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7390370 |
Gold bonding wires for semiconductor devices and method of producing the wires
Gold bonding wires for semiconductor devices featuring increased strength and modulus of elasticity, stable loop shapes, suppressing the flow of wires, suppressing the leaning, and totally improved...
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7279054 |
Dental prosthesis method and alloys
Dental prostheses are machined from a metallic body instead of being made by lost wax casting. Suitable gold base alloys have only base metal alloying additions which are more readily oxidized than...
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7229510 |
Manganese alloy sputtering target and method for producing the same
A manganese alloy sputtering target characterized in that oxygen is 1000 ppm or less, sulfur is 200 ppm or less and a forged texture is provided, and a method for producing a forged manganese alloy...
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7153375 |
Precious metal solder
Platinum, silver and gold solder compositions for repairing, assembling, or sizing jewelry. Platinum compositions having about 90% to about 95% by weight platinum. Silver compositions having at...
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7048813 |
Foil-form soldering metal and method for processing the same
The present invention provides a processing method capable of continuously working an Au—Sn soldering metal having a foil form in room temperature. The foil-form soldering metal containing from...
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6991854 |
Gold alloy bonding wire for semiconductor device
A gold (Au) alloy bonding wire for a semiconductor device is provided. The Au alloy bonding wire is manufactured by adding at least one of polonium (Po), promethium (Pm), thulium (Tm), and boron...
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6929776 |
Jewelry alloy compositions
A jewellery alloy, having a substantially purple hue and sufficient toughness to withstand Rockwell 3 hardness testing with a 100 kg load without shattering, comprises 76 to 83.5 wt % gold and 16.5...
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6913657 |
Hard precious metal alloy member and method of manufacturing same
A hard precious metal alloy member is constituted of a gold alloy, which has a gold Au content of from 37.50 to 98.45 wt %, and contains a hardening additive in a range of not less than 50 ppm but...
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6492593 |
Gold wire for semiconductor element connection and semiconductor element connection method
A gold wire, for semiconductor element connection, having 5-100 ppm by weight of Ca, 5-100 ppm by weight of Gd, and 1-100 ppm by weight of Y. The gold wire further preferably has 1-100 ppm by...
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6413649 |
Silver-copper-nickel infiltration brazing filler metal and composites made therefrom
The present invention is directed to brazing filler metals that can be used in the infiltration brazing of porous matrix materials without the need for a flux. The brazing filler metals contain two...
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6403233 |
Article comprising creep-resistant and stress-reducing solder
The invention relates to use of a solder composition exhibiting a desired combination of high creep resistance at typical operating temperatures and low stress in formed solder joints. The...
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6319617 |
Oxide-bondable solder
A solder composition that bonds well to oxides and other surfaces to which solder bonding is conventionally difficult is provided. The solder is particularly useful for reliable bonding and...
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6306516 |
Article comprising oxide-bondable solder
The invention provides an article comprising a solder that bonds well to oxides and other surfaces to which solder bonding is problematic. The solder composition contains one or more rare earth...
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H001934 |
Gold-tin solder suitable for self-aligning applications
A tin-rich gold-tin solder is disclosed which is particularly advantageous for self-aligning applications. When utilized with gold-plated bond locations, the out-diffusion of tin from the solder...
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6123786 |
Gold materials for accessories hardened with minor alloying components
A gold material for accessories comprises a hardened gold alloy composed of pure gold having a purity of 99% or more and from 200 to 2000 ppm, relative to the total weight of the resulting gold...
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6063213 |
High-purity hard gold alloy and method of manufacturing same
A method of manufacturing a high-purity gold alloy for making an electronic member, a dental member or a decorative member. The method includes subjecting a high-purity gold alloy having a Gd...
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6045635 |
High-purity hardened gold alloy and a process of producing the same
A high-purity hard gold alloy containing 50 ppm or more of Gd and one or more of other additional elements in Au having a purity of 99.7% by weight or more, such that a total content of the...
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5989364 |
Gold-alloy bonding wire
A thin wire of gold alloy for wire bonding, consisting of: a first group consisting of 2 to 10 ppm by weight of scandium, 3 to 20 ppm by weight of beryllium, and 2 to 50 ppm by weight of indium;...
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5945065 |
Method for wedge bonding using a gold alloy wire
A gold alloy wire for wedge bonding, comprising 1 to 100 parts per million by weight of calcium (Ca), the remainder being gold and inevitable impurities, said gold alloy wire having a tensile...
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5922276 |
Gold alloy for porcelain/metal dental restorations
A dental alloy is provided for use in porcelain-fused-to-metal dental restorations, which has an excellent oxide color and which can be cast and recast without deleterious effect, which comprises...
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5853661 |
High gold content bio--compatible dental alloy
A high gold content dental alloy comprises, on a weight basis, 91 to 99.4% of gold, 0.5 to 3% of at least one metal selected from titanium and tantalum, up to 5% of silver, 0.05 to 1% of iridium...
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5833462 |
Precision attachments for dental technology capable of being cast on
Precision attachments containing a titanium-containing gold alloy which is covered with a gold film, capable of being cast on, which have a golden yellow color, are extremely corrosion-resistant...
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5702814 |
Gold wire for bonding
According to the present invention provided is a gold wire for IC chip bonding which wire is unlikely to be broken after thermosonic wire bonding at an increased ultrasonic output, subsequent...
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5658664 |
Thin gold-alloy wire for semiconductor device
This invention provides a thin gold-alloy wire for a semiconductor device capable of improving long term reliability of bonding with an electrode and capable of simultaneously accomplishing...
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5593514 |
Amorphous metal alloys rich in noble metals prepared by rapid solidification processing
Amorphous metal alloys rich in noble metals prepared by rapid solidification processing are disclosed. The alloys have at least a ternary composition having the formula M a G1 b G2 c , wherein M...
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5518691 |
Precious metal material
Disclosed is gold and platinum material having excellent mechanical strength while maintaining its high quality. The precious metal material of the present invention comprises 0.01 to 1% in weight...
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5491034 |
Bonding wire for semiconductor element
This invention relates to a bonding wire (3) for connecting electrodes of a semiconductor element to outer leads (2). The bonding wire (3) consists of Cu of not less than 1 wt % but less than 5 wt...
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5429795 |
10-Carat gold alloy for ornaments
A 10-carat gold alloy for ornaments comprises 41.7% gold 12.0 to 13.0% silver, 40 to 41.5% copper, and 4.5 to 5.5% zinc.
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5423680 |
Palladium, gallium and copper-free alloy having high thermal expansion coefficient
A dental alloy is provided which is free of palladium, gallium and copper and which is compatible with a wide variety of composites and porcelain compositions. The alloy has a melting range of...
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5415922 |
Resin-coated bonding device
A resin-coated, bonding fine wire for use in forming bonded electrical connections on a semiconductor device, wherein the wire is characterized as having a tensile strength exceeded when the wire...
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5348593 |
Method of heat treating gold or gold alloy parts
A process for generating in-situ low cost atmospheres suitable for annealing and heat treating ferrous and non-ferrous metals and alloys, brazing metals and ceramics, sealing glass to metals, and...
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5340529 |
Gold jewelry alloy
A gold based jewelry alloy is disclosed of preferably the 10 to 18 karat range containing primarily gold, copper, zinc and silver. This alloy is formulated to create a unique color, a mid-range hue...
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5338378 |
Dental gold alloy with age-hardenability at intraoral temperature
A dental gold alloy which is soft enough for adjustment of a patient's occlusal condition, which is age-hardenable with passage of time at temperatures encountered within a patient's oral cavity,...
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5298219 |
High purity gold bonding wire for semiconductor device
Bonding wire for a semiconductor device contains high purity Au or Au alloy as a base metal and 25-10000 atppm of low boiling point element I having a boiling point lower than a melting point of...
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5286417 |
Method and composition for making mechanical and electrical contact
A fusible conductive adhesive for making electrical and mechanical contact is provided. The fusible conductive adhesive contains a polymer having a glass transition temperature and a thermal...
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5249100 |
Electronic circuit device provided with a ceramic substrate having lead pins bonded thereto by solder
Disclosed is an electronic circuit device in which the solder (14) connecting lead pins (6) to the ceramic substrate (2) has a melting point of 356° C. to 450° C. and has a tensile strength being...
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5139739 |
Gold alloy for black coloring, processed article of black colored gold alloy and method for production of the processed article
A gold alloy for black coloring comprising gold and at least one coloring metallic element selected from the group consisting of Cu, Fe, Co, and Ti, a gold alloy for black coloring having the...
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5098655 |
Electrical contact alloy
The electrical contact alloy is provided comprising Sb and either Au or Ag or both. In such alloys, Sb produces a non-catalytic effect to inhibit formation of carbon from organic gases derived from...
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5095759 |
Platinum electrode bonded to ceramic
A high gold content brazing alloy containing titanium is used to braze a platinum electrode to a ceramic cylinder.
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5071619 |
Fine gold alloy wire for bonding of a semiconductor device
A fine gold alloy wire of high tensile strength for bonding semiconductor elements is disclosed. The wire consists essentially of 0.0003 to 0.010 wt % of at least one rare earth element selected...
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4997723 |
Metal-porcelain dental restorations, dental veneers, dental bridges and metal foil for use therein and methods for making dental appliances
A metal foil is provided for use in a metal-porcelain dental restoration, which metal foil provides improved color qualities to the finished restoration and improved bonding of the metal to the...
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4938923 |
Gold wire for the bonding of a semiconductor device
The gold wire used for the wire bonding of a semiconductor device comprises at least three kinds of elements selected from rare earth elements such as La, Ce and Pr: Be, Ca, Mg, Ag, Fe: and...
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4810313 |
Gold solder fluxing composition and method of preparing the same
A gold solder matching 14 karat yellow gold. The solder is typically employed in jewelry repair and is comprised of discrete particles of gold alloy and a flux to which a small amount of water is...
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4808373 |
Multiple-substance alloy for targets of cathode sputtering apparatus
A multiple-substance alloy used as a target in a cathode sputtering apparatus, and having a gold content most preferably in the range of 94-98 percent by weight, is disclosed. The alloy further...
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4775512 |
Gold line for bonding semiconductor element
This invention relates to a wire bonding gold line used for connecting a semiconductor tip electrode with an outside lead portion. This gold wire characteristically contains gold (Au) having a...
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4752442 |
Bonding wire
A bonding wire for use in semiconductor devices which consists essentially of 0.0003 to 0.01 wt. % of barium and the balance gold, the gold purity of said bonding wire being at least 99.99%. The...
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4726858 |
Recording material
A recording material made of an alloy capable of exhibiting different spectral reflectances at an equal temperature, depending on a heating-cooling cycle to which the alloy is subjected. The alloy...
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4690799 |
Superelastic dental Au-Cu-Zn alloys
Superelastic dental Au-Cu-Zn alloys characterizing that it is in a range defined by point A (63 wt % Au, 11 wt % Cu, 26 wt % Zn), Point B (55 wt % Au, 17 wt % Cu, 28 wt % Zn), Point C (55 wt % Au,...
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4606981 |
Ductile brazing alloys containing reactive metals
Brazing alloys containing up to a specified amount of a reactive metal selected from the group consisting of titanium, zirconium, vanadium and mixtures thereof and only one metal selected from the...
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4563541 |
Package providing high heat dissipation, in particular for microelectronics
A package of the flatpack type for microelectronic circuits comprises a metal base of material having good heat conductivity on which a metal frame is mounted by means of a hard brazing alloy. The...
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