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7615853 |
Chip-stacked package structure having leadframe with multi-piece bus bar
The present invention provides a chip-stacked package structure with leadframe having multi-piece bus bar, comprising: a leadframe composed of a plurality of inner leads arranged in rows facing...
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7612436 |
Packaged microelectronic devices with a lead frame
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed herein. In one embodiment, a packaged microelectronic device can include a support...
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7598604 |
Low profile semiconductor package
A first semiconductor element and a second semiconductor element each have an electrode forming surface with an electrode pad thereon. The first semiconductor element and the second semiconductor...
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7556987 |
Method of fabricating an integrated circuit with etched ring and die paddle
An integrated circuit package system is provided including forming a D-ring comprising half etching a paddle, etching a ring, and etching a tie bar. The tie bar is between the paddle and the ring....
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7524696 |
Sensor including lead frame and method of forming sensor including lead frame
A sensor includes a plurality of leads that have bottom surfaces extending in a first plane, a stage that extends in a second plane that tilts from the first plane, a sensor chip that is supported...
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7497011 |
Hoop molding method
A hoop molding method comprises forming, in the frame portions, connection portions that link, to the frame portions, at least one molded portion of the at least one bent molded portion or at least...
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7495322 |
Light-emitting device
A light-emitting device ( 200 ) has a submount ( 100 ) and a plate for heat transfer ( 300 ) having a metallic plate ( 30 ). The submount ( 100 ) has a mount base ( 10 ), at least one...
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7484291 |
Method of manufacturing a disk drive with a lead frame engaged within a host electronic unit socket
A method of manufacturing a disk drive for use with a host electronic unit (HEU). The HEU including a printed circuit board having a socket and HEU disk drive circuitry. The method includes...
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7449370 |
Production process for manufacturing such semiconductor package
In a semiconductor package including at least one plate-like mount, a semiconductor chip has at least one electrode formed on a top surface thereof, and is mounted on the plate-like mount such that...
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7435102 |
Interconnecting electrical devices
A male contact having a longitudinal axis includes a head configured to contact a corresponding electrical contact and a first portion extending along the longitudinal axis and configured to be...
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7425756 |
Semiconductor device and electronic device
This invention provides a high frequency power module which is incorporated into a mobile phone and which incorporates high frequency portion analogue signal processing ICs including low noise...
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7425470 |
Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths
The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a...
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7405467 |
Power module package structure
A power module package structure is disclosed. The control circuits are fabricated on a circuit plate, instead of fabricating them directly on a main substrate. The fabrication cost is reduced...
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7391101 |
Semiconductor pressure sensor
A semiconductor pressure sensor can reduce the damage of bonding wires to increase their life time even under an environment in which the temperature and pressure change rapidly and radically. The...
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7385394 |
Integrated magnetic sensor component
A sensor component used to measure a magnetic field strength is disclosed. In one embodiment, the sensor component contains a plurality of leads and a sensor semiconductor chip, which measures the...
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7339797 |
Chip mount, methods of making same and methods for mounting chips thereon
The present invention describes a pre-fabricated chip mount and a method for making the pre-fabricated mount. The mount includes a mount body and a protective ring attached to the body by a...
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7332757 |
MOSFET package
A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic...
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7307339 |
Semiconductor device having curved leads offset from the center of bonding pads
A semiconductor device including: a substrate on which a plurality of leads are formed; and a semiconductor chip mounted on the substrate in such a manner that a surface of the semiconductor chip...
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7286360 |
Heat radiating system and method for a mobile communication terminal
A system and method for transferring heat from a terminal in a mobile communication system. The system comprises a circuit board mounted to a terminal body, in which a heat generating component is...
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7279780 |
Quad flat no-lead (QFN) grid array package, method of making and memory module and computer system including same
A quad flat no-lead (QFN) grid array semiconductor package and method for making the same are provided. The package includes a semiconductor die and a lead frame having a plurality of conductive...
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7271471 |
Metal substrate apparatus, method of manufacturing an IC card module apparatus, and an IC card module apparatus
A metal substrate apparatus comprises a plurality of metal substrates forming an IC card module used in manufacturing transfer mold-type non-contact IC cards. The metal substrate apparatus...
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7262973 |
Power conversion module device and power unit using the same
In a power conversion module device of the present invention, a transformer, a primary power element and a secondary power element are mounted on a printed wiring board in surface-to-surface...
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7253506 |
Micro lead frame package
The present invention comprises a lead frame substrate adapted to receive semiconductor die and multiple passive components. The lead frame substrate is preferably formed from a single piece of...
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7247931 |
Semiconductor package and leadframe therefor having angled corners
A leadframe for a semiconductor package is formed with an indentation on a bottom surface. A side of the indentation is used to form a mold-lock that assists in securing the leadframe to the...
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7203073 |
Circuit-constituting member and circuit unit
A group of bus bars, forming a power circuit, are adhesively bonded to a surface of a control circuit board. Surface-mounting type relay switches are used as a switching unit for the power circuit....
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7173321 |
Semiconductor package having multiple row of leads
Provided is a method of producing a semiconductor package including at least two rows of leads in which the leads of each row separately connecting a semiconductor chip to an external substrate....
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7138673 |
Semiconductor package having encapsulated chip attached to a mounting plate
In a semiconductor package including at least one plate-like mount, a semiconductor chip has at least one electrode formed on a top surface thereof, and is mounted on the plate-like mount such that...
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7123107 |
Piezoelectric oscillator, manufacturing method thereof, and electronic device
To provide a piezoelectric oscillator which can be reduced in size by reducing the planar size. With regard to a layered lead frame comprising two lead frames and, connection leads for connection...
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7109572 |
Quad flat no lead (QFN) grid array package
A quad flat no-lead (QFN) grid array semiconductor package and method for making the same is disclosed. The package includes a semiconductor die and a lead frame having a plurality of conductive...
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7084490 |
Leads under chip IC package
A semiconductor device assembly including a semiconductor device having a plurality of bond pads on the active surface thereof and a lead frame having a portion of the plurality of lead fingers of...
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7075173 |
Interposer including adhesive tape
Two dice may be provided within a single package so that one pin and associated leadfinger may be coupled to bond pads on different dice. This may mean that two different bond pads on different...
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7064420 |
Integrated circuit leadframe with ground plane
A leadframe for a semiconductor package includes signal and ground leads, a ground plane, and a frame paddle. Supports connect the signal and ground leads, ground plane, and frame paddle in at...
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7031170 |
Electronic device having a plastic housing and components of a height-structured metallic leadframe and methods for the production of the electronic device
An electronic device has a plastic housing. The plastic housing has components of a height-structured metallic leadframe. The components are in a matrix form and contain contact islands and chip...
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7030763 |
Method for manufacturing electronic tag
In the event of the shipment of electronic tags from a manufacturer to a customer, a number of the electronic tags required by the customer are adhered to a double-faced adhesive tape and then the...
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7016200 |
Module support for electrical/electronic components
In a module frame for electronic components, having a conductor structure having a metallic conductor, at least one contact segment of a metallic conductor, the at least one contact segment of the...
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7008824 |
Method of fabricating mounted multiple semiconductor dies in a package
A semiconductor device includes multiple dies, in which a first die and a second die are mounted on a leadframe. The bond pads on the first and second dies are wirebonded to the leadframe. The...
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7002813 |
Assembly comprised of a panel-like constructed module and of a connection unit, production method and device
An arrangement which has a panel-like electrical/electronic module, such as a solar power module, and a connection unit which are electrically connected to one another. The module and the...
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7002249 |
Microelectronic component with reduced parasitic inductance and method of fabricating
A semiconductor device package is disclosed which includes inter-digitated input and output bond wires configured to increase the negative mutual inductive coupling between the wires, thus reducing...
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6965517 |
Component substrate for a printed circuit board and method of assembyling the substrate and the circuit board
The invention provides a system and method for assembling an electrical module. The module comprises a circuit board, a substrate and an electrical component carried on the substrate. The substrate...
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6921966 |
Tape under frame for lead frame IC package assembly
A semiconductor integrated circuit device, and method of manufacturing the same, having a conventional-type lead frame with the die paddle removed. In particular, the die paddle is replaced with a...
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6912134 |
Fan control circuit and package
A dual output power module housing a dual output power circuit for providing variable power to two parallel connected fan motors is shown. The power module includes a pad which has disposed thereon...
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6909168 |
Resin encapsulation semiconductor device utilizing grooved leads and die pad
A resin-encapsulation semiconductor device of this invention includes a die pad for mounting a semiconductor element; a plurality of supporting leads; a semiconductor element; a plurality of leads...
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6902309 |
Light-emitting unit and illumination device and image reading device using light-emitting unit
A light-emitting unit 20 has a light-emitting unit board 21 made of resin provided with a lead frame 22 . The light-emitting unit board 21 is also provided with an open window 21 a for...
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6900524 |
Resin molded semiconductor device on a lead frame and method of manufacturing the same
A resin molded type semiconductor device has: a semiconductor chip ( 12 ) which is mounted on a die pad portion ( 11 ) of a lead frame ( 9 ); thin metal wires ( 14 ) which connect terminals of the...
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6894904 |
Tab package
A tape automated bonding (TAB) package and a method for fabricating the same is provided. A chip (a wire-bond chip or a flip chip) is bonded to a tape carrier through thermal compression. The chip...
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6853558 |
Surface mount power supply device and associated method
A surface mount power supply device and a method for mounting a lead frame to a circuit board, which has a first and second side, and assembling such a device. The lead frame has leads with a lead...
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6838755 |
Leadframe for integrated circuit chips having low resistance connections
A leadframe for semiconductor devices, including a region which is adapted to support a semiconductor device and a plurality of leads which are arranged so as to be directed toward the region, for...
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6833999 |
Optical module and method of making the same
An optical module comprises (1) an optical device assembly having an optical device for converting one of optical and electric signals into the other; (2) a circuit board for mounting an electronic...
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6819570 |
Circuit board with lead frame
In a circuit board of the present invention, a lead frame includes an electrode for mounting an electronic component. The lead frame is encapsulated in a resin portion. The lead frame includes a...
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6806559 |
Method and apparatus for connecting vertically stacked integrated circuit chips
Prepackaged chips, such a memory chips, are vertically stacked and bonded together with their terminals aligned. The exterior lead frames are removed including that portion which extends into the...
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