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7619296 |
Circuit board and semiconductor device
A semiconductor device, includes: a semiconductor substrate; a multilayered interconnect structure formed on the semiconductor substrate; a terminal for flip-chip packaging arranged on the surface...
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7613009 |
Electrical transition for an RF component
An RF electronic component for mounting on a substrate includes a housing; and at least one electronic device having an input and/or output incorporated in the housing. At least one input/output...
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7606050 |
Compact module system and method
A flexible circuit is populated on one or both sides and disposed about a substrate to create a circuit module. Along one of its edges, the flex circuit is connected to a connective facility such...
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7606049 |
Module thermal management system and method
A circuit module shunts thermal energy into a chassis component or a part of the box of the computing application in which the module is employed. In one preferred mode, a flex circuit is populated...
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7606042 |
High capacity thin module system and method
Multiple DIMM circuits or instantiations are presented in a single module. In some embodiments, memory integrated circuits (preferably CSPs) and accompanying AMBs, or accompanying memory registers,...
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7602613 |
Thin module system and method
A flexible circuit has contacts for mounting in a socket or card edge connector. The flexible circuit includes integrated circuit devices mounted on both sides of the edge connector contacts....
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7599193 |
Tape circuit substrate with reduced size of base film
A tape circuit substrate includes a base film with first wiring and second wiring disposed on the base film. The first wiring extends into a chip mount portion through a first side and bends within...
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7591067 |
Thermally enhanced coreless thin substrate with embedded chip and method for manufacturing the same
A thermally enhanced coreless thin substrate with embedded chips, which mainly includes a patterned carrier metal layer, at least one chip, at least one dielectric layer and at least one wiring...
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7583511 |
Semiconductor die package with internal bypass capacitors
Embodiments of the present invention provide a computer system that reduces voltage noise for a processor chip. The computer system includes a package which is configured to be sandwiched between...
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7583055 |
Information handling system capable of operating with a power adapter having a power rating lower than the information handling system's power rating
In response to detecting that a power adapter, having a first power rating lower than a second power rating of an information handling system (“IHS”), is coupled to the IHS and in response to a...
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7566968 |
Biosensor with smart card configuration
A biosensor that has a smart card configuration includes a semiconductor chip including a bioactive structure and contact areas disposed on a first side of the semiconductor chip, and a rewiring...
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7539027 |
Force distributing spring element
A force distributor is configured for disposition between a printed circuit board and a stiffening plate, which is spaced from the printed circuit board. The force distributor is configured to...
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7522425 |
High capacity thin module system and method
Multiple DIMM circuits or instantiations are presented in a single module. In some embodiments, memory integrated circuits (preferably CSPs) and accompanying AMBs, or accompanying memory registers,...
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7511359 |
Dual die package with high-speed interconnect
Embodiments of the invention relate to the construction of a dual die package with a high-speed interconnect. A package is created having a first die on a first side of a base substrate and a...
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7510108 |
Method of making an electronic assembly
A method of making an electronic assembly comprising an electronic component that is attached to a circuit board by protruding solder bumps of the electronic component places the electronic...
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7495179 |
Components with posts and pads
A packaged microelectronic element includes connection component incorporating a dielectric layer ( 22 ) carrying traces ( 58 ) remote from an outer surface ( 26 ), posts ( 48 ) extending from the...
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7480151 |
Wiring board and method of manufacturing the same
A wiring board according to the present invention includes a wiring part formed of one or more layers, a first terminal area disposed on one side of the wiring part in a projecting manner, and a...
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7477523 |
Semiconductor device and method of manufacturing semiconductor device
A semiconductor device has at least a square wiring board having a board core made of an insulating material, wires made of a metal and formed on a first surface of the board core, a solder resist...
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7450395 |
Circuit module and circuit device including circuit module
A circuit module includes connection electrodes on a plate-shaped board and connection electrodes on a frame-shaped board that are bonded together with conductive bonding materials there between....
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7446398 |
Bump pattern design for flip chip semiconductor package
A bump pattern design for flip chip semiconductor packages includes a pattern of contact pads formed on a package substrate. Each contact pad is adapted to receive a corresponding solder bump from...
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7435619 |
Method of fabricating a 3-D package stacking system
The present invention provides a system for 3D package stacking system, comprising providing a substrate, attaching a ball grid array package, in an inverted position, to the substrate, forming a...
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7420817 |
MEMS device seal using liquid crystal polymer
An apparatus and method for a near hermetic chip carrier package having a base die and a lid die each formed of a substantially impermeable material and conjoined by a semi-permeable sheet or tape...
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7420809 |
Heat spreader in integrated circuit package
An integrated circuit (IC) package comprises a package substrate, an IC die mounted on the package substrate, a wire bond electrically connecting the IC die and the package substrate, and a heat...
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7405946 |
Ball grid array assignment
A pattern of contacts that includes high speed transmitter contacts disposed in a first portion of the pattern, where the high speed transmitter contacts are disposed in first ordered channels of...
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7391110 |
Apparatus for providing capacitive decoupling between on-die power and ground conductors
One embodiment of the present invention provides capacitive decoupling on the surface of a semiconductor die, instead of providing the decoupling on a package or printed circuit board to which the...
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7385792 |
Electronic control apparatus
An electronic control apparatus includes an exclusive power source line for a charge pump circuit which is discriminated from a common power source line. The exclusive power source line is...
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7377032 |
Process for producing a printed wiring board for mounting electronic components
A printed wiring board for mounting electronic components includes an insulating layer and a wiring pattern formed on one surface of the insulating layer, wherein one end portion of a filled via 4...
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7365991 |
Dual LED board layout for lighting systems
Circuit boards for lighting systems have identical LED landing zones printed on the board. Each zone includes at least two sets of LED contact pads. One pad set is configured to mate with contacts...
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7362588 |
Flying capacitor type battery voltage detector
In a flying capacitor type battery voltage detector on a circuit substrate, a large number of photo MOS switches having performance highly depending from temperature are dividedly disposed on front...
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7359213 |
Circuit board
A circuit board is formed by mounting at least one passive component on a first surface of a first laminate material; interconnecting the passive component to contact traces and vias of the first...
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7359211 |
Local control of underfill flow on high density packages, packages and systems made therewith, and methods of making same
An article includes a mounting substrate, a passive component site on the mounting substrate, and an active component site on the mounting substrate. The article also includes a fluid flow barrier...
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7345245 |
Robust high density substrate design for thermal cycling reliability
A semiconductor package for a die with improved thermal cycling reliability. A first layer of the package provides ball pads dispersed throughout. A second layer of the package provides signal...
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7339276 |
Underfilling process in a molded matrix array package using flow front modifying solder resist
Placing a flow modifier on a package substrate to create two flow fronts on a molded matrix array package. A flow modifier may be laid on a package substrate to a height that blocks off the bottom...
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7324350 |
MEMS RF switch module including a vertical via
An apparatus and method to provide a micro-electromechanical systems (MEMS) radio frequency (RF) switch module with a vertical via. The MEMS RF switch module includes a MEMS die coupled to a cap...
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7315455 |
Surface-mounted electronic component module and method for manufacturing the same
More compact, thinner, shorter and lighter surface-mounted electronic component modules and their manufacturing methods at low costs, thus making them industrially highly valuable are available....
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7305509 |
Method and apparatus for zero stub serial termination capacitor of resistor mounting option in an information handling system
A method of implementing zero stub serial termination component mounting in an information handling system includes providing a first and second serial terminator option. The first serial...
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7304857 |
Sensor node and circuit board arrangement
An electronic circuit, preferable as a sensor node, has a highly sensitive radio function and is capable of performing a low-power-consumption operation. The electronic device has a board; a...
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7301781 |
Semiconductor module
The present invention realizes strengthening of a ground of a lower-surface ground electrode of an upper semiconductor chip and miniaturization in a semiconductor module on which two semiconductor...
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7301775 |
Receiving device
A tuner section is provided on one surface of a multilayered substrate, and a demodulating section on another surface of the multilayered substrate. The multilayered substrate further includes: an...
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7295027 |
Semiconductor device socket and semiconductor device connecting method using anisotropic conductive sheet
A semiconductor device socket, in which a semiconductor device is installed, includes a support member on which a substrate is placed, an anisotropic conductive sheet that acts as an intermediary...
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7294928 |
Components, methods and assemblies for stacked packages
A bottom unit including a bottom unit semiconductor chip is mounted to a circuit board and one or more top elements such as packaged semiconductor chips are mounted to the bottom unit. Both...
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7289332 |
Mirror image electrical packages and system for using same
A mirror image package is disclosed along with several embodiments for using such package in connection with a normal package. Embodiments include side-by-side and top-over-bottom mounting...
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7280370 |
Electronic package and circuit board having segmented contact pads
An electronic package has a circuit board including a substrate electrical circuitry including circuit traces and first and second contacts for connecting to surface mount device(s). The first and...
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7276791 |
Board having alternating rows of processors and memories
An electronic device is provided on which semiconductor packages can be mounted efficiently. The electronic device includes a board that can receive a plurality of first semiconductor packages each...
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7274096 |
Light transmissive cover, device provided with same and methods for manufacturing them
A light transmissive cover for a device comprising: a cover member of light transmissive material; and a junction member joined to the cover member, the junction member being a member used to be...
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7262497 |
Bumpless assembly package
A bumpless assembly package mainly comprises a substrate, and a chip. The substrate has an upper surface and an opposite lower surface, a plurality of first contacts and a plurality of second...
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7246431 |
Methods of making microelectronic packages including folded substrates
A microelectronic package is fabricated by a process which includes folding a substrate. A substrate is folded by engaging a folding portion of the substrate with a die so that the folding portion...
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7215555 |
Bus bar structure plate and producing method of circuit structure body by using of the same
An integrated bus bar structure plate in which a plurality of bus bars are arranged on substantially the one plain face to form an electric power circuit, wherein after the bus bar structure plate...
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7209366 |
Delivery regions for power, ground and I/O signal paths in an IC package
An integrated circuit (IC) package includes a chip carrier and a chip mounted to the chip carrier. The chip carrier has a centrally located power delivery region and a peripherally located...
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7189598 |
Wiring board, method of manufacturing the same, semiconductor device, and electronic instrument
A receiving layer is formed from a thermosetting resin precursor. An interconnecting layer is formed on the receiving layer from a dispersion liquid containing conductive particles. Heat is applied...
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