|
Match
|
Document |
Document Title |
|
|
7479697 |
Resilient carrier assembly for an integrated circuit
Provided is a carrier assembly for an integrated circuit. The assembly includes a carrier having a matrix of island contacts interconnected by respective serpentine members to allow resilient...
|
|
|
7445457 |
Techniques for connecting midplane connectors through a midplane
A midplane has plated through holes (PTHs) which form a first profile and a second profile. The first profile has (i) an overlapping portion which overlaps at least part of the second profile and...
|
|
|
7411134 |
Hybrid ground grid for printed circuit board
Electrical mounting boards and methods for their fabrication and use are disclosed herein. In particular, such mounting boards embodiments utilize hybrid ground lines interconnected through a...
|
|
|
7397001 |
Multi-strand substrate for ball-grid array assemblies and method
A multi-strand printed circuit board substrate for ball-grid array (BGA) assemblies includes a printed wiring board ( 11 ) having a plurality of BGA substrates ( 12 ) arranged in N rows ( 14 ) and...
|
|
|
7321497 |
Electronic circuit apparatus and method for stacking electronic circuit units
The invention provides an electronic circuit apparatus having a plurality of electronic circuit units ( 101 a - 101 n ), a circuit board ( 102 ) and a connection unit ( 103 ), the circuit board (...
|
|
|
7247941 |
Printed circuit board assembly with strain-alleviating structures
A printed circuit board (PCB) assembly includes a PCB. An integrated circuit (IC) carrier defines a receiving zone to receive an IC. The carrier has a plurality of island portions about the...
|
|
|
7199306 |
Multi-strand substrate for ball-grid array assemblies and method
A multi-strand printed circuit board substrate for ball-grid array (BGA) assemblies includes a printed wiring board ( 11 ) having a plurality of BGA substrates ( 12 ) arranged in N rows ( 14 ) and...
|
|
|
7139648 |
Apparatus for actuating a control element for a heating or air-conditioning system in a motor vehicle
The invention relates to an apparatus for actuating a control element, for example, an air flap, for a heating or air-conditioning system ( 34 ) in a motor vehicle, having an actuating drive ( 32...
|
|
|
7031170 |
Electronic device having a plastic housing and components of a height-structured metallic leadframe and methods for the production of the electronic device
An electronic device has a plastic housing. The plastic housing has components of a height-structured metallic leadframe. The components are in a matrix form and contain contact islands and chip...
|
|
|
6787984 |
Wiring substrate, manufacturing method therefor, and image display device
A wiring substrate for a display panel having a plurality of wiring electrodes thereon includes an airtight container formed by disposing an opposing substrate through a frame member on the surface...
|
|
|
6542952 |
PCI computer system having a transition module and method of operation
A PCI computer system includes component boards ( 130 ) adjacent to and coupled to a PCI bus ( 120 ), a controller board ( 310 ) coupled to the PCI bus, a transition module ( 140 ) coupled to the...
|
|
|
6535397 |
Interconnect structure for interconnecting electronic modules
An interconnect structure interconnects electronic modules and includes a backplane assembly formed from a substantially rigid backplane plate that carries RF connectors and a digital motherboard...
|
|
|
6496377 |
Vehicle electric power distribution system
A vehicle electric power distribution apparatus is provided which includes a plurality of vertically stacked conductive circuit layers, each layer including an array of contact pads, a layer of...
|
|
|
6485309 |
Virtual midplane to enhance card interconnections using a matrix of interconnecting assemblies
The present invention is a method and apparatus for interconnection system. A first connector located on a first card provides first contacts for first signal traces on the first card. The first...
|
|
|
6445578 |
Data storage enclosure
An enclosure for a data storage system comprises at least first and second cast magnesium parts joined by rivets, each of which is made of a suitable material that provides compressive strength...
|
|
|
6423909 |
Circuit board construction for differential bus distribution
A circuit board including differential bus traces on or buried within both sides of the board, interconnecting electronic devices such as disk drives, processors, and connectors for external...
|
|
|
6388200 |
Electronic interconnection medium having offset electrical mesh plane
An electrical interconnection medium is provided having first and second overlying interconnection layers. Each interconnection layer includes parallel conductors, and the conductors of the first...
|
|
|
6303871 |
Degassing hole design for olga trace impedance
An organic land grid array having multiple built up layers of metal sandwiching non-conductive layers, having a staggered pattern of degassing holes in the metal layers. The staggered pattern...
|
|
|
6297460 |
Multichip module and method of forming same
An electrical interconnection medium is provided having first and second overlying interconnection layers. Each interconnection layer includes parallel conductors, and the conductors of the first...
|
|
|
6049043 |
Printed circuit board
A printed circuit board has a plastic carrier plate and a one-piece pressed screen forming interconnects of the electrical circuit that are firmly mechanically connected to one another via...
|
|
|
6037677 |
Dual-pitch perimeter flip-chip footprint for high integration asics
A connection array for a chip provides a substantial increase in numbers of signal connection locations and a power distribution arrangement of improved robustness and noise immunity while...
|
|
|
5956232 |
Chip support arrangement and chip support for the manufacture of a chip casing
Chip-support arrangement (23) with a chip support (23) for the manufacture of a chip casing, said chip support being provided on a support foil (20) with conducting paths (21) which are connected...
|
|
|
5887158 |
Switching midplane and interconnecting system for interconnecting large numbers of signals
A physical interconnection architecture for making connections between a plurality of first printed-circuit boards and a plurality of second printed-circuit boards includes a midplane...
|
|
|
5644115 |
Relay matrix switching assembly
A matrix of three pole, high speed, low current relays for connecting test equipment to a device under test is provided with improved interconnect buses. The relays are mounted in rows and columns...
|
|
|
5640308 |
Field programmable circuit module
The invention uses a programmable interconnect substrate having a plurality of conductive and interconnectable vias located on one or both surfaces thereof. A customized pattern of bonding pads is...
|
|
|
5633479 |
Multilayer wiring structure for attaining high-speed signal propagation
Signal wiring layers are formed between a power supply layer and a ground layer, which have conductor patterns each constituted by a plurality of parallel strip-shaped conductors. The above layers...
|
|
|
5585602 |
Structure for providing conductive paths
A method for forming one or more conductive paths by providing a first pattern of pre-formed conductive elements and a second pattern of preformed conductive elements in a substrate and forming, at...
|
|
|
5572409 |
Apparatus including a programmable socket adapter for coupling an electronic component to a component socket on a printed circuit board
Two types of programmable elements, fuses and antifuses, are disclosed for forming an electrically programmable socket adapter in one embodiment. The socket adapter can be used for interconnecting...
|
|
|
5512782 |
Semiconductor device for DC/AC converter
A semiconductor device for converting DC input power to AC output power includes a package having a rectangular shape with four side edges and containing a plurality of semiconductor chips therein....
|
|
|
5481073 |
Modular broadband bidirectional programmable switch system with stacked modular switch arrangement
The basic element of a modular, bidirectional broadband programmable switch system is a switch module having a thin rectangular housing with a single first connector preferably in the center of an...
|
|
|
5438166 |
Customizable circuitry
A customizable circuit using a programmable interconnect and compatible TAB chip bonding design. The programmable interconnect comprises layers of wire segments forming programmable junctions...
|
|
|
5410107 |
Multichip module
An electrical interconnection medium having first and second overlying interconnection layers, each interconnection layer including parallel conductors, the conductors of the first and second...
|
|
|
5390081 |
Fault-tolerant power distribution system for rack-mounted hardware
Fault-tolerant power distribution system for back-mounted hardware in which a backplane arrangement delivers alternative sources of system power in a prioritized pattern to each of a plurality of...
|
|
|
5352123 |
Switching midplane and interconnection system for interconnecting large numbers of signals
A physical interconnection architecture for making connections between a plurality of first printed-circuit boards and a plurality of second printed-circuit boards includes a midplane...
|
|
|
5309327 |
Apparatus and method for manufacturing printed circuit boards
A circuit board assembly system for manufacturing a prototype printed circuit board having a matrix formed in it. A base board having a connection matrix that matches the matrix of the printed...
|
|
|
5289340 |
Structure of an electronic device including a number of printed circuit boards
An electronic device has a rack accommodating a mother board and a first and a second printed circuit board (PCB) group mounted on the mother board. The PCBs belonging to one of the first and...
|
|
|
5278727 |
High density electrical interconnection device and method therefor
A high density electrical interconnection device provides a uniform complementary pattern of thieving lines on both X and Y interconnect layers of the high density device to provide for uniform...
|
|
|
5257166 |
Configurable electronic circuit board adapter therefor, and designing method of electronic circuit using the same board
There is provided a configurable electronic circuit board which comprises a board including many modular sockets in a minimum unit each having a size and the number of pins both standardized, the...
|
|
|
5190462 |
Multilead microwave connector
An N×M electrical connector suitable for use at microwave frequencies comprises a first set of N insulating parallel substrates each containing M notches with adjacent planar conductors and a...
|
|
|
5130893 |
Signal distribution system
There is provided a distribution system and a wiring format which will not only provide for a common enclosure, which will help to centralize the entrance of services to a facility, but will also...
|
|
|
5124638 |
Automatic circuit tester employing a three-dimensional switch-matrix layout
An automatic circuit tester (10) employs a scanner (20) embodied in a group of interconnected main scanner boards (46, 47) that provide switching by means of mechanical relays. In order to provide...
|
|
|
5081561 |
Customizable circuitry
A customizable circuit using a programmable interconnect and a compatible tape design for tape automated bonding of chips to the circuitry. The programmable interconnect comprises layers of wires,...
|
|
|
5034855 |
Printed circuit assembly
On a printed circuit board, according to the present invention, IC packages are arranged in a matrix layout. The IC packages are soldered to the printed circuit board via their lead wires provided...
|
|
|
5032896 |
3-D integrated circuit assembly employing discrete chips
A 3-D IC chip assembly is formed from stacked substrates in which each individual substrate has a plurality of different IC chips retained in respective recesses. Conductive feedthroughs extend...
|
|
|
4949171 |
Commutation grid
A commutation grid in which any of N input signals can be output to any of M outputs. The input signals are fed to an input card which passes the input signals to an output card via a commutation...
|
|
|
4916576 |
Matrix capacitor
A multipin matrix capacitor includes a first and second electrode separated by a dielectric material to form a capacitive element and includes terminals for connecting it to the first and second...
|
|
|
4906987 |
Printed circuit board system and method
The printed circuit board system and method are characterized by the use of at least one integrated circuit path bridging device, preferably a programmable integrated crosspoint switch, mounted to...
|
|
|
4902555 |
Hybrid circuit element and method of manufacturing the same
Disclosed herein is a hybrid circuit element including a redox electrial element formed with redox materials such as biomaterials or pseud-biomaterials and a semiconductor element together with the...
|
|
|
4876630 |
Mid-plane board and assembly therefor
A mid-plane board for orthogonally interconnecting a first set of circuit boards to a second set of circuit boards. The mid-plane board has a first group of pins which project outwardly equally on...
|
|
|
4859806 |
Discretionary interconnect
A discretionary interconnect which includes orthogonal arrays of conductors sandwiched between conductive planes and accessible through a number of selectively arranged vias for interconnection and...
|