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7615708 |
Arrangement of non-signal through vias and wiring board applying the same
An arrangement of non-signal through vias suitable for a wiring board is provided. The wiring board has a contact surface, a core layer and pads. The contact pads are disposed on the contact...
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7599192 |
Layered structure with printed elements
The present invention incorporates electronic components into an electronic core structure that may be readily hot laminated by existing processes. The structure may include multiple desired...
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7583513 |
Apparatus for providing an integrated printed circuit board registration coupon
A device includes a plane metallization layer, and a plane plated through hole attached to the plane metallization layer and terminating at the at a major exterior surface with a plurality of...
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7580268 |
Built-in capacitor type power feed device to power pins of electrical component
A built-in capacitor type power feed device for an electrical component which solves the problems of the reduction in the noise margin of the power supply system accompanying the lower drive...
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7573725 |
Optimizing power delivery and signal routing in printed circuit board design
A system, method and apparatus for providing a printed circuit board having optimized power delivery planes and signal routing regions are disclosed. In one aspect, the present disclosure teaches a...
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7566960 |
Interposing structure
A capacitive interposer (caposer) is disposed inside an integrated circuit package between a die and an inside surface of the package. Conductive layers within the caposer constitute a bypass...
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7564695 |
Circuit connection structure and printed circuit board
While gradually increasing the widths of signal lines ( 104 a, 104 b, 105 a, 105 b ) of first and second groups of differential signal lines ( 104, 105 ) to suppress attenuation in the lines,...
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7564694 |
Apparatus and method for impedance matching in a backplane signal channel
An apparatus comprising a printed circuit board having a front side and a back side, and having therein a plurality of conductive layers, each conductive layer including one or more signal...
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7548432 |
Embedded capacitor structure
An embedded capacitor structure comprising a main body; at least one embedded capacitor, having a first electrode, a dielectric layer, and a second electrode, formed in the main body; and at least...
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7532485 |
Multilayer module and method of manufacturing the same
A multilayer module includes a parts-containing module whose circuit board has been mounted at one surface with an electronic component and the electronic component is covered with a resin layer....
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7532483 |
Mounting integrated circuit dies for high frequency signal isolation
A method of connecting signal lines between an integrated circuit (IC) die and a carrier or external circuit, and corresponding apparatus. Techniques for adjusting magnetic coupling between...
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7530043 |
Printed circuit board able to suppress simultaneous switching noise
A printed circuit board includes a first layer including a first power portion and a first ground portion isolated from each other, and a second layer including a second power portion and a second...
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7529103 |
Multi-layered printed circuit board embedded with filter
A multi-layered printed circuit board embedded with a filter, the multi-layered printed circuit board using a composite multi-layered printed circuit board formed of at least a high dielectric...
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7525817 |
Wiring layout of auxiliary wiring package and printed circuit wiring board
A printed circuit board wiring system including a printed wiring circuit board having a plurality of conductive layers, at least one electronic part mounted on one side of the circuit board and...
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7525814 |
Wiring board and method for manufacturing the same
A wiring board includes a plurality of via pads disposed on a ceramic sub-core accommodated in a core board. A Cu-plated layer is formed on the surface of a conductor pad and serves as a processed...
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7525813 |
Semiconductor device
In a semiconductor device such as a high-frequency power amplifier module, a plurality of amplifying means are formed on a semiconductor chip which is mounted on a main surface of a wiring...
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7518884 |
Tailoring impedances of conductive traces in a circuit board
An apparatus and method that permits signal traces of different widths and the same impedance to be placed on the same layer of a printed circuit board (PCB). Alternatively, signal traces of...
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7515436 |
Communication unit
In a communication unit 100 , a ground layer section 101 which is a sheet-like conductive material and a power-source layer section 102 which is a sheet-like conductive material are laid out...
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7508681 |
Printed circuit board for high speed, high density electrical connector with improved cross-talk minimization attenuation and impedance mismatch characteristics
In the preferred embodiment, there is disclosed a printed circuit board having a surface providing a mating interface to which is electrically connected an electrical connector having signal...
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7501583 |
Low noise multilayer printed circuit board
A low noise multilayer printed circuit board includes at least one ground layer and at least one power layer. The at least one ground layer is divided into a first area and a second area. The first...
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7495930 |
Circuit board structure for high density processing of analog and digital signals
A circuit board which has a high speed digital circuit in close proximity to a sensitive analog structure has a grounded, conductive band interposed between them and a ground plane with two...
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7495929 |
Reference layer openings
A component having reference layer openings to contribute towards achieving a differential impedance in a circuit, is described herein.
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7495322 |
Light-emitting device
A light-emitting device ( 200 ) has a submount ( 100 ) and a plate for heat transfer ( 300 ) having a metallic plate ( 30 ). The submount ( 100 ) has a mount base ( 10 ), at least one...
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7495177 |
Printed wiring board, its manufacturing method, and circuit device
A printed wiring board manufacturing process comprises forming a conductive metal layer on at least one surface of an insulating film with a sputtered metal layer in between, selectively etching...
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7489520 |
Printed circuit board and liquid crystal display device having the same
An LCD capable of preventing and electrostatic discharge is provided. The LCD includes a liquid crystal panel for displaying an image, a PCB on which electronic devices are mounted to generate...
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7470864 |
Multi-conducting through hole structure
A multi-conducting through hole structure is provided. The multi-conducting through hole structure has a substrate, at least two signal lines and at least a reference line. The substrate has a...
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7465882 |
Ceramic substrate grid structure for the creation of virtual coax arrangement
Signal line conductors passing through vertical vias in an insulative substrate for supporting and interconnecting integrated circuit chips are provided with shielding conductors in adjacent vias...
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7450397 |
Wiring board and circuit apparatus
A wiring board in which a line can be made narrower and/or a transmission loss can be reduced is developed. The wiring board includes a first conductor and a second conductor maintained at the same...
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7450392 |
Cable modem device and method of assembling the same
There is discolsed a cable modem device capable of reducing unnecessary signals inputted into a circuit substrate which processes signals and signal terminals from the outside and unnecessary...
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7447038 |
Module
In a memory module, a plurality of memories are mounted on a module base plate, impedance between Vref and Vss near each memory is coupled to Vss by a decoupling capacitor and a Vref plane to...
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7443693 |
Electromagnetic interference shielding for a printed circuit board
The present invention provides shielded printed circuit boards and electronic devices. The printed circuit board may comprise an internal network of grounded conductive elements that are coupleable...
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7440291 |
Method of reducing noise induced from reference plane currents
A method of reducing noise induced from reference plane currents is disclosed. The method includes routing a first path for an electrical trace on a circuit board such that the first path...
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7428155 |
Printed wiring board including power supply layer and ground layer
A first power supply layer spreads over an insulating layer outside an island of a second power supply layer. A first ground layer spreads over an insulating layer outside an island of a second...
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7420126 |
Circuit board and circuit apparatus using the same
A circuit board and a circuit apparatus using the same are provided, which have an improved heat radiation capability near through holes piercing through its metal substrate so as to address a...
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7417872 |
Circuit board with trace configuration for high-speed digital differential signaling
Trace configurations for carrying high-speed digital differential signals provide for reduced conduction loss and improved signal integrity. In one embodiment, a circuit board has a first set of...
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7417197 |
Direct contact power transfer pad and method of making same
A power transfer pad, having: a non-conductive board having a top and a bottom; a plurality of conductive substrate sections disposed across the top of the non-conductive board; at least one...
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7411283 |
Interconnect design for reducing radiated emissions
An interconnect system between an integrated circuit device and a printed circuit board may include a filter between the integrated circuit device and the power subsystem of the printed circuit...
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7408423 |
Semiconductor device and adjusting method for semiconductor device
An object of the invention is to provide a semiconductor device and an adjusting method for a semiconductor device wherein power source noises and noises radiated as radio waves can be reduced and...
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7408120 |
Printed circuit board having axially parallel via holes
Disclosed is a PCB having axially parallel via holes, in which an outer ground via hole, acting as a ground, is formed around a via hole for intercircuit connection in the PCB, thereby minimizing...
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7405919 |
Electronic circuit having transmission line type noise filter
A power supply circuit produces a supply voltage to be supplied to a microprocessor which is an integrated circuit. A transmission line type noise filter includes a signal input terminal, a signal...
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7405477 |
Ball grid array package-to-board interconnect co-design apparatus
A package-board co-design methodology preserves the signal integrity of high-speed signals passing from semiconductor packages to application PCBs. An optimal architecture of interconnects between...
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7405473 |
Techniques for optimizing electrical performance and layout efficiency in connectors with via placement and routing
Techniques are provided for placing and routing vias that conduct signals through a connector between two electrical units. Vias that conduct a first set of signals are placed next to vias that...
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7394027 |
Multi-layer printed circuit board comprising a through connection for high frequency applications
A high frequency multi-layer printed circuit board, according to the present invention, comprises a through connection having an impedance adapting structure surrounding the through connection and...
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7391622 |
Composite structural member having an integrated electrical circuit
A composite structural member with an integrated electrical circuit is provided. The structural member includes a plurality of layers of structural reinforcement material, and two or more...
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7391620 |
System for improving power distribution current measurement on printed circuit boards
A method and system for improving power distribution and/or current measurement on a printed circuit board is disclosed. According to the invention, a first power plane adapted for current...
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7385792 |
Electronic control apparatus
An electronic control apparatus includes an exclusive power source line for a charge pump circuit which is discriminated from a common power source line. The exclusive power source line is...
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7382629 |
Circuit substrate and method of manufacturing plated through slot thereon
A circuit substrate and a method of manufacturing a slot-shaped plated through slot thereon are provided. The circuit substrate has a linear slot. A slot-shaped plated through hole with a multiple...
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7375983 |
Circuit board for reducing crosstalk of signals
A circuit board includes a first group of layers located close to a top side of the circuit board, and a second group of layers located close to an underside of the circuit board. Signals which are...
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7375978 |
Method and apparatus for trace shielding and routing on a substrate
Some embodiments of the invention effectively shield signal traces on a substrate without impacting the signal trace routing on the metal layers of the substrate. Other embodiments of the invention...
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7375290 |
Printed circuit board via with radio frequency absorber
A printed circuit board with vias that reduce or eliminate radio frequency interference and method of forming the same. The printed circuit board includes non-conductive layers, conductive-layers...
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