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6621716 |
LED package
An LED package having a generally tubular electrically conductive body, a circuit board which is mounted across the body at or adjacent one end thereof and which has an outer face on which an LED...
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6614664 |
Memory module having series-connected printed circuit boards
A memory module having series-connected printed circuit boards is provided. The memory module comprises a plurality of printed circuit boards, each comprising a plurality of memory chips mounted...
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6611433 |
Motherboard module
A motherboard module includes a motherboard, a backboard, and a modular mechanism. The modular mechanism for fast assembly and disassembly of a motherboard includes an upright, an upstanding...
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6609914 |
High speed and density circular connector for board-to-board interconnection systems
A system and method for interconnecting circuit boards is disclosed. In one embodiment, a first circuit board connects with a second circuit board via a connector. The first circuit board has an...
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6608755 |
Adapter which is adapted to receive cards designed for a different form factor
The coupling apparatus couples two cards of a first size to fit in to a chassis having slots of second size. The coupling apparatus can connect two 3U cards together by clamping the first card and...
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6594152 |
Board-to-board electrical coupling with conductive band
A first printed circuit board has a contact area, and a second printed circuit board has a contact area. An electrically conductive band is to couple the contact area of the first printed circuit...
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6583503 |
Semiconductor package with stacked substrates and multiple semiconductor dice
A semiconductor package comprising multiple stacked substrates having flip chips attached to the substrates with chip-on-board assembly techniques to achieve dense packaging. The substrates are...
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6582371 |
Ultrasound probe wiring method and apparatus
Wiring an IC, using flexible circuits, by relating a circuit board to an IC and using traces on the circuit board as a second set of input to the IC. More specifically, a set of first lands on the...
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6580620 |
Matrix type printed circuit board for semiconductor packages
Disclosed is a matrix type printed circuit board (PCB) for semiconductor packages having a structure including a plurality of PCB units arranged in a matrix array having at least two rows in such a...
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6574116 |
Inverter capacitor module and inverter
An inverter capacitor module includes a plurality of substrates having a plurality of ceramic capacitors provided on the top surfaces thereof, and first and second feeding unit lands having...
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6570775 |
Circuit board assembly having a compact structure
A circuit board device includes a secondary circuit board supported on a primary circuit board and parallel to the primary circuit board for forming a compact structure. The secondary circuit board...
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6542376 |
High density packaging of electronic components
Disclosed is an electronics packaging system, which provides for a high density assembly of groups of similar solid state part packages. The system provides a novel method for interconnecting the...
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6542378 |
Frequency converter
The frequency converter for an electrical motor essentially consists of power part integrated in a common semiconductor component, of a component accommodating at least the intermediate circuit...
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6542373 |
Memory module device formation and mounting methods thereof
In a memory module arranged with the connection terminals located on both sides of the circuit board, the connection terminals for transmitting a common signal to all memory modules conducts with...
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6535398 |
Multichip module substrates with buried discrete capacitors and components and methods for making
Modularly constructed multichip modules with are disclosed. A plurality of miniature capacitor substrates and/or miniature resistor substrates are assembled and attached to a base substrate,...
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6532157 |
Angulated semiconductor packages
A novel semiconductor package comprises a rigid dielectric, e.g., ceramic, substrate having first and second portions joined to one another at respective margins thereof to form an angle, e.g., a...
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6519157 |
System and method for mounting a stack-up structure
Disclosed are systems and methods which utilize mounting members adapted to provide consistent compressive pressure with respect to strata of a laminated structure, such as the heat source, TEC,...
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6507495 |
Three-dimensional technique for improving the EMC characteristics of a printed circuit board
An apparatus for use with data processing systems. In one embodiment, the apparatus includes but is not limited to at least one conductive member having a first end electrically coupled to a first...
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6504241 |
Stackable semiconductor device and method for manufacturing the same
There is provided a semiconductor device having a semiconductor chip in which a first protrusion electrode is formed on the semiconductor substrate; and an intermediate substrate which comprises a...
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6496384 |
Circuit board assembly and method of fabricating same
A circuit board assembly and method of fabricating an assembly are provided. The assembly preferably comprises a first circuit board defining an aperture and a second circuit board having an edge....
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6490163 |
Computer readable portable data storage device
A portable data storage device includes a main circuit board, a stack of memory circuit boards mounted on the main circuit board, and a USB port pivoted to one end of the main circuit board and...
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6490169 |
Conductive circuit structure having an electrically conductive surface fixed by collar walls
An electrically conductive circuit conductor 2 is disposed on an insulating resin substrate 1, an electrically conductive surface 3 of the circuit conductor is exposed from the resin...
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6490168 |
Interconnection of circuit substrates on different planes in electronic module
An electronic module ( 20 ) includes a first circuit substrate ( 40 ) and a second circuit substrate ( 44 ). The first circuit substrate ( 40 ) has a post surface ( 50 ) and a post ( 52 )...
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6487087 |
Optical interface arrangement
An optical interface arrangement includes a tile carrying an optical component which is mounted substantially at right angles to a closely adjacent circuit board which carries an electrical...
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6487082 |
Printed circuit board component packaging
A printed circuit board apparatus, configurations and methods are presented which provide for close spacing between the HUB and multiple processors as well as a common configuration for two or four...
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6477058 |
Integrated circuit device package including multiple stacked components
An integrated circuit device package in accordance with the invention comprises a first land grid array (LGA) interposer socket positioned between, and in communication with, an LGA integrated...
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6472613 |
Low-inductance connector for printed-circuit board
A low-inductance connection between a first component and a second component on a first surface of a first printed-circuit board includes a second conducting path in electrical communication with a...
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6466447 |
Electronic control unit having flexible wires connecting connector to circuit board
In an electronic control unit for controlling operation of various devices, a circuit board carrying electronic components thereon and a connector for connecting the control unit to outside devices...
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6456505 |
Electronic device and attachment structure thereof
An electronic device having a plurality of leader patterns, and penetration portions penetrating the leader patterns, provided in an extension portion of a printed board projecting from a housing....
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6454572 |
Surface mount connector
An apparatus and method for making a solderless electrical connection between a plurality of electrical contact pads on a disc drive printed circuit board (disc drive PCB) and a plurality of...
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6452804 |
Method and apparatus for thermal and mechanical management of a power regulator module and microprocessor in contact with a thermally conducting plate
A stack up assembly for supplying power and removing heat from a microprocessor while controlling electromagnetic emissions is disclosed. The stack up assembly comprises a VRM circuit board or...
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6433415 |
Assembly of plurality of semiconductor devices
An assembly of semiconductor devices, wherein the device comprises a chip with electrodes on one side for electrical connection with an external circuit, and a flexible base comprising an...
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6434014 |
Printed circuit board connection including a conductor foil
A printed circuit board connection for connecting printed circuit boards provided with conductor tracks and arranged at a right angle with respect to each other consists of a first plug connector...
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6424029 |
Chip card
A chip card is described, preferably a contactless chip card, comprising a data-processing circuit for receiving, processing and/or transmitting data signals, and at least a capacitive switching...
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6422876 |
High throughput interconnection system using orthogonal connectors
The present invention is a method and apparatus for interconnection system. A first front connector is located at a side of a first front card to provide first contacts for first signal traces on...
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6424535 |
Hybrid circuit with contact surfaces (solder pads)
A plate-shaped ceramic circuit substrate ( 6 ), which is adapted to be vertically mounted on a mother board, has near a lower edge ( 7 ) thereof a series of contact areas (solder pads) ( 1 ) for...
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6421248 |
Chip card module
A chip card module contains, in addition to conductor tracks and a chip carrier, one or more semiconductor chips and, if necessary, a stiffening frame. The semiconductor chip(s) and/or stiffening...
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6421244 |
Power module
In a power module, an interconnection terminal ( 10 ) is inserted into a through hole ( 30 ) and a connector ( 16 ) of a control circuit substrate ( 12 ) from the side of a lower main surface of...
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6421250 |
Multi in-line memory module and matching electronic component socket
A multi in-line module and an electronic component socket for the multi in-line module are provided. One embodiment of a multi in-line memory module includes a printed circuit board having at least...
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6418033 |
Microelectronic packages in which second microelectronic substrates are oriented relative to first microelectronic substrates at acute angles
Microelectronic packages include a first microelectronic substrate, a second microelectronic substrate that is oriented at an acute angle relative to the first microelectronic substrate, and first...
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6418034 |
Stacked printed circuit board memory module and method of augmenting memory therein
A stacked printed circuit board memory module in which a plurality of daughter circuit boards can be stacked onto a primary circuit board. The primary board and each of the plurality of daughter...
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6411524 |
Dual planar printed wiring board for compact fluorescent lamp
A printed wiring board assembly for a compact fluorescent lamp unit that has a lamp portion and a base portion includes a first generally planar wiring board containing a first group of electronic...
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6407930 |
Structure of printed circuit board with stacked daughter board
A structure of a printed circuit board with stacked daughter board. The structure has a motherboard and at least a daughter board. The motherboard has a first signal layer, a second signal layer, a...
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6399898 |
Technique for coupling signals between circuit boards
A technique for coupling a signal between a first circuit board and a second circuit board. In one embodiment, the first circuit board has a first signal conductor formed therein, and the second...
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6385049 |
Multi-board BGA package
A multi-board BGA package comprises a chip, a plurality of circuit boards, a plurality of metal bonding wires, a plurality of solder balls, and a package body. The circuit boards are formed on a...
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6384476 |
Semiconductor integrated circuit and printed wiring substrate provided with the same
When a semiconductor integrated circuit having a plurality of electrode pads disposed in an array-like form on the bottom surface thereof is mounted on a printed wiring substrate, a plurality of...
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6377471 |
Disk drive interface with variably spaceable connectors
An apparatus and methods are provided for interfacing a disk drive to a computer system without requiring conventional power and signal cables between the apparatus and the disk drive. An interface...
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6374486 |
Smart card and process for manufacturing the same
A method for manufacturing a smart card in which a through-passage is produced in a central sheet. At least one face of the central sheet is provided with at least one metal coil having connection...
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6376776 |
Circuit board holder
When a sub board is detached from a main board, a movable part is slid toward the main board. At this time, a wedge part of the movable part intrudes between a main part and an engagement part to...
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6373716 |
Printed circuit board for surface connection and electronic apparatus employing the same
An electronic apparatus comprises a first and a second printed circuit board. An elastic conductive member is interposed between the first and second printed circuit boards. The elastic conductive...
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