solder composition having a mixture of elements including indium, tin and silver. Less than about 75% of the composition by weight is tin.
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6180269 |
GaAs single crystal substrate and epitaxial wafer using the same
A GaAs single crystal substrate and an epitaxial wafer using the same suppress the generation of slips during growth of the epitaxial layer, and improve the breakdown withstanding characteristic of...
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6030507 |
Process for making a crystalline solid-solution powder with low electrical resistance
A process for making a crystalline solid-solution powder which involves reacting at least two reactants in a plasma arc of a plasma chamber and blast-cooling the resultant product in a high...
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6027575 |
Metallic adhesive for forming electronic interconnects at low temperatures
The invention is a self-low-temperature curing metallic adhesive with thermal and electrical conductivity. It comprises a paste mixture of a liquid metal having a melting temperature below 30° C....
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5628933 |
Transparent conductors comprising zinc-indium-oxide and methods for making films
Applicant has discovered that aliovalently doped zinc-indium-oxide where In is 40-75% of the metal elements can achieve electrical conductivity comparable to wide band-gap semiconductors presently...
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5508003 |
Metallic material with low melting temperature
A gallium-indium-zinc-copper metallic material has been found to exhibit many of the advantageous properties of mercury, such as electrical conductivity, fluidity, and high vaporization...
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5505928 |
Preparation of III-V semiconductor nanocrystals
Nanometer-scale crystals of III-V semiconductors are disclosed, They are prepared by reacting a group III metal source with a group V anion source in a liquid phase at elevated temperature in the...
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5474591 |
Method of synthesizing III-V semiconductor nanocrystals
The present invention relates, in general, to a method of synthesizing nanocrystals and, in particular, to a method of synthesizing III-V semiconductor nanocrystals in solution at a low temperature...
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5384090 |
Fine wire for forming bump electrodes using a wire bonder
This invention relates to a connection method for a semiconductor material enabling a formation of a bump electrode with a wire bonder, keeping always a cutting position of the wire at a specified...
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5281364 |
Liquid metal electrical contact compositions
Liquid metal electrical contact compositions are disclosed. Compositions of this invention consist of a metal mixture of first and second Periodic Table Group III metals and a lubricant. A...
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5225157 |
Amalgam composition for room temperature bonding
An amalgam and a method of preparing an amalgam for bonding two articles together, which includes mixing a composition of a liquid metal and a metal powder to thoroughly wet the metal powder with...
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5126168 |
Preparation of group IIIA-VA compounds such as boron nitride, and of boron nitride films and coatings
Lewis base-borane complexes such as (CH 3 ) 2 S.BHBr 2 are utilized as molecular precursors for the formation of both bulk powders, films and coatings of boron nitride. The complexes are...
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5120498 |
Solders having exceptional adhesion to glass
Heavy metal solders having exceptional ability to wet non-metals, especially glass, are produced by the incorporation of small amounts of the light reactive metals lithium, sodium, potassium,...
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5098656 |
Alloys for electrically joining superconductors to themselves, to normal conductors, and to semi-conductors
A unique class of bonding alloys and methods for their use are provided which enable the user to electrically join superconductive materials to themselves, to normal conductive materials, or to...
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5053195 |
Bonding amalgam and method of making
An amalgam and a method of preparing an amalgam for bonding two articles together, which includes mixing a composition of a liquid metal and a metal powder to thoroughly wet the metal powder with...
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5051316 |
Overlay alloy or plain bearing
A Pb-based overlay alloy of a plain bearing contains 3%-20% of In and more than 0.5% to 9% of Sb, and, preferably 0.1%-5% of Ag, Cu, Ni, and/or Mn, and exhibits improved properties at a high...
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5024264 |
Method of cooling a semiconductor device with a cooling unit, using metal sherbet between the device and the cooling unit
A method of cooling a device with a cooling unit, using a metal sherbet, which is metal being in a state of a two-phase composition consisting of a liquid phase and a solid phase, as a heat...
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5011564 |
Epitaxial growth
An equilibrium growth dispersion for use in liquid epitaxial growth at a predetermined growth temperature of a compound including at least two constituents. Predetermined quantities each of the...
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4976529 |
Soldering material for spectacle frame and spectacle frame in which said soldering material is used
A shape memory alloy is used for face-contacting parts (1, 3, 4, 5; 101) and lens-fixing parts (2) of a spectacle frame, and parts (12, 13; 103) connected thereto are formed of titanium, a titanium...
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4970060 |
Pure or mixed monocrystalline boules of lanthanum orthogallate
Monocrystalline lanthanum orthogallate compositions grown along a predetermined crystallographic direction in the form of a single crystal of a size greater than 1 cm in diameter/width and at least...
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4902486 |
Novel gallium arsenide precursor and low temperature method of preparing gallium arsenide therefrom
A novel gallium arsenide precursor has the formula R 2 GaAs(SiR') 2 wherein R is selected from the group consisting of alkyl substituted cycloaliphatic group and alkyl substituted aromatic group...
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4874438 |
Intermetallic compound semiconductor thin film and method of manufacturing same
An intermetallic compound semiconductor thin film comprises a single crystalline deposition thin film made of a III-V group intermetallic compound having a stoichiometry composition ratio of 1:1....
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4798701 |
Method of synthesizing amorphous group IIIA-group VA compounds
A method of synthesizing amorphous Group IIIA-Group VA compounds. A first solution is prepared which consists of a tris(trialkylsilyl) derivative of either a Group IIIA or Group VA element...
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4785137 |
Novel nickel/indium/other metal alloy for use in the manufacture of electrical contact areas of electrical devices
This invention relates to electrical devices in which the electrical contact areas are plated with a nickel/indium/other metal alloy.
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4721539 |
Large single crystal quaternary alloys of IB-IIIA-SE.sub.2 and methods of synthesizing the same
New alloys of Cu x Ag (1-x) InSe 2 (where x ranges between 0 and 1 and preferably has a value of about 0.75) and CuIn y Ga (1-y) Se 2 (where y ranges between 0 and 1 and preferably has a value...
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4659384 |
Gallium alloy for dental restorations
A gallium alloy for dental restorations which is hardenable at mouth temperature or around 37° C. or more after triturating multicomponent liquid gallium alloy with alloy powder, is disclosed. The...
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4633050 |
Nickel/indium alloy for use in the manufacture of electrical contact areas electrical devices
This invention relates to electrical devices in which the electrical contact areas are plated with a nickel/indium alloy comprising 0.1-9 percent indium, balance nickel. The nickel/indium alloy...
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4623514 |
Liquid metal brush material for electrical machinery systems
A method for transferring current which uses a fusible alloy comprising f about 25.0 to about 48.0 weight percent bismuth, from about 0.8 to about 11.5 weight percent cadmium, from about 18.0 to...
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4609530 |
GaAs single crystal with small fluctuation in impurity concentration in the plane perpendicular to the growth direction of the crystal
A GaAs single crystal containing at least one impurity selected from the group consisting of B, Si, S, Te and In in a concentration of at least 10 15 /cm 3 , fluctuation of which is not larger...
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4594264 |
Method for forming gallium arsenide from thin solid films of gallium-arsenic complexes
A method for depositing GaAs on a substrate is disclosed, involving applying a thin liquid film of a gallium-arsenic complex solution to the substrate and evaporating arsenide complex. The...
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4539178 |
Indium-antimony complex crystal semiconductor and process for production thereof
An indium-antimony complex crystalline semiconductor consisting essentially of crystals of an indium-antimony compound and crystals of indium alone is disclosed. The atomic ratio of the total...
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4492842 |
Process of brazing using low temperature braze alloy of gold-indium tin
A heat resistant brazing alloy of a major amount of gold, a lesser amount of indium and a minor amount of tin. The alloy is particularly suited for use in bonding electrical components to chip...
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4399097 |
Preparation of III-V materials by reduction
A method of producing III-V materials by reducing a complex salt in a hydrogen atmosphere is shown. For example, complex salts reduce to InP or GaAs. The salts are conveniently prepared by...
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4308248 |
Material and method to dissociate water
A material and method to decompose/dissociate water into hydrogen and oxygen. The material comprises a reactive alloy of an alkali metal and aluminum combined with a catalytically effective amount...
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4296183 |
Al-Sn Base bearing alloy and composite
The invention relates to aluminum-tin (Al-Sn) base bearing alloys and bearing materials that are made by applying the alloys to backing steel sheets by pressure welding. The Al-Sn base bearing...
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4265661 |
Direct synthesis of intermetallic compounds
A reagent container is described formed from two hemispherical shells (10, 12) of a material which is solid below reaction temperatures (typically at room temperatures) and which will melt below...
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4239534 |
Ga-Cu alloy for use in exchangeable electrode for an evaporation system
Ga-Cu alloy having the formula of Ga 1 -x Cu x , wherein x is a composition ratio parameter of Ga and Cu in a range of 0.0001≤×≤0.05. The alloy has a stable liquid phase at the normal...
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