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7187558 |
Leadframe-based module DC bus design to reduce module inductance
A DC bus for use in a power module has a positive DC conductor bus plate parallel with a negative DC conductor bus plate. One or more positive leads are connected to the positive bus and are...
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7158387 |
Film carrier tape for mounting electronic part
A film carrier tape for mounting electronic part comprises an insulating film, a wiring pattern formed on a surface of the insulating film, and a solder resist layer formed by moving a squeegee...
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7154760 |
Power amplifier module
The present invention realizes strengthening of a ground of a lower-surface ground electrode of an upper semiconductor chip and miniaturization in a semiconductor module on which two semiconductor...
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7132736 |
Devices having compliant wafer-level packages with pillars and methods of fabrication
Devices and methods of fabrication thereof are disclosed. A representative device includes a complaint wafer-level package having one or more lead packages. A representative lead package includes a...
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7132746 |
Electronic assembly with solder-bonded heat sink
A process and electronic assembly for conducting heat from a semiconductor circuit device mounted to a substrate. The substrate is supported by a housing member equipped with a heat-conductive...
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7096555 |
Closed loop backdrilling system
A multilayer circuit board is provided with at least one signal layer, at least one feedback layer, and at least one dielectric layer positioned between the signal layer and the feedback layer. The...
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7092257 |
Bendable low voltage contact rail for track lighting systems
A lighting track apparatus includes elongated colored tubes which are easily bent into stable curved shapes to custom shape and fit sections of the apparatus into a track lighting system. Plural...
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7065869 |
Method for plating of printed circuit board strip
Disclosed is a design method for plating of a printed circuit board (PCB) strip, in which a main plating line is optionally formed on a component side, a solder side, or an inner layer of the PCB...
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7064964 |
USB power amplified trumpet connecting device
A USB power amplified trumpet connecting device comprises a digital conversion chip and a power amplifier chip on a circuit board; an input connected to a USB port as an input; and an output. The...
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7044745 |
Electronic device
An electronic device has several superposed main printed circuit boards ( 2, 3, 4 ), of which one has e.g. the electronic components of a radio, another has the electronic components of a...
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7035112 |
Automatic switch
An automatic switch includes a main body having connector ports provided thereon, more than one or two sets of cable-connected connectors directly extended from the main body, and a circuit board...
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7035116 |
Memory system and memory subsystem
A memory system has a circuit board provided with a first slot connector into which a first memory module is inserted. A second slot connector is provided into which a second memory module is...
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6979895 |
Semiconductor assembly of stacked substrates and multiple semiconductor dice
A semiconductor package comprising multiple stacked substrates having flip-chips attached to the substrates with chip-on-board assembly techniques to achieve dense packaging. The substrates are...
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6979784 |
Component power interface board
A component may comprise one or more integrated circuits and a component package to which the one or more integrated circuits are coupled. The component package has a bottom comprising a plurality...
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6967834 |
Electronic apparatus
There is provided an electronic apparatus which allows an operating panel surface thereof to be precisely finished and coated in a bright color and hence be attractive in appearance. A main case...
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6922342 |
Computer system employing redundant power distribution
A computer system employing redundant power distribution. A computer system includes power distribution boards arranged to distribute power such that the computer system may continue to operate if...
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6861764 |
Wiring substrate having position information
A wiring board for a semiconductor package comprises a base substrate having first and second surfaces; a wiring layer consisting of necessary wiring patterns formed on at least one of the first...
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6839230 |
Heat dissipating device of an extractable disk drive
A heat-dissipating device of an extractable disk drive capable of being mounted to a mainframe of a personal computer or a servo is disclosed. The extractable disk drive box has a preferred heat...
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6828669 |
Interconnection substrate having metal columns covered by a resin film, and manufacturing method thereof
An interconnection substrate comprises an uppermost interconnection layer having a plurality of terminal pads located at positions corresponding to a plurality of solder bumps (external connection...
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6813163 |
Converter device
A plurality of converter circuits is connected in parallel while reducing conduction loss. A converter circuit is formed on each of a plurality of circuit boards, and a plurality of types of...
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6809937 |
Method and apparatus for shock and vibration isolation of a circuit component
An apparatus for improved shock and vibration isolation of a CGA integrated package which utilizes solder column grid arrays to provide electrical connection to a printed circuit board. The CGA...
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6807063 |
High-frequency integrated circuit module
A high-frequency integrated circuit (IC) module comprising a multilayer mounting board on which an integrated circuit with a plurality of high-frequency signal terminals is mounted, and IC...
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6804123 |
Computer mainframe with superposed architecture
A computer mainframe includes a housing, a motherboard, an intermediate circuit board, and a supporting bracket. A CD-ROM and a hard disk are attached to upper and lower sides, respectively, of the...
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6794580 |
Solder interconnections for flat circuits
A system and method are provided for facilitating the interconnection of the conductors of a flat circuit. A flat circuit substrate is provided with a plurality of conductors thereon. A dielectric...
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6788526 |
Housing structure of network device
The present invention is to provide a network device having a parallelepiped housing comprising a plurality of slots on two opposite sides and two opposite edges at each of an underside and a top...
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6784526 |
Integrated circuit device module
According to the present invention, for a module in which a plurality of integrated circuit devices are mounted in parallel, the inductance generated by the unit length of a branched signal line on...
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6773267 |
Electronic assembly having a removable power supply
An electronic device includes a first chassis, a second chassis, and at least one flexible circuit extending therebetween. The first chassis is oriented along a first axis and comprises at least...
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6765152 |
Multichip module having chips on two sides
A multichip module including a frame having contacts suitable for making an electrical connection with an article, preferably a printed wiring board or similar, which is the next level of...
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6760969 |
Method for connecting electrical components
A method for connecting electrical components is provided. The method includes electrically connecting electrodes on two separate substrates with an anisotropic electroconductive adhesive layer....
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6757176 |
Circuit board
This invention relates to circuit boards and methods of fabricating circuit boards. A circuit board includes a core layer and a surface layer. The core layer includes a number of fibers and the...
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6741474 |
Electrical device with a revolvable display panel
An electrical device with a revolvable display panel. The electrical device comprises a housing, a guidance means, a sliding means, and a revolving means. The housing has a plurality of housing...
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6738263 |
Stackable ball grid array package
A stackable FBGA package is configured such that conductive elements are placed along the outside perimeter of an integrated circuit (IC) device mounted to the FBGA. The conductive elements also...
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6727591 |
Multi-piece substrate and method of manufacturing the substrate
It is intended to provide multi-piece circuit boards capable of preventing lowering of strength of joint sections between piece sections after cutoff and other sections, and determining material of...
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6724639 |
Power supply structure
A power supply structure includes a first circuit board, a second circuit board, a first connecting part and a second connecting part. The second circuit board is horizontally disposed above the...
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6721195 |
Reversed memory module socket and motherboard incorporating same
A memory module socket having a transposed pinout allowing the socket to be mounted on the second, or reverse, surface of a motherboard and connected to circuit traces configured for mounting of a...
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6714418 |
Method for producing an electronic component having a plurality of chips that are stacked one above the other and contact-connected to one another
An electronic component has a plurality of chips which are stacked one above the other and contact-connected to one another. To form this component, a first planar chip arrangement is provided with...
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6707670 |
Systems and methods for mounting devices
A retainer includes a device having at least one dovetail-shaped portion, a frame configured to receive the dovetail-shaped portion, and at least one expanding device. The expanding device is...
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6700783 |
Three-dimensional stacked heat spreader assembly for electronic package and method for assembling
A three-dimensional stacked heat spreader assembly is provided which includes an upper heat spreader of generally rectangular shape having a first edge portion extending downwardly; a lower heat...
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6700795 |
Scalable, modular architecture for automotive power distribution and body control functions
The architecture of an automotive wiring, power distribution and accessory control system is described. The system comprises semi-custom two-tier nodes which are distributed in locations around the...
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6683791 |
Circuit board assembly with solder cover
A circuit board assembly that includes a circuit board. The circuit board includes a plurality of electrical contacts. The circuit board assembly also includes a solder cover that covers the...
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6667891 |
Computer chassis for dual offset opposing main boards
This invention involves the efficient placement of a pair of main boards within a given computer chassis. The available density of CPUs and main boards that may be provided for a given chassis...
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6667874 |
Structure for eliminating electromagnetic interference caused by central processing unit
A structure for eliminating electromagnetic interference caused by CPU includes a fixing seat, onto which two conductive members having a plurality of elastic contacts are mounted. Each of the...
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6665191 |
Multi-folded printed wiring construction for an implantable medical device
A printed circuit assembly for use in an implantable medical device comprises a plurality of panels having active and passive circuit components on one major surface thereof, the plurality of...
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6665182 |
Module unit for memory modules and method for its production
The invention relates to a module unit for memory modules and to a method for producing the module unit. A module unit of this type has at least one main module and submodules. The modules are...
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6661674 |
System comprising at least two printed circuit boards
In a system having two printed circuit boards, each printed circuit board is provided with at least one electrical contact element for electrically interconnecting the printed circuit boards. One...
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6653575 |
Electronic package with stacked connections and method for making same
An electronic package which includes first and second circuitized substrates secured together by a solder member which includes a first contact portion for attachment to a printed circuit board and...
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6628527 |
Mounting structure for electronic parts and manufacturing method thereof
A unit interconnection substrate for mounting leadless type electronic parts on a mount substrate by superposing them on each other in two or more stages, comprising an insulating surface on the...
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6625038 |
Functional asymmetrical circuit substrate assembly including a mirror-symmetrical component layout
The invention relates to a circuit substrate assembly comprising a left-hand ( 1 ) and a right-hand ( 1 ′) circuit substrate mirror-symmetrical thereto, each including electrical and/or...
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6623304 |
Connector for flash memory card, connection structure using connector and electronic apparatus using connection structure
In a connector main body, a first card installing space used to install an SD card is formed, and also, a second card installing space used to install a SIM card is formed between this first card...
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6625031 |
Module part and electronic device
A part having a large height contained in a module part is placed in a first cut-off portion formed in a part-mounting substrate to be mounted. Moreover, the module part itself is placed in a...
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