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7425756 Semiconductor device and electronic device  
This invention provides a high frequency power module which is incorporated into a mobile phone and which incorporates high frequency portion analogue signal processing ICs including low noise...
7425470 Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths  
The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a...
7405467 Power module package structure  
A power module package structure is disclosed. The control circuits are fabricated on a circuit plate, instead of fabricating them directly on a main substrate. The fabrication cost is reduced...
7400002 MOSFET package  
A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic...
7394146 MOSFET package  
A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic...
7391101 Semiconductor pressure sensor  
A semiconductor pressure sensor can reduce the damage of bonding wires to increase their life time even under an environment in which the temperature and pressure change rapidly and radically. The...
7385394 Integrated magnetic sensor component  
A sensor component used to measure a magnetic field strength is disclosed. In one embodiment, the sensor component contains a plurality of leads and a sensor semiconductor chip, which measures the...
7342267 MOSFET package  
A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic...
7339797 Chip mount, methods of making same and methods for mounting chips thereon  
The present invention describes a pre-fabricated chip mount and a method for making the pre-fabricated mount. The mount includes a mount body and a protective ring attached to the body by a...
7332757 MOSFET package  
A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic...
7307339 Semiconductor device having curved leads offset from the center of bonding pads  
A semiconductor device including: a substrate on which a plurality of leads are formed; and a semiconductor chip mounted on the substrate in such a manner that a surface of the semiconductor chip...
7286360 Heat radiating system and method for a mobile communication terminal  
A system and method for transferring heat from a terminal in a mobile communication system. The system comprises a circuit board mounted to a terminal body, in which a heat generating component is...
7279780 Quad flat no-lead (QFN) grid array package, method of making and memory module and computer system including same  
A quad flat no-lead (QFN) grid array semiconductor package and method for making the same are provided. The package includes a semiconductor die and a lead frame having a plurality of conductive...
7271471 Metal substrate apparatus, method of manufacturing an IC card module apparatus, and an IC card module apparatus  
A metal substrate apparatus comprises a plurality of metal substrates forming an IC card module used in manufacturing transfer mold-type non-contact IC cards. The metal substrate apparatus...
7262973 Power conversion module device and power unit using the same  
In a power conversion module device of the present invention, a transformer, a primary power element and a secondary power element are mounted on a printed wiring board in surface-to-surface...
7253506 Micro lead frame package  
The present invention comprises a lead frame substrate adapted to receive semiconductor die and multiple passive components. The lead frame substrate is preferably formed from a single piece of...
7247931 Semiconductor package and leadframe therefor having angled corners  
A leadframe for a semiconductor package is formed with an indentation on a bottom surface. A side of the indentation is used to form a mold-lock that assists in securing the leadframe to the...
7229018 Manufacture of RFID tags and intermediate products therefor  
In the manufacture of RFID tags, electronic components are connected with soldered connections to antennas stamped from a thin strip of electrically conductive metal, utilizing methods and...
7203073 Circuit-constituting member and circuit unit  
A group of bus bars, forming a power circuit, are adhesively bonded to a surface of a control circuit board. Surface-mounting type relay switches are used as a switching unit for the power circuit....
7173321 Semiconductor package having multiple row of leads  
Provided is a method of producing a semiconductor package including at least two rows of leads in which the leads of each row separately connecting a semiconductor chip to an external substrate....
7138673 Semiconductor package having encapsulated chip attached to a mounting plate  
In a semiconductor package including at least one plate-like mount, a semiconductor chip has at least one electrode formed on a top surface thereof, and is mounted on the plate-like mount such that...
7123107 Piezoelectric oscillator, manufacturing method thereof, and electronic device  
To provide a piezoelectric oscillator which can be reduced in size by reducing the planar size. With regard to a layered lead frame comprising two lead frames and, connection leads for connection...
7109572 Quad flat no lead (QFN) grid array package  
A quad flat no-lead (QFN) grid array semiconductor package and method for making the same is disclosed. The package includes a semiconductor die and a lead frame having a plurality of conductive...
7084490 Leads under chip IC package  
A semiconductor device assembly including a semiconductor device having a plurality of bond pads on the active surface thereof and a lead frame having a portion of the plurality of lead fingers of...
7075173 Interposer including adhesive tape  
Two dice may be provided within a single package so that one pin and associated leadfinger may be coupled to bond pads on different dice. This may mean that two different bond pads on different...
7064420 Integrated circuit leadframe with ground plane  
A leadframe for a semiconductor package includes signal and ground leads, a ground plane, and a frame paddle. Supports connect the signal and ground leads, ground plane, and frame paddle in at...
7031170 Electronic device having a plastic housing and components of a height-structured metallic leadframe and methods for the production of the electronic device  
An electronic device has a plastic housing. The plastic housing has components of a height-structured metallic leadframe. The components are in a matrix form and contain contact islands and chip...
7030763 Method for manufacturing electronic tag  
In the event of the shipment of electronic tags from a manufacturer to a customer, a number of the electronic tags required by the customer are adhered to a double-faced adhesive tape and then the...
7016200 Module support for electrical/electronic components  
In a module frame for electronic components, having a conductor structure having a metallic conductor, at least one contact segment of a metallic conductor, the at least one contact segment of the...
7008824 Method of fabricating mounted multiple semiconductor dies in a package  
A semiconductor device includes multiple dies, in which a first die and a second die are mounted on a leadframe. The bond pads on the first and second dies are wirebonded to the leadframe. The...
7002813 Assembly comprised of a panel-like constructed module and of a connection unit, production method and device  
An arrangement which has a panel-like electrical/electronic module, such as a solar power module, and a connection unit which are electrically connected to one another. The module and the...
7002249 Microelectronic component with reduced parasitic inductance and method of fabricating  
A semiconductor device package is disclosed which includes inter-digitated input and output bond wires configured to increase the negative mutual inductive coupling between the wires, thus reducing...
6979889 Plastic lead frames for semiconductor devices  
A conductive plastic lead frame and method of manufacturing the same, suitable for use in IC packaging, circuit card, electronic device, and a computer system. In a preferred embodiment, the lead...
6965517 Component substrate for a printed circuit board and method of assembyling the substrate and the circuit board  
The invention provides a system and method for assembling an electrical module. The module comprises a circuit board, a substrate and an electrical component carried on the substrate. The substrate...
6921966 Tape under frame for lead frame IC package assembly  
A semiconductor integrated circuit device, and method of manufacturing the same, having a conventional-type lead frame with the die paddle removed. In particular, the die paddle is replaced with a...
6912134 Fan control circuit and package  
A dual output power module housing a dual output power circuit for providing variable power to two parallel connected fan motors is shown. The power module includes a pad which has disposed thereon...
6909168 Resin encapsulation semiconductor device utilizing grooved leads and die pad  
A resin-encapsulation semiconductor device of this invention includes a die pad for mounting a semiconductor element; a plurality of supporting leads; a semiconductor element; a plurality of leads...
6902309 Light-emitting unit and illumination device and image reading device using light-emitting unit  
A light-emitting unit 20 has a light-emitting unit board 21 made of resin provided with a lead frame 22 . The light-emitting unit board 21 is also provided with an open window 21 a for...
6900524 Resin molded semiconductor device on a lead frame and method of manufacturing the same  
A resin molded type semiconductor device has: a semiconductor chip ( 12 ) which is mounted on a die pad portion ( 11 ) of a lead frame ( 9 ); thin metal wires ( 14 ) which connect terminals of the...
6894904 Tab package  
A tape automated bonding (TAB) package and a method for fabricating the same is provided. A chip (a wire-bond chip or a flip chip) is bonded to a tape carrier through thermal compression. The chip...
6894372 Tape under frame for lead frame IC package assembly  
A semiconductor integrated circuit device, and method of manufacturing the same, having a conventional-type lead frame with the die paddle removed. In particular, the die paddle is replaced with a...
6885097 Semiconductor device  
A board-shaped thermal conductor base board ( 3 ) is arranged on the bottom surface of a power module ( 1 ). Substrates ( 4 ) and ( 5 ) are arranged on the top surface of the thermal conductor base...
6885092 Semiconductor device and a memory system including a plurality of IC chips in a common package  
A semiconductor device is formed by laminating two semiconductor chips with the rear surfaces thereof provided face to face. Each semiconductor chip is provided with an outer lead for clock enable...
6861735 Resin molded type semiconductor device and a method of manufacturing the same  
A resin molded type semiconductor device has: a semiconductor chip ( 12 ) which is mounted on a die pad portion ( 11 ) of a lead frame ( 9 ); thin metal wires ( 14 ) which connect terminals of the...
6853558 Surface mount power supply device and associated method  
A surface mount power supply device and a method for mounting a lead frame to a circuit board, which has a first and second side, and assembling such a device. The lead frame has leads with a lead...
6853178 Integrated circuit leadframes patterned for measuring the accurate amplitude of changing currents  
A metallic leadframe for use with a semiconductor chip intended for operation in a changing magnetic field comprises a chip mount pad having at least one slit penetrating the whole thickness of the...
6838755 Leadframe for integrated circuit chips having low resistance connections  
A leadframe for semiconductor devices, including a region which is adapted to support a semiconductor device and a plurality of leads which are arranged so as to be directed toward the region, for...
6833999 Optical module and method of making the same  
An optical module comprises (1) an optical device assembly having an optical device for converting one of optical and electric signals into the other; (2) a circuit board for mounting an electronic...
6819570 Circuit board with lead frame  
In a circuit board of the present invention, a lead frame includes an electrode for mounting an electronic component. The lead frame is encapsulated in a resin portion. The lead frame includes a...
6806559 Method and apparatus for connecting vertically stacked integrated circuit chips  
Prepackaged chips, such a memory chips, are vertically stacked and bonded together with their terminals aligned. The exterior lead frames are removed including that portion which extends into the...
Matches 1 - 50 out of 488 1 2 3 4 5 6 7 8 9 10 >