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9042116 Printed circuit board with daughterboard  
A printed circuit board includes a motherboard and a daughterboard. The motherboard includes at least one first signal pad and defines at least one via under the at least one first signal pad. The...
9030838 Package substrate and semiconductor package having the same  
Provided is a package substrate and a semiconductor package. The package substrate includes a main body having an upper surface and a lower surface opposite to the upper surface, a plurality of...
9025341 Power converter  
A power module includes a power module body portion and a wiring board. The power module body portion includes P-side semiconductor elements and N-side semiconductor elements, and a P-side...
9019709 Protective circuit module  
A protection circuit board is disclosed. The protection circuit board includes a main printed circuit board and an auxiliary printed circuit board. In the auxiliary printed circuit board, a...
9019718 Modular electronic building systems with magnetic interconnections and methods of using the same  
Electrical connectors, electrical modules, and systems are provided. In one aspect, an electrical connector includes a housing defining a side surface, an electrical conductor supported by the...
9000306 Interconnect board and electronic apparatus  
An electronic apparatus (100) has an electronic device (151), a power supply plane (121) and a power supply plane (122) disposed with a gap (123) therebetween, a connection member (152) that...
8995143 Pivotal assembly applied to board  
A pivotal assembly applied to a board includes a first board, a first pivotal member, and a pivotal plate. The first pivotal member is fixed to the first board and has a first retaining structure....
8978245 Method of securing electronic devices within a sub-chassis  
A method includes securing a midplane to a bracket disposed between a first and second ends of a chassis, wherein a first surface of the midplane engages the bracket and faces the first end of the...
8964219 Image forming apparatus including an installation section for a substrate  
An image forming apparatus includes an installation section, a control board, a first connection terminal provided on an outer surface of the control board, a first electrical connection member...
8958214 Motherboard assembly for interconnecting and distributing signals and power  
Mechanisms for interconnecting and distributing signals and power between PCBs are provided. A first PCB having land grid arrays (LGAs) and a first wiring layer designed for interconnect...
8952265 Electromagnetic interference noise reduction package board  
An EMI noise reduction package board, having a top layer and a bottom layer, one of which having a semiconductor device mounted thereon, can include: a first area having a signal layer arranged on...
8946892 Semiconductor package  
A semiconductor package includes a package substrate including a first wiring embedded in the package substrate, a second wiring embedded in the package substrate, the second wiring electrically...
8942005 Low cost, high strength electronics module for airborne object  
An electronics module is provided for utilization onboard an airborne object. In one embodiment, the electronics module includes a housing having a cavity therein, a first printed circuit board...
8934262 Wiring board and method for manufacturing the same  
A wiring board including a first rigid wiring board having an accommodation portion and a conductor, a second rigid wiring board accommodated in the accommodation portion of the first rigid wiring...
8934261 Compact device housing and assembly techniques therefor  
High density electronic device assemblies and techniques for forming high density electronic device assemblies are disclosed. These assemblies and techniques can be used to form compact electronic...
8928114 Through-assembly via modules and methods for forming the same  
A discrete Through-Assembly Via (TAV) module includes a substrate, and vias extending from a surface of the substrate into the substrate. The TAV module is free from conductive features in contact...
8923011 Interconnect board  
A combination of an interconnect board and a module board for connecting a plurality of electronic modules to a processing unit is described. The interconnect board comprises a plurality of...
8923003 Flexible circuit connectors with reduced profiles  
An electronic device may contain components such as flexible printed circuits and rigid printed circuits. Electrical contact pads on a flexible printed circuit may be coupled electrical contact...
8898362 Lane jumper  
A lane jumper for transmitting at least one lane from a first interface to a second interface is disclosed. The at least one lane is connected with the first interface. The first interface defines...
8897030 Expansion apparatus with serial advanced technology attachment dual in-line memory module device  
An expansion apparatus includes a first connector having first power pins and first signal pins, and a second connector having second power pins and second signal pins. A power circuit is...
8885357 Printed circuit board with reduced cross-talk  
A multi-layer printed circuit board has a number of landing pads that are configured to engage a connector secured thereto. Between the landing pads associated with different signals is at least...
8885349 Daughter circuit board for interface signal conversion  
A daughter circuit board of a brushless DC motor for interface signal conversion, having circuit units integrated on the daughter circuit and eight ports for communicating with a control system of...
8867231 Electronic module packages and assemblies for electrical systems  
An electronic module package that includes an electronic module configured to receive input signals and process the input signals to provide output signals. The module package also includes an...
8853547 Flexible printed board  
A flexible printed circuit board, in particular for the spatial connection of electronic components, includes a carrier foil (1), several bonding surfaces (10) arranged on a solder side (4) of the...
8848389 Transmission device and method for manufacturing same, and wireless transmission device and wireless transmission method  
An electronic device provided with a plurality of circuit boards uses a support member for supporting the circuit boards as the transmission path of a wireless signal. For example, the electronic...
8842440 Printed circuit board and method of manufacturing printed circuit board  
A method for manufacturing a printed circuit board includes forming an opening portion in a substrate, positioning chip capacitors in the opening portion of the substrate such that the chip...
8835774 Circuit board assembly and method of assembling circuit boards  
According to an aspect of the invention, there is provided a circuit board assembly including a first circuit board including a first circuit pattern formed on a surface of the first circuit...
8830689 Interposer-embedded printed circuit board  
Disclosed herein is an interposer-embedded printed circuit board, including: a substrate including a cavity formed in one side thereof and having a predetermined height in a thickness direction of...
8824163 RF layered module using three dimensional vertical wiring and disposing method thereof  
Provided is a structure and disposing method of a radio frequency (RF) layered module using three dimensional (3D) vertical wiring. A first wafer in the RF layered module having the 3D vertical...
8824159 Three dimensional structure memory  
A Three-Dimensional Structure (3DS) Memory allows for physical separation of the memory circuits and the control logic circuit onto different layers such that each layer may be separately...
8810833 Image processing device and image forming apparatus  
An image processing device includes a body that has a first connection portion and a second connection portion inside the body; an image processing board that is electrically connected to the...
8804313 Enclosure power distribution architectures  
Computational enclosures may be designed to distribute power from power supplies to load units (e.g., processors, storage devices, or network routers). The architecture may affect the efficiency,...
8804368 Downward-facing optical component module  
A motherboard for an electronic device comprising a main printed circuit board (PCB) with a through-hole extending between the upper component surface and the lower surface. The motherboard...
8773277 Routing facility for a subsea electronics module  
A routing facility (1) for a subsea electronics module (7) has on a single circuit board (2) a facility (5) for routing data packets between segments of a differential serial bus, and at least one...
8754328 Laminate circuit board with a multi-layer circuit structure  
A laminate circuit board with a multi-layer circuit structure which includes a substrate, a first circuit metal layer, a second circuit metal layer, a first nanometer plating layer, a second...
8743562 Modular cam system  
A cam system includes a beam including a plurality of coupling features. A first handle is operable to be coupled to the beam using the coupling features. A plurality of cam elements are each...
8741411 Multi-piece board and method for manufacturing the same  
A method for manufacturing a multi-piece board having a frame section and a multiple piece sections connected to the frame section includes forming a frame section from a manufacturing panel for...
8711575 Printed circuit board unit having routing unit mounted thereon and computer device having the same  
A printed circuit board unit usable with a computer device includes a main board on which a first component and a second component are mounted on an upper surface, and a routing unit mounted on at...
8698004 Multi-piece board and fabrication method thereof  
A fabrication method for a multi-piece board includes: checking whether pieces (printed wiring boards) are defect-free or not; forming a first recess in a joint portion between a defective piece...
8687380 Wiring board and method for manufacturing the same  
A wiring board including a first rigid wiring board including a conductor and having an accommodation portion, the accommodation portion having wall surfaces, a second rigid wiring board...
8654543 Circuit board assembly  
A circuit board assembly includes two external circuit boards, at least one electrical connector, at least one electronic component, and at least one hollow substrate. Each external circuit board...
8654541 Three-dimensional power electronics packages  
Three-dimensional power electronics packages are disclosed. In one embodiment, a three-dimensional power electronics package includes a metalized substrate assembly, a first power electronics...
8637778 Debond interconnect structures  
The present subject matter relates to the field of fabricating microelectronic devices. In at least one embodiment, the present subject matter relates to forming an interconnect that has a portion...
8638565 Arrangement of optoelectronic components  
A method for producing an arrangement of optoelectronic components (10) is specified, comprising the following steps: producing at least two fixing regions (2) on a first connection carrier (1);...
8633395 Multilayer wiring board  
A multilayer wiring board 100 comprises a first wiring region 101 where wirings 103a and insulating layers 104a and 104b are alternately laminated, and a second wiring region 102 where a thickness...
8633400 Multilayer printed wiring board and method for manufacturing multilayer printed wiring board  
A multilayer printed wiring board including a first interlayer resin insulation layer, a first conductive circuit formed on the first interlayer resin insulation layer, a second interlayer resin...
8634202 Power transforming circuit board  
A power transforming circuit board includes a substrate and at least one power output structure. The substrate has at least one power transforming circuit and at least one pair of power input...
8625299 Circuit board with even current distribution  
A circuit board includes an outer conductive layer, a number of inner conductive layers, at least one group of vias defined through the outer conductive layer and the inner conductive layers and...
8619432 Implementing high-speed signaling via dedicated printed circuit-board media  
Some embodiments of the inventive subject matter are directed to a first circuit board configured to include an electronic component. The electronic component includes a plurality of leads. The...
8611096 Stiffening plate for circuit board and switch assembly  
This invention is directed to a support plate for reinforcing a portion of a circuit board. The support plate may be coupled to a portion of the circuit board that is subject to forces (e.g.,...