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7619900 |
Dual-board case for multi-mainboard system
A dual-board case for multi-mainboard system includes a rectangular-sectioned tubular housing, in which two track sets are provided; and two mainboard trays being movably mounted on the two track...
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7606959 |
Multiprocessor system using stacked processor modules and board to board connectors
A multiprocessor system is provided, comprising a baseboard, for arranging peripheral equipments; and a plurality of processor modules, each equipped with a processor and a board-to-board...
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7606044 |
Multi-purpose structural support I/O member for a server
The teachings of the present disclosure provide a housing for a modular component of an information handling system. The housing may include a wall member generally defining a first plane, one or...
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7602630 |
Configurable inputs and outputs for memory stacking system and method
Embodiments of the present invention relate to configurable inputs and/or outputs for memory and memory stacking applications. More specifically, embodiments of the present invention include memory...
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7602618 |
Methods and apparatuses for transferring heat from stacked microfeature devices
Apparatuses for transferring heat from stacked microfeature devices are disclosed herein. In one embodiment, a microfeature device assembly comprises a support member having terminals and a first...
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7589409 |
Stacked packages and microelectronic assemblies incorporating the same
A microelectronic assembly includes units superposed on one another to form at least one stack having a vertical direction. Each unit includes one or more microelectronic devices and has top and...
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7586747 |
Scalable subsystem architecture having integrated cooling channels
A method for building scalable electronic subsystems is described. Stackable modules employ copper substrates with solder connections between modules, and a ball grid array interface is provided at...
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7583518 |
Information processing device
An information processing device is disclosed that is able to prevent displacement of an extension board caused by vibration or shock, and able to prevent deformation of the extension board and...
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7573723 |
Method for attaching chips in a flip-chip arrangement
Polyimide is used as a spacer that also bonds together the elements that it is spacing apart. This is achieved by constructing the spacer on at least one of the wafers as is conventionally done,...
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7566960 |
Interposing structure
A capacitive interposer (caposer) is disposed inside an integrated circuit package between a die and an inside surface of the package. Conductive layers within the caposer constitute a bypass...
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7542299 |
Keyboard, video and mouse (KVM) switch
A computer peripherals switch having a switching circuit contained within a body; a first computer cable electrically coupled to the switching circuit and integrally attached to the body; a second...
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7539021 |
Retention device
A retention device is applied in an electronic device that has a case and a circuit board. The circuit board may shifts along a integrate direction or a release direction. The retention device...
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7534966 |
Edge connection structure for printed circuit boards
A printed circuit board (PCB) edge connection structure formed by a first PCB having one or more electronic components and printed circuitry provided thereon and a second PCB, having one or more...
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7532480 |
Power delivery for electronic assemblies
Embodiments of methods, apparatuses, devices, and/or systems for power delivery for electronic assemblies are disclosed.
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7531897 |
Process for sealing and connecting parts of electromechanical, fluid and optical microsystems and device obtained thereby
A process for connecting two bodies forming parts of an electromechanical, fluid and optical microsystem, wherein a welding region is formed on a first body; an electrically conductive region and a...
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7531754 |
Flexible substrate having interlaminar junctions, and process for producing the same
A flexible substrate comprises a film, a first insulating resin layer on a front face of the film, a second insulating resin layer on a rear face of the film, a front-sided wiring pattern embedded...
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7530043 |
Printed circuit board able to suppress simultaneous switching noise
A printed circuit board includes a first layer including a first power portion and a first ground portion isolated from each other, and a second layer including a second power portion and a second...
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7529093 |
Circuit device
A first insulating layer is formed on the front surface of a circuit board, and a second insulating layer on the back surface. A conductive pattern is formed on the surface of the first insulating...
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7525816 |
Wiring board and wiring board connecting apparatus
The present invention provides a wiring board including a first board provided with a first wiring pattern and a second board provided with a second wiring pattern while the first wiring pattern...
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7525809 |
Isolated control and network wireway for motor control center
A packaged electrical system includes an enclosure and a main interior volume for component supports. The component supports may support electrical, electronic, power electronic and similar...
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7521788 |
Semiconductor module with conductive element between chip packages
A semiconductor module and a method of manufacturing a semiconductor module including at least one chip package, at least one module board, at least one conductive element provided between the...
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7515430 |
Conductive hook and loop shockmount system
An electrically conductive shock mount system for electrical subassemblies is provided. The shock mount system includes a first assembly having a housing containing a hook member for a hook and...
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7511968 |
Buffered thin module system and method
Multiple fully buffered DIMM circuits or instantiations are presented in a single module. In a preferred embodiment, memory integrated circuits (preferably CSPs) and accompanying AMBs are arranged...
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7511967 |
Avionics enclosure
An enclosure for compact computer boards is described that allows a user to easily configure, or reconfigure, a microserver stack using an interchangeable common bus as a data and power backbone....
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7511963 |
Housing, in particular housing for electronic components or the like
This metal housing ( 2 ) is particularly intended to contain electronic or similar components. It includes a side wall ( 8 ) furnished with a ledge ( 20 ) having a bore ( 16 ) to receive a fixing...
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7508681 |
Printed circuit board for high speed, high density electrical connector with improved cross-talk minimization attenuation and impedance mismatch characteristics
In the preferred embodiment, there is disclosed a printed circuit board having a surface providing a mating interface to which is electrically connected an electrical connector having signal...
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7508679 |
Electrical tool
An electrical tool with an adjustable housing geometry has a motor part, a handle part situated so that it is displaceable relative to the motor part via a connection, and a power supply block that...
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7508677 |
Detachable module connector
Presented is a detachable module connector comprising a main body with a first section, a second section, and a first opening extending through the first section and the second section, wherein the...
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7504843 |
Probe unit substrate
A ceramic substrate has, on its surface, a multilayer wiring division, on which micro cantilever type probes are fixed. The multilayer wiring division has the first conductor layer, which includes...
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7502230 |
Keyboard, video and mouse (KVM) switch
A keyboard, video and mouse (KVM) switch comprises an enclosure; a switching circuit contained within the enclosure; a set of connector ports disposed on the enclosure and electrically coupled to...
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7499286 |
Mounting adapter for electronic modules
A mounting adapter for inserting one or more electronic modules in a system is disclosed. The mounting adapter includes a sleeve having first and second portions that are each configured to receive...
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7499285 |
Control device used for a computer motherboard on which a plurality of interface cards is inserted
A control device used for a computer motherboard on which a plurality of interface cards is inserted, is composed of an L-shape notch which is opened at a corner or a long strip of notch which is...
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7495931 |
Patch panel chassis
A patch panel system including a chassis and a plurality of modules. The chassis includes elongated structures configured to interconnect top, bottom and side portions of the chassis. The elongated...
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7495930 |
Circuit board structure for high density processing of analog and digital signals
A circuit board which has a high speed digital circuit in close proximity to a sensitive analog structure has a grounded, conductive band interposed between them and a ground plane with two...
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7486524 |
Module housing for improved electromagnetic radiation containment
A module housing for minimizing electromagnetic radiation leakage and a transceiver module built with this housing are presented. The housing includes a cover and a base disengagably coupled to...
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7483276 |
Semiconductor package and method for manufacturing same
Disclosed is a semiconductor package adapted to be light, slim, compact, and suitable for high-density mounting and a method for manufacturing the same. The semiconductor package includes a...
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7480152 |
Thin module system and method
A flexible circuit is populated with integrated circuits. Integrated circuits populated on the side of the flexible circuit closest to the substrate are disposed, at least partially, in what are,...
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7465882 |
Ceramic substrate grid structure for the creation of virtual coax arrangement
Signal line conductors passing through vertical vias in an insulative substrate for supporting and interconnecting integrated circuit chips are provided with shielding conductors in adjacent vias...
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7459773 |
Stackable ball grid array
A memory package having a plurality of vertically stacked ball grid arrays. Each of the vertically stacked ball grid arrays has a memory chip coupled thereto. Further, each of the plurality of ball...
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7457133 |
Electronic apparatus with natural convection structure
An electronic apparatus with natural convection structure is disclosed. The electronic apparatus with natural convection structure includes a main body to be placed on a surface, a hole piercing...
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7453706 |
Module with interchangeable card
A patch panel system including a chassis and a plurality of modules. The chassis includes elongated structures configured to interconnect top, bottom and side portions of the chassis. The elongated...
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7443687 |
Heat sink mounting device and mounting method, and server blade using the same
A heat sink mounting device according to the present invention can secure a mounting space of the heat sink sufficiently, mount a heat sink with large capacity, and use a main board in common even...
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7436676 |
Portable electronic apparatus and BGA package protective device
A portable electronic device in which microswitches ( 12 ) controlled by operation buttons ( 11 ) are mounted on one side of a printed circuit board ( 13 ), and circuit elements accommodated in BGA...
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7435619 |
Method of fabricating a 3-D package stacking system
The present invention provides a system for 3D package stacking system, comprising providing a substrate, attaching a ball grid array package, in an inverted position, to the substrate, forming a...
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7420817 |
MEMS device seal using liquid crystal polymer
An apparatus and method for a near hermetic chip carrier package having a base die and a lid die each formed of a substantially impermeable material and conjoined by a semi-permeable sheet or tape...
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7420814 |
Package stack and manufacturing method thereof
A package stack may include a first package and a second package. The first package may have an IC chip with an active surface and a back surface. The active surface may be connected to a first...
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7405919 |
Electronic circuit having transmission line type noise filter
A power supply circuit produces a supply voltage to be supplied to a microprocessor which is an integrated circuit. A transmission line type noise filter includes a signal input terminal, a signal...
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7402760 |
Multi-layer printed wiring board and manufacturing method thereof
A multi-layer printed wiring board has a core substrate, a throughhole structure, a first interlayer insulation layer, a first via, a second interlayer insulation layer and a second via. The core...
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7394148 |
Module having stacked chip scale semiconductor packages
Stacked CSP (chip scale package) modules include a molded first (“top”) chip scale package having a molding side and a substrate side, and a second (“bottom”) package affixed to the...
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7385792 |
Electronic control apparatus
An electronic control apparatus includes an exclusive power source line for a charge pump circuit which is discriminated from a common power source line. The exclusive power source line is...
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