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4547436 |
Conductive element metallized with a thick film gold composition
A conductive element having a metallization paste screen printed on its surface is made using a paste containing 65 to 97% by weight gold and 3 to 25% by weight cadmium/antimony alloy dispersed in...
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4539041 |
Process for the reduction of metallic compounds by polyols, and metallic powders obtained by this process
A process for reducing in a liquid phase a solid compound selected from the oxide, hydroxide or salt of a metal selected from the group consisting of gold, palladium, iridium, osmium, copper,...
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4492842 |
Process of brazing using low temperature braze alloy of gold-indium tin
A heat resistant brazing alloy of a major amount of gold, a lesser amount of indium and a minor amount of tin. The alloy is particularly suited for use in bonding electrical components to chip...
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4486386 |
Reactive metal-palladium-gold brazing alloys
Reactive metal-palladium-gold ductile alloys are suitable for brazing ceramics, other non-metallic and metallic materials.
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4466940 |
Multicomponent alloy for sputtering targets
A multicomponent alloy for targets employed in the sputter coating of gold layers, said alloy having 35% to 55%, preferably either 50% or 42%, non-aurous alloy components.
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4446102 |
Yellow gold jewelry alloy
A jewelry alloy is disclosed preferably of 3 to 5 karat gold having the color, hue and shine characteristics of 10 or higher karat yellow gold. Although the alloy disclosed is virtually identical...
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4387073 |
Gold based electrical contact materials
Gold based contact materials fabricated by directional solidification and hibiting increased strength, hardness, wear resistance and undegraded electrical conductivity, are presented. An eutectic...
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4385029 |
Gold based compounds for electrical contact materials
Gold-based intermetallic compounds suitable as a contact material for electrical contacts are presented. The gold-based electrical compounds are selected from a group consisting of Au 4 In, Au 10 ...
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4381955 |
Gold based electrical contact materials, and method therefor
There is presented gold based contact materials fabricated by internal carization and method therefor. Carburizable refractory elements are carburized by internal carburization by exposing a gold...
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4374668 |
Gold based electrical materials
A gold based electrical contact material comprising an oxide of an oxidize element in the gold matrix formed by subjecting the solid solution to an oxidizing atmosphere for internally oxidizing the...
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4374086 |
Gold based material for electrical contact materials
There is presented an electrical contact material consisting of an alloy of gold and a compound selected from a group consisting of a carbide, a boride, or a silicide of a refractory element. The...
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4367429 |
Alloys for liquid metal ion sources
Alloys suitable for use in liquid metal field ionization ion sources are provided. Such sources include an anode electrode for supporting an ion emitter comprising an alloy in the liquid state. The...
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4355084 |
Low temperature braze alloy and composite
This invention relates to an alloy for bonding gold-plated substrates together. In a more specific aspect, it relates to a braze alloy for bonding gold-plated lids to gold-plated seal rings or...
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4233103 |
High temperature-resistant conductive adhesive and method employing same
A high temperature-resistant, conductive adhesive composition for bonding a semiconductor die to a substrate comprising a mixture of (1) an alloy of gallium-tin eutectic and gold and (2) a...
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4225051 |
Containers for storing fluids under pressure
This invention relates to lightweight containers for fluids under pressure. The container is formed from an outer shell of fibrous material impregnated with resin and an inner wall made of an alloy...
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4217137 |
Gold based alloy composition and brazing therewith, particularly for ceramic-metal seals in electrical feedthroughs
New alloys containing gold, vanadium, yttrium and/or scandium, optionally including niobium. The alloys are particularly suitable for brazing and for metallizing, most particularly for brazing...
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4214904 |
Gold-tin-silicon alloy for brazing silicon to metal
An alloy for brazing a silicon die to a gold-plate kovar header consists essentially of 19 to 21 weight percent tin and 0.6 to 0.8 weight percent silicon with the balance being gold. The alloy...
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4181757 |
Process for surface coating gold alloys onto a metallic substrate to enhance corrosion protection
Processes and compositions are disclosed for surface coating of metals and alloys of low nobility with gold alloys to provide improved corrosion resistance and surface hardness to the underlying...
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4180700 |
Alloy composition and brazing therewith, particularly for _ceramic-metal seals in electrical feedthroughs
New alloys containing gold, vanadium, yttrium and/or scandium, optionally including niobium. The alloys are particularly suitable for brazing and for metallizing, most particularly for brazing...
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4093453 |
Method of making an ordered alloy
A method of making a substantially ordered alloy which involves providing a metal base consisting of at least one of the ingredients of the desired alloy, depositing a thin metal layer on the base,...
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4080485 |
Fine gold wire for use in connection in a semiconductor device
A fine wire made of a gold alloy for use in a semiconductor device. The alloy consists essentially of at least one control element selected from the group consisting of carbon in an amount of 1 to...
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4066819 |
Method of bonding gold films to non-electrically conducting oxides and product thereby obtained
A microstrip board comprising a gold film which contains about at least 1/2 weight per cent of aluminum bonded to a non-electrical conducting oxide is prepared by simultaneously evaporating the...
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4036634 |
Oxidation and sinter-resistant metal powders
A high density precious metal powder that resists sintering at 600° C. and contains a very small percentage of titania or zirconia is produced by co-nucleation and precipitation of gold and...
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4018599 |
Electrical contacts of dispersion strengthened gold
Small concentrations of certain dispersed oxides such as CeO 2 substantially improve the electrical contact properties of gold. Gold with dispersed CeO 2 is superior to gold for use as an...
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4014690 |
Gold-colored alloy solders
A gold-colored alloy solder for use with dental gold alloys and gold-colored jewelry alloys includes the following ranges of constituents in percentages by weight: TBL ...
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3926748 |
Electrodeposition of gold-antimony alloys and compositions therefor
A neutral and stable gold and antimony metal plating bath and gold and antimony metal alloys of outstanding properties; an electrolytic bath operated at a pH between 6.8 and 7.3 which is stable...
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3897246 |
Novel electro deposited gold; electrolyte solution to obtain the same; method for producing said gold; and products
An aqueous electrolyte solution having a pH from 5.5 to 8 for depositing hard ductile and bright arsenic containing gold has been provided. Besides the buffers and the alkali gold cyanide complex,...
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3769006 |
BRIGHT CAST ALLOY, AND COMPOSITION
An improved gold alloy casting composition wherein sufficient aluminum and/or silicon is utilized in an amount sufficient to form a lustrous oxidation resistant surface coating during and after...
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3767482 |
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
The invention relates to the provision of low-resistance ohmic contacts on A III B V semiconductor bodies. The known alloying contacts provided by means of a doping layer show a poor thermal...
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3616406 |
PREPARATION OF GLUE LAYER FOR BONDING GOLD TO A SUBSTRATE
A technique for preparing a glue layer destined for use in bonding gold to a substrate involves depositing a gold-transition metal alloy upon a substrate member by cathodic sputtering techniques.
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3532562 |
OHMIC LOW RESISTANCE CONTACT TO GALLIUM ARSENIDE
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3515542 |
METHOD OF MAKING DISPERSION-STRENGTHENED DUCTILE MATERIALS
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3514675 |
SEMI-CONDUCTOR ELEMENTS FOR JUNCTION DEVICES AND THE MANUFACTURE THEREOF
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3502554 |
METHOD FOR FORMING THIN FILMS
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3487024 |
ALLOY FILM
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3472653 |
NONMIGRATING SOLDERS AND PRINTED CIRCUITS THEREFROM
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3463636 |
CONSTANT CONDUCTIVITY ALLOYS
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3434828 |
GOLD ALLOY FOR ATTACHING A LEAD TO A SEMICONDUCTOR BODY
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3427154 |
AMORPHOUS ALLOYS AND PROCESS THEREFOR
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3412278 |
Hollow cathodes having a matrix material with particles interspersed
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3406673 |
INTERNAL COMBUSTION ENGINE SYSTEM
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3380898 |
ELECTROLYTE AND METHOD FOR ELECTRODEPOSITING A PINK GOLD ALLOY
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3380814 |
Electrolyte and method for coating articles with a gold-copper-antimony alloy and article thereof
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3374530 |
Process for the joinder of metallic members
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3356982 |
Metal film resistor for low range and linear temperature coefficient
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3340602 |
Process for sealing
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3297436 |
Method for making a novel solid metal alloy and products produced thereby
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3272625 |
Beryllium-gold alloy and article made therefrom
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3214653 |
Gold bonded, boron containing semiconductor devices
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3211550 |
Gold boron alloy and method of making the same
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