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7601919 |
Printed circuit boards for high-speed communication
Apparatus and method for communicating high-speed signals between a primary printed circuit board and one or more secondary printed circuit boards. The high-speed signals are communicated between...
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7599192 |
Layered structure with printed elements
The present invention incorporates electronic components into an electronic core structure that may be readily hot laminated by existing processes. The structure may include multiple desired...
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7589409 |
Stacked packages and microelectronic assemblies incorporating the same
A microelectronic assembly includes units superposed on one another to form at least one stack having a vertical direction. Each unit includes one or more microelectronic devices and has top and...
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7586756 |
Split thin film capacitor for multiple voltages
An apparatus, and a method for forming, a split thin film capacitor for providing multiple power and reference supply voltage levels to electrical devices such as integrated circuits, may be useful...
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7583513 |
Apparatus for providing an integrated printed circuit board registration coupon
A device includes a plane metallization layer, and a plane plated through hole attached to the plane metallization layer and terminating at the at a major exterior surface with a plurality of...
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7573725 |
Optimizing power delivery and signal routing in printed circuit board design
A system, method and apparatus for providing a printed circuit board having optimized power delivery planes and signal routing regions are disclosed. In one aspect, the present disclosure teaches a...
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7558073 |
Multifunctional peripheral device
A multifunctional apparatus includes a first circuit board which is installed on a low surface of a main body, receives a current from an external power source and supplies the current to other...
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7557445 |
Multilayer substrate and the manufacturing method thereof
A multilayer substrate, comprising a first substrate, a connector and a second substrate, is disclosed. The first substrate has a circuit pattern. The connector, coupling onto the first substrate,...
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7550832 |
Stackable semiconductor package
A stackable semiconductor package includes a top package, a bottom package, an adhesive layer, a plurality of wires and a molding compound. A part of a surface of a chip of the bottom package is...
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7548432 |
Embedded capacitor structure
An embedded capacitor structure comprising a main body; at least one embedded capacitor, having a first electrode, a dielectric layer, and a second electrode, formed in the main body; and at least...
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7542303 |
Printed circuit board
A printed circuit board (PCB) includes first and second signal layers sandwiching a dielectric layer therebetween, and a differential pair having two differential traces respectively disposed...
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7539025 |
Method of reducing electromagnetic interference and circuit connection device using the same
A device and a method of reducing electromagnetic interference resulting from a harmonic wave produced by a signal transmitted through a harness. The method includes winding a conductive wire at...
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7537962 |
Method of fabricating a shielded stacked integrated circuit package system
A shielded stacked integrated circuit package system is provided including forming a first integrated circuit structure having a first substrate and a first integrated circuit die; mounting a...
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7534966 |
Edge connection structure for printed circuit boards
A printed circuit board (PCB) edge connection structure formed by a first PCB having one or more electronic components and printed circuitry provided thereon and a second PCB, having one or more...
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7532483 |
Mounting integrated circuit dies for high frequency signal isolation
A method of connecting signal lines between an integrated circuit (IC) die and a carrier or external circuit, and corresponding apparatus. Techniques for adjusting magnetic coupling between...
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7530043 |
Printed circuit board able to suppress simultaneous switching noise
A printed circuit board includes a first layer including a first power portion and a first ground portion isolated from each other, and a second layer including a second power portion and a second...
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7525816 |
Wiring board and wiring board connecting apparatus
The present invention provides a wiring board including a first board provided with a first wiring pattern and a second board provided with a second wiring pattern while the first wiring pattern...
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7523545 |
Methods of manufacturing printed circuit boards with stacked micro vias
Methods of manufacturing printed circuit boards having circuit layers laminated with stacked (or staggered) micro via(s). Aspects of embodiments of the present invention are directed to a method of...
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7521788 |
Semiconductor module with conductive element between chip packages
A semiconductor module and a method of manufacturing a semiconductor module including at least one chip package, at least one module board, at least one conductive element provided between the...
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7515430 |
Conductive hook and loop shockmount system
An electrically conductive shock mount system for electrical subassemblies is provided. The shock mount system includes a first assembly having a housing containing a hook member for a hook and...
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7514779 |
Multilayer build-up wiring board
Mesh holes 35 a and 59 a of upper solid layers 35 and upper solid layers 59 are formed to overlie on one another, so that the insulating properties of interlayer resin insulating layers 50...
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7508681 |
Printed circuit board for high speed, high density electrical connector with improved cross-talk minimization attenuation and impedance mismatch characteristics
In the preferred embodiment, there is disclosed a printed circuit board having a surface providing a mating interface to which is electrically connected an electrical connector having signal...
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7501586 |
Apparatus and method for improving printed circuit board signal layer transitions
A method and apparatus for improving printed circuit board signal layer transitions are described. In one embodiment, the method includes the formation of a first via within a printed circuit board...
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7501584 |
Circuit board device and method for board-to-board connection
A structure for connecting substrates to each other, which is capable of thinning an electronic device on which a plurality of circuit boards is mounted, saving a space of the electronic device,...
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7499287 |
Printed wiring board with enhanced structural integrity
A structural printed wiring board panel includes a multilayer printed wiring board having opposing, outer faces and interlayer interconnects that route RF, power and control signals. Connection...
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7495177 |
Printed wiring board, its manufacturing method, and circuit device
A printed wiring board manufacturing process comprises forming a conductive metal layer on at least one surface of an insulating film with a sputtered metal layer in between, selectively etching...
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7492605 |
Power plane to reduce voltage difference between connector power pins
A power plane including a supply power pin receptacle, a first connector power pin receptacle, and a second power pin receptacle, where a first electrical resistance between the supply power pin...
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7476813 |
Multilayer flip-chip substrate interconnect layout
The multilayer substrate includes a plurality of layers. Located within the plurality of layers are a number of vias. Conductive traces connect the vias to form trace/via paths having various...
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7470864 |
Multi-conducting through hole structure
A multi-conducting through hole structure is provided. The multi-conducting through hole structure has a substrate, at least two signal lines and at least a reference line. The substrate has a...
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7466557 |
Storage device and method of efficiently arranging components in an information processing apparatus
An information processing apparatus designed for miniaturization, having a chassis, and including a motherboard; an expansion slot exchange device electronically connected to the motherboard and...
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7465882 |
Ceramic substrate grid structure for the creation of virtual coax arrangement
Signal line conductors passing through vertical vias in an insulative substrate for supporting and interconnecting integrated circuit chips are provided with shielding conductors in adjacent vias...
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7463493 |
Module for transferring PCB, apparatus for attaching PCB and liquid crystal display device including PCB
A module for transferring a PCB including a first transfer body that is translatable along a first moving path to transfer a first PCB and a second transfer body that is translatable along a second...
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7455533 |
Method for producing printed wiring board
An insulating resin layer 50 is formed on a surface of a conductor portion 2 by performing a plating pretreatment to the conductor portion 2 that has been formed on a surface of a wiring...
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7453705 |
Barrier, such as a hermetic barrier layer for O/PLED and other electronic devices on plastic
A protective layer for an electronic device and devices with a protective layer. In one exemplary embodiment, the protective layer includes two different layers which can be etched by the same...
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7450398 |
Printed circuit board
An improved printed circuit board (PCB) includes first and second substrates, which are disposed being distanced or spaced mutually and in which at least one or more semiconductor chips are...
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7450397 |
Wiring board and circuit apparatus
A wiring board in which a line can be made narrower and/or a transmission loss can be reduced is developed. The wiring board includes a first conductor and a second conductor maintained at the same...
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7450396 |
Skew compensation by changing ground parasitic for traces
According to embodiments, small holes or openings may be cut on or through the ground plane(s) adjacent to a selected trace line, so that C and L will be changed accordingly. Then phase velocity...
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7450394 |
PCB contact arrangement
A printer circuit board for mounting electrical components such as LEDs has outward edge protrusion on which an electrically conductive material is deposited such that the board itself can be used...
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7449641 |
High-speed signal transmission structure having parallel disposed and serially connected vias
A high-speed signal transmission structure having parallel disposed and serially connected vias is disclosed. The structure is applicable to a multi-layered circuit board such as a high-speed...
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7447038 |
Module
In a memory module, a plurality of memories are mounted on a module base plate, impedance between Vref and Vss near each memory is coupled to Vss by a decoupling capacitor and a Vref plane to...
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7440291 |
Method of reducing noise induced from reference plane currents
A method of reducing noise induced from reference plane currents is disclosed. The method includes routing a first path for an electrical trace on a circuit board such that the first path...
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7438560 |
Printed wiring board and electronic equipment
A printed wiring board, comprising a signal plane having a baseband block for processing a baseband signal and a high-frequency block for processing a high-frequency signal which is obtained by...
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7428155 |
Printed wiring board including power supply layer and ground layer
A first power supply layer spreads over an insulating layer outside an island of a second power supply layer. A first ground layer spreads over an insulating layer outside an island of a second...
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7427718 |
Ground plane having opening and conductive bridge traversing the opening
Conductive bridges to traverse openings in ground planes, and methods of making the conductive bridges, are disclosed. In one aspect, an apparatus may include a ground plane, one or more openings...
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7423222 |
Circuit board and method of manufacturing the same
A circuit board is manufactured by filling a via-hole formed in an insulating substrate with conductive material, disposing conductive layers on both sides of the insulating substrate, and forming...
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7420131 |
Wiring substrate
A wiring substrate, in which a wiring stacked portion including a conductor layer and a resin layer is stacked on a principal face of a core substrate including a substantially cylindrical through...
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7420130 |
Wiring board and method for fabricating the same
The wiring board comprises a plate-shaped conductive core material 10 with a through-hole 12 formed in, an insulation layer 14 formed on the surface of the conductive core material 10 and...
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7420126 |
Circuit board and circuit apparatus using the same
A circuit board and a circuit apparatus using the same are provided, which have an improved heat radiation capability near through holes piercing through its metal substrate so as to address a...
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7417872 |
Circuit board with trace configuration for high-speed digital differential signaling
Trace configurations for carrying high-speed digital differential signals provide for reduced conduction loss and improved signal integrity. In one embodiment, a circuit board has a first set of...
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7417871 |
Memory module
The memory module includes a substantially rigid first circuit board having at least one memory chip disposed thereon. The memory module also includes a substantially rigid second circuit board...
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