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7626825 |
Optical transmitter module
An optical transmitter module is described. The optical transmitter module includes a lead pin for electrically connecting the inside and outside of a housing, and a flexible printed circuit board...
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7615708 |
Arrangement of non-signal through vias and wiring board applying the same
An arrangement of non-signal through vias suitable for a wiring board is provided. The wiring board has a contact surface, a core layer and pads. The contact pads are disposed on the contact...
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7599192 |
Layered structure with printed elements
The present invention incorporates electronic components into an electronic core structure that may be readily hot laminated by existing processes. The structure may include multiple desired...
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7599190 |
High-frequency module, and method of producing same
A high-frequency module having a communication function is provided which includes a base substrate block ( 2 ) formed from organic substrates ( 11, 12 ), the organic substrate ( 11 ) having wiring...
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7583513 |
Apparatus for providing an integrated printed circuit board registration coupon
A device includes a plane metallization layer, and a plane plated through hole attached to the plane metallization layer and terminating at the at a major exterior surface with a plurality of...
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7583512 |
Printed circuit board including embedded passive component
Disclosed is a PCB including an embedded passive component and a method of fabricating the same. The PCB includes at least two circuit layers in which circuit patterns are formed. At least one...
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7573725 |
Optimizing power delivery and signal routing in printed circuit board design
A system, method and apparatus for providing a printed circuit board having optimized power delivery planes and signal routing regions are disclosed. In one aspect, the present disclosure teaches a...
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7548432 |
Embedded capacitor structure
An embedded capacitor structure comprising a main body; at least one embedded capacitor, having a first electrode, a dielectric layer, and a second electrode, formed in the main body; and at least...
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7542303 |
Printed circuit board
A printed circuit board (PCB) includes first and second signal layers sandwiching a dielectric layer therebetween, and a differential pair having two differential traces respectively disposed...
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7531754 |
Flexible substrate having interlaminar junctions, and process for producing the same
A flexible substrate comprises a film, a first insulating resin layer on a front face of the film, a second insulating resin layer on a rear face of the film, a front-sided wiring pattern embedded...
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7525814 |
Wiring board and method for manufacturing the same
A wiring board includes a plurality of via pads disposed on a ceramic sub-core accommodated in a core board. A Cu-plated layer is formed on the surface of a conductor pad and serves as a processed...
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7518881 |
Interposer containing bypass capacitors for reducing voltage noise in an IC device
One embodiment of the present invention provides an apparatus that reduces voltage noise for an integrated circuit (IC) device. This apparatus includes an interposer, which is configured to be...
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7518884 |
Tailoring impedances of conductive traces in a circuit board
An apparatus and method that permits signal traces of different widths and the same impedance to be placed on the same layer of a printed circuit board (PCB). Alternatively, signal traces of...
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7515436 |
Communication unit
In a communication unit 100 , a ground layer section 101 which is a sheet-like conductive material and a power-source layer section 102 which is a sheet-like conductive material are laid out...
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7508681 |
Printed circuit board for high speed, high density electrical connector with improved cross-talk minimization attenuation and impedance mismatch characteristics
In the preferred embodiment, there is disclosed a printed circuit board having a surface providing a mating interface to which is electrically connected an electrical connector having signal...
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7504843 |
Probe unit substrate
A ceramic substrate has, on its surface, a multilayer wiring division, on which micro cantilever type probes are fixed. The multilayer wiring division has the first conductor layer, which includes...
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7505281 |
Multilayer wiring board for an electronic device
A multilayer wiring board includes a first insulating film and a first patterned metal wiring film extending along a first major surface thereof, and a second insulating film a second patterned...
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7501583 |
Low noise multilayer printed circuit board
A low noise multilayer printed circuit board includes at least one ground layer and at least one power layer. The at least one ground layer is divided into a first area and a second area. The first...
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7495177 |
Printed wiring board, its manufacturing method, and circuit device
A printed wiring board manufacturing process comprises forming a conductive metal layer on at least one surface of an insulating film with a sputtered metal layer in between, selectively etching...
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7470864 |
Multi-conducting through hole structure
A multi-conducting through hole structure is provided. The multi-conducting through hole structure has a substrate, at least two signal lines and at least a reference line. The substrate has a...
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7468490 |
Circuit substrate and electronic apparatus, fabrication process thereof
A circuit substrate comprises a lamination of plural resin insulation films and includes, on a surface and in an interior of the circuit substrate, plural interconnection layers. One of the plural...
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7465882 |
Ceramic substrate grid structure for the creation of virtual coax arrangement
Signal line conductors passing through vertical vias in an insulative substrate for supporting and interconnecting integrated circuit chips are provided with shielding conductors in adjacent vias...
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7446263 |
Multilayer printed circuit board
The objective of present invention is to provide an electroplating solution capable of forming the upper face of a via-hole and the upper face of a conductor circuit in the same layer in...
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7447038 |
Module
In a memory module, a plurality of memories are mounted on a module base plate, impedance between Vref and Vss near each memory is coupled to Vss by a decoupling capacitor and a Vref plane to...
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7435910 |
Multilayer printed circuit board
A multilayer printed circuit board has an IC chip 20 included in a core substrate 30 in advance and a transition layer 38 provided on a pad 24 of the IC chip 20 . Due to this, it is...
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7428155 |
Printed wiring board including power supply layer and ground layer
A first power supply layer spreads over an insulating layer outside an island of a second power supply layer. A first ground layer spreads over an insulating layer outside an island of a second...
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7420126 |
Circuit board and circuit apparatus using the same
A circuit board and a circuit apparatus using the same are provided, which have an improved heat radiation capability near through holes piercing through its metal substrate so as to address a...
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7408120 |
Printed circuit board having axially parallel via holes
Disclosed is a PCB having axially parallel via holes, in which an outer ground via hole, acting as a ground, is formed around a via hole for intercircuit connection in the PCB, thereby minimizing...
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7405473 |
Techniques for optimizing electrical performance and layout efficiency in connectors with via placement and routing
Techniques are provided for placing and routing vias that conduct signals through a connector between two electrical units. Vias that conduct a first set of signals are placed next to vias that...
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7402760 |
Multi-layer printed wiring board and manufacturing method thereof
A multi-layer printed wiring board has a core substrate, a throughhole structure, a first interlayer insulation layer, a first via, a second interlayer insulation layer and a second via. The core...
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7391622 |
Composite structural member having an integrated electrical circuit
A composite structural member with an integrated electrical circuit is provided. The structural member includes a plurality of layers of structural reinforcement material, and two or more...
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7385792 |
Electronic control apparatus
An electronic control apparatus includes an exclusive power source line for a charge pump circuit which is discriminated from a common power source line. The exclusive power source line is...
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7382629 |
Circuit substrate and method of manufacturing plated through slot thereon
A circuit substrate and a method of manufacturing a slot-shaped plated through slot thereon are provided. The circuit substrate has a linear slot. A slot-shaped plated through hole with a multiple...
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7378601 |
Signal transmission structure and circuit substrate thereof
A signal transmission structure is provided. The structure mainly comprises at least a conductive via, at least a via land and a conductive wall. One end of the conductive via is connected to the...
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7375286 |
Printed circuit board and manufacturing method thereof
A plurality of wiring patterns in a stripe form are formed to be parallel to one another on one surface of a base insulating layer. The wiring patterns each have a layered structure including a...
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7375288 |
Apparatuses and methods for improving ball-grid-array solder joint reliability
In some embodiments, apparatuses and methods for improving ball-grid-array solder joint reliability in printed circuit boards. Such apparatuses may comprise, in an exemplary embodiment, a stiffened...
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7375290 |
Printed circuit board via with radio frequency absorber
A printed circuit board with vias that reduce or eliminate radio frequency interference and method of forming the same. The printed circuit board includes non-conductive layers, conductive-layers...
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7365272 |
Circuit board with identifiable information and method for fabricating the same
A circuit board with identifiable information and a method for fabricating the same are proposed. At least one insulating layer within the circuit board has a non-circuit area free of a circuit...
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7361843 |
AC coupling of power plane sections using improved capacitance stitching material
An information handling system has a printed circuit board with a split power plane having a plurality of sections that may be used for distributing different voltages on a single conductive foil...
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7355863 |
High frequency multilayer integrated circuit
A high frequency multilayer integrated circuit is provided with: a multilayer board including n earth conductor layers (n: integer of two or more than two) and (n-1) dielectric layers each arranged...
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7350292 |
Method for affecting impedance of an electrical apparatus
A method for affecting an impedance of a portion of an electrical circuit loop in an electrical circuit apparatus includes providing an electrical circuit apparatus having at least a portion of an...
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7349225 |
Multifunctional composite sandwich element with embedded electronics
A composite sandwich structure with embedded electronics, that in one embodiment includes two multilayered composite facesheet laminates, a central core, embedded electronic components within the...
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7321496 |
Flexible substrate, multilayer flexible substrate and process for producing the same
A flexible substrate comprises: a film; an insulating resin layer formed on each of a front face of the film and a rear face of the film, which rear face is opposite to the front face; a...
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7307853 |
Wired circuit board assembly
There is provided a wired circuit board assembly that prevents breakage of the flexing portion of a wired circuit board supported by a support frame. In a wired circuit board support sheet, a...
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7304860 |
Printed circuit board with thin film switches for a keyboard
A printed circuit board with thin film switches for a keyboard including an upper board having multiple circuit lines, an insulating separation defining multiple through holes, a lower board having...
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7304857 |
Sensor node and circuit board arrangement
An electronic circuit, preferable as a sensor node, has a highly sensitive radio function and is capable of performing a low-power-consumption operation. The electronic device has a board; a...
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7269029 |
Rapid fire test board
A test board for testing a packaged integrated circuit has a set of contacts matching counterpart contacts on a socket. The contacts are each connected to a first voltage plane containing power, a...
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7245506 |
System for reducing noise induced from reference plane currents
A method of reducing noise induced from reference plane currents is disclosed. The method includes routing a first path for an electrical trace on a circuit board such that the first path...
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7238603 |
Connecting member between wiring films, manufacturing method thereof, and manufacturing method of multilayer wiring substrate
A connecting member between wiring films is provided in which: a normal copper foil, which is a general-purpose component and not expensive, or the like can be used as a material; formation of...
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7230835 |
Apparatus for reducing signal reflection in a circuit board
A circuit board has, in a first signal layer, a signal conductor having a relatively small width and a contact pad having a relatively large width. The relatively large width of the contact pad...
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