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Match Document Document Title
7612648 Disc varistor and method of manufacturing the same  
Disclosed herein are a disc varistor having a capability to absorb a double amount of surge and a method of manufacturing the varistor. The varistor includes a disc-shaped first ceramic body having...
7568830 Led holder  
An LED holder has a housing, a disc mounted in a lower end of the housing, a seat formed on the disc, a pair of sockets formed in the seat and a bracket mounted detachably on the seat to hole the...
7545653 Semiconductor integrated circuit device  
A disclosed semiconductor integrated circuit device includes a digital circuit and an analog circuit formed on one semiconductor substrate; a guard band configured to prevent noise generated in the...
7525183 Surface mount multichip devices  
A surface mountable multi-chip device is provided which includes first and second lead frames portions and at least two chips. The lead frame portions each include a header region and a lead...
7498664 Semiconductor package having increased resistance to electrostatic discharge  
Embodiments of the invention include a semiconductor integrated circuit package that includes a substrate having an integrated circuit die attached thereto. The package includes a ESD shield...
7480153 EMI shielding package and method for making the same  
An exemplary Electromagnetic Interference (EMI) shielding package ( 1 ) includes a substrate ( 10 ), a metal cap ( 15 ), and a potting compound ( 18 ). The substrate has a plurality of electronic...
7468547 RF-coupled digital isolator  
An RF-coupled digital isolator includes a first leadframe portion and a second leadframe portion, electrically isolated from one another. The first leadframe portion includes a first main body and...
7403399 Active primary-sided circuit arrangement for a switch-mode power supply  
The invention under consideration refers to a circuit arrangement for a switch-mode power supply, wherein the switch-mode power supply has a primary side, which can be connected to a supply...
7352587 Power semiconductor module having a half-bridge configuration  
A power semiconductor module having a carrier plate, on which at least four substrates are arranged, and having a first and a second busbar having two conductive plates is disclosed. The conductive...
7322736 LED positioning structure  
An improved LED positioning structure includes a retaining holder and a cover; multiple slots being disposed on one side of the retaining holder; a slope externally extending beneath each slot...
7203073 Circuit-constituting member and circuit unit  
A group of bus bars, forming a power circuit, are adhesively bonded to a surface of a control circuit board. Surface-mounting type relay switches are used as a switching unit for the power circuit....
7203071 Component mounting circuit board with resin-molded section covering circuit pattern and inner components  
A component mounting circuit board includes a circuit pattern including a plurality of electrically conductive plates, an inner electrical component electrically connected to the circuit pattern,...
7091580 Semiconductor device  
When a silicone gel is injected into a case, since the gel is liquid before curing, the gel attempts to rise along a minute gap formed between a front face of a first electrode and a rear face of a...
7085143 In-module current source  
Disclosed is a method and structure for locally powering a semiconductor chip within a package. The structure and method incorporate a local voltage regulator mounted adjacent a semiconductor chip...
7031170 Electronic device having a plastic housing and components of a height-structured metallic leadframe and methods for the production of the electronic device  
An electronic device has a plastic housing. The plastic housing has components of a height-structured metallic leadframe. The components are in a matrix form and contain contact islands and chip...
7015579 Semiconductor device for fingerprint recognition  
A semiconductor device is disclosed that performs fingerprint recognition on the electrostatic-capacity principle. A finger sweeping across a fingerprint recognition area of a semiconductor chip...
6927969 Circuit arrangement  
First and second chips each having a transistor are provided. The first chips are arranged along a first axis on a first metallic body in side-by-side and interspaced manner. The second chips are...
6864802 Wireless spread-spectrum telesensor chip with synchronous digital architecture  
A fully integrated wireless spread-spectrum sensor incorporating all elements of an “intelligent” sensor on a single circuit chip is capable of telemetering data to a receiver. Synchronous...
6759913 Crystal resonator based oscillator formed by attaching two separate housings  
A double-sided oscillator package having an open-top oscillator housing adapted to receive electronic components and a hermetically sealed resonator housing containing a piezoelectric element is...
6724599 Power semiconductor device  
A power semiconductor device comprises a power switching element having two main electrodes and one control electrode, a metal electrode connected to one of main electrodes of the power switching...
6711025 Combination device of the IC connection device and the main board  
A combination device of the IC package connection device and the main board comprises a socket and a main board. The socket has a holding assembly which is placed on the top surface of the socket....
6702609 IC socket contact medium having uniform contact force  
An IC socket is provided which realizes a uniform pressure of contact with an IC package over the entire length of a row of contacts and thereby enables an appropriate evaluation of characteristics...
6680123 Embedding resin  
An embedding resin embeds an electronic part in an object and has a dielectric constant of about 5 or less and tan δ of about 0.08 or less.
6665195 Converter appliance capacitor assembly  
The invention relates to a capacitor module for a converter. The capacitor module contains a capacitor which can be fastened to a base frame or to a cooling body by means of lateral, mechanical...
6629363 Process for mechanically attaching a temporary lid to a microelectronic package  
A process for picking up and moving a microelectronic package during card assembly operations. A clipping lid having a top surface and at least two sides attaches to a substrate via friction where...
6597585 Power semiconductor module  
A power semiconductor module includes a plastic housing, a plurality of connection elements for external main connections and control connections, and at least one ceramic substrate which is...
6563203 Motor driving device  
In a motor driving device, an IC chip of a drive circuit for driving a motor is die-bonded to one island of a leadframe, and a diode chip of a protection diode for preventing the drive circuit from...
6562643 Packaging types of light-emitting diode  
A LED packaging process is to place LED chips at predetermined positions on the printed circuit board substrate, followed by drilling holes to penetrate the substrate, followed by passing the...
6557675 Tunable vibration damper for processor packages  
The present invention relates to a method and apparatus that minimizes shock/vibrational motion in interposer sockets. The ability to control shock/vibration can ensure successful operation and...
6549425 Electronic apparatus with separating plate to secure electronic component  
An electronic apparatus has a casing, electrically insulating separating plates arranged in the casing, electronic components arranged in proximity to the separating plate, and a securing member....
6532157 Angulated semiconductor packages  
A novel semiconductor package comprises a rigid dielectric, e.g., ceramic, substrate having first and second portions joined to one another at respective margins thereof to form an angle, e.g., a...
6521989 Methods and apparatus for hermetically sealing electronic packages  
An electronic package and/or package lid includes at least one connection slot for receiving a line, such as an optical fiber. The package and/or package lid also includes at least one sealant slot...
6512680 Semiconductor package  
In a semiconductor package which contains an IC element therein and effects the inputting and outputting of a signal to the IC element through a plurality of pads, a group of signals is...
6507268 Low profile mount for plural upper electrode metal oxide varistor package and method  
A low profile mount for a disc varistor. A thermally sensitive switch is provided both for single and multiple electrode embodiments. The switch may be placed in a shorting circuit and include a...
6490166 Integrated circuit package having a substrate vent hole  
The present invention involves a method of providing an integrated circuit package having a substrate with a vent opening. The integrated circuit package includes a substrate having an opening and...
6456240 High-G, low energy beacon system  
A switch modulated low duty cycle low energy mass limited radio frequency beacon system for locating spent, un-exploded or experimental munitions projectiles in a large open-air test range or...
6456168 Temperature compensated crystal oscillator assembled on crystal base  
A dual-cavity temperature compensated crystal oscillator ( 100 ) provides a three-layer ceramic package ( 110 ), with a crystal ( 170 ) sealed in a well or cavity ( 148 ). Oscillator components (...
6421254 Multi-chip module having interconnect dies  
A multi-chip module includes a housing having insulative side walls and an end plate, conductive leads extending from the side walls, integrated circuit (IC) dies mounted to the end plate, and one...
6414852 Integrated circuit and method of design thereof  
A semiconductor integrated circuit comprising a functional block 500 which includes macrocells 510 to 513 . A macrocell 510 is connected to four input-output terminals 530 to 533 on four...
6404644 Non-contact IC card  
A non-contact IC card ( 1, 2, 30, 50 ) includes a substrate ( 10 ), a coil ( 12, 32, 52, 57 ) provided on substrate ( 10 ), and an IC chip ( 11, 31, 51 ) electrically connected to a coil ( 12, 32,...
6388888 Semiconductor device and process for manufacturing the same, liquid crystal module and process for mounting the same  
A semiconductor device comprising a patterned wiring including a connector for external connection formed on an elongate base film, a semiconductor element or the semiconductor element and a...
6377468 Electric circuit apparatus  
Circuit elements of surface-mounting type such as MOSFETs etc. are mounted on a circuit board by soldering. The circuit board is retained slantingly by a base so that any one of the MOSFET falls...
6377466 Header, a method of manufacture thereof and an electronic device employing the same  
A header containing a semiconductor die, method of manufacture thereof and electronic device employing the same. In one embodiment, the header includes first and second contacts, and an...
6373273 Test insert containing vias for interfacing a device containing contact bumps with a test substrate  
An insert is provided for testing a chip-scale-packaged microelectronic device having an encapsulant-protrusion and a ball-grid-array of outwardly-projecting contacts. The insert comprises a...
6369324 High-frequency input/output feedthrough and package for housing a high-frequency semiconductor element  
In a conventional high-frequency input/output feedthrough having a microstrip line, for a millimeter wave band, the reliability of a hermetic seal portion was low and transmission characteristics...
6366468 Self-aligned common carrier  
Precision alignment of one or more parts on a common carrier is described. A self-aligned common carrier includes a carrier substrate having one or more pockets formed in the substrate. Each pocket...
6351027 Chip-mounted enclosure  
A chip mounted enclosure (“CME”) comprises a base formed by an integrated circuit chip, a transducer element disposed on the integrated circuit chip, a side piece surrounding the transducer...
6350630 Method for attaching a micromechanical sensor in a housing and sensor assembly  
A sensor assembly is formed by attaching a micromechanical semiconductor sensor in a housing. The micro-mechanical sensor is secured to the housing by a gel, which leads to a particularly favorable...
6335669 RF circuit module  
An RF circuit module comprising a first RF semiconductor device 19 mounted within a cavity 4 surrounded by a wall 3 of a first dielectric circuit board 1, and a second RF semiconductor...
6320739 Electronic part and manufacturing method therefor  
An electronic part in which a chip 2 having bump electrodes is sealed in a cavity 14 of a resin container 10, wherein the resin container having: a mounting board 1 having a conductor pattern 4 for...
Matches 1 - 50 out of 200 1 2 3 4 >