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7619296 |
Circuit board and semiconductor device
A semiconductor device, includes: a semiconductor substrate; a multilayered interconnect structure formed on the semiconductor substrate; a terminal for flip-chip packaging arranged on the surface...
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7616451 |
Semiconductor package substrate and method, in particular for MEMS devices
A semiconductor package substrate suitable for supporting a damage-sensitive device, including a substrate core having a first and opposite surface; at least one pair of metal layers covering the...
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7613009 |
Electrical transition for an RF component
An RF electronic component for mounting on a substrate includes a housing; and at least one electronic device having an input and/or output incorporated in the housing. At least one input/output...
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7613007 |
Power core devices
The present invention relates to a device comprising a power core wherein said power core comprises: at least one embedded singulated capacitor layer containing at least one embedded singulated...
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7599193 |
Tape circuit substrate with reduced size of base film
A tape circuit substrate includes a base film with first wiring and second wiring disposed on the base film. The first wiring extends into a chip mount portion through a first side and bends within...
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7594105 |
Multilayer print circuit board
This invention effectively prevents potential fluctuation in the power supply terminal of a semiconductor device, that is, noise from flowing out to a main power supply wiring. A multilayer print...
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7586755 |
Electronic circuit component
Through an improvement of module size increase due to mounting a single passive element on a substrate and an increase in the mounting cost, to provide a highly reliable, high performance and small...
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7583511 |
Semiconductor die package with internal bypass capacitors
Embodiments of the present invention provide a computer system that reduces voltage noise for a processor chip. The computer system includes a package which is configured to be sandwiched between...
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7580269 |
Apparatus for supplying power to a semiconductor device using a capacitor DC shunt
A power shunt for use within a semiconductor device of a type having a motherboard and an integrated circuit package electrically coupled to the motherboard and of a type having a spaced portion...
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7564694 |
Apparatus and method for impedance matching in a backplane signal channel
An apparatus comprising a printed circuit board having a front side and a back side, and having therein a plurality of conductive layers, each conductive layer including one or more signal...
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7561437 |
Electronic element module and electronic device using the same
An electronic element module and an electronic device using the same are provided. The electronic element module includes a circuit board and a plurality of electronic elements. In one embodiment,...
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7547961 |
IC card with bonding wire connections of different lengths
An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip...
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7545651 |
Memory module with a predetermined arrangement of pins
A memory module according to one implementation includes a support substrate, plural memory devices mounted on the support substrate, and pins having a predetermined arrangement on the support...
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7535728 |
Electronic assemblies comprising ceramic/organic hybrid substrate with embedded capacitors
To reduce switching noise, the power supply terminals of an integrated circuit die are coupled to the respective terminals of at least one embedded capacitor in a multilayer ceramic/organic hybrid...
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7529102 |
Wiring substrate, electronic device, electro-optical device, and electronic apparatus
The invention achieves stable performance, such as low parasitic capacitance generated at conductive components. Components having a low dielectric constant of 4 or less are disposed on a base...
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7515436 |
Communication unit
In a communication unit 100 , a ground layer section 101 which is a sheet-like conductive material and a power-source layer section 102 which is a sheet-like conductive material are laid out...
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7505281 |
Multilayer wiring board for an electronic device
A multilayer wiring board includes a first insulating film and a first patterned metal wiring film extending along a first major surface thereof, and a second insulating film a second patterned...
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7489519 |
Power and ground ring snake pattern to prevent delamination between the gold plated ring and mold resin for wirebond PBGA
An exemplary ball grid array package for a semiconductor device includes an integrated circuit on a substrate, and a first bus on the substrate, the first bus including first portions that extend...
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7474539 |
Inductor
A component having an inductor to at least partially compensate for a capacitance in a circuit of the component, is described herein.
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7474538 |
Semiconductor device mounting board, method of manufacturing the same, method of inspecting the same, and semiconductor package
A semiconductor device mounting board, a method of manufacturing the same, a method of inspecting the same, and a semiconductor package are provided. The semiconductor device mounting board is...
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7471501 |
Circuit arrangement comprising several capacitors
A device includes a base plate, a first cell, a second cell, and a housing in which the-first cell and the second cell are arranged. The first cell and the second cell each include at least one...
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7466560 |
Multilayered printed circuit board
A multilayered printed circuit board includes a first surface layer that includes a semiconductor integrated circuit, a second surface layer that includes a bypass capacitor and that is opposite to...
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7457132 |
Via stub termination structures and methods for making same
Vias are used in multilayer printed circuit boards to route electrical interconnects between layers. Some via constructions embodiments result in the formation of a via-stub section. Via stub...
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7453703 |
Electronic component module having electronic component with piezoelectric device
The present invention is to provide a small-sized electronic component module in which RF units of a mobile phone for multi-band and multi-system are integrated at low cost. In the RF module, an RF...
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7446389 |
Semiconductor die package with internal bypass capacitors
One embodiment of the present invention provides an apparatus that reduces voltage noise for an integrated circuit (IC) device. This apparatus includes a package which is configured to be...
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7436681 |
Wiring board with built-in capacitor
The invention provides a wiring board with built-in capacitors, that has a multilayer wiring structure and capable of mounting an IC chip thereon. The wiring board with built-in capacitors...
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7436679 |
Radio-frequency module for communication
A communication radio-frequency module is provided that has a semiconductor device to which an antenna element is connected. This communication radio-frequency module includes: a supporting body...
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7432580 |
Semiconductor device with a substrate having a spiral shaped coil
A semiconductor apparatus comprises a substrate, a semiconductor chip fixedly secured on one side of the substrate, a spirally shaped coil formed on the other side of the substrate and electrically...
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7420819 |
Expanding high speed transport interface hardware method for motherboard
An expanding high speed transport interface hardware method for motherboard is provided. In the method, a mezzanine card is provided and the mezzanine card has a chip socket. An expanding hardware...
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7417869 |
Methods and systems for filtering signals
The present invention describes methods for enhancing the performance of two-capacitor low-pass filters. In certain embodiments of the invention, the capacitors are placed on opposite sides of a...
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7417299 |
Direct connection multi-chip semiconductor element structure
A direct connection multi-chip semiconductor element structure is proposed. A plurality of semiconductor chips are mounted and supported on a metal heat sink, such that heat generated by the chips...
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7405946 |
Ball grid array assignment
A pattern of contacts that includes high speed transmitter contacts disposed in a first portion of the pattern, where the high speed transmitter contacts are disposed in first ordered channels of...
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7405448 |
Semiconductor device having a resistance for equalizing the current distribution
A first insulating substrate is formed on a heat sink, and a semiconductor element is formed thereon. An insulating resin casing is formed so as to cover the first insulating substrate and the...
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7391110 |
Apparatus for providing capacitive decoupling between on-die power and ground conductors
One embodiment of the present invention provides capacitive decoupling on the surface of a semiconductor die, instead of providing the decoupling on a package or printed circuit board to which the...
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7385792 |
Electronic control apparatus
An electronic control apparatus includes an exclusive power source line for a charge pump circuit which is discriminated from a common power source line. The exclusive power source line is...
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7365991 |
Dual LED board layout for lighting systems
Circuit boards for lighting systems have identical LED landing zones printed on the board. Each zone includes at least two sets of LED contact pads. One pad set is configured to mate with contacts...
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7362588 |
Flying capacitor type battery voltage detector
In a flying capacitor type battery voltage detector on a circuit substrate, a large number of photo MOS switches having performance highly depending from temperature are dividedly disposed on front...
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7359213 |
Circuit board
A circuit board is formed by mounting at least one passive component on a first surface of a first laminate material; interconnecting the passive component to contact traces and vias of the first...
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7359211 |
Local control of underfill flow on high density packages, packages and systems made therewith, and methods of making same
An article includes a mounting substrate, a passive component site on the mounting substrate, and an active component site on the mounting substrate. The article also includes a fluid flow barrier...
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7352060 |
Multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring substrate
A multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring structure is disclosed. The multilayer wiring substrate includes a dielectric layer including a resin...
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7345889 |
Method and system for reducing radiated energy emissions in computational devices
A method and system for reducing the release of high frequency electromagnetic energy into the environment is disclosed, wherein local regions of distributed capacitance are embedded within a...
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7339798 |
Electronic assemblies and systems comprising interposer with embedded capacitors
To reduce switching noise, the power supply terminals of an integrated circuit die are coupled to the respective terminals of at least one capacitor embedded in an interposer that lies between the...
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7339277 |
Semiconductor device having passive component and support substrate with electrodes and through electrodes passing through support substrate
A capacitor comprises a first conducting film 12 formed on a substrate 10 , a first dielectric film 14 formed on the first conducting film, a second conducting film 18 formed on the first...
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7336498 |
Memory card with push-push connector
The present invention, roughly described, pertains to a small memory card that includes features which allow the memory card to be more easily handled by a user. In various embodiments, the memory...
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7317622 |
Method and apparatus for supplying power to a semiconductor device using a capacitor DC shunt
A power shunt for use within a semiconductor device of a type having a motherboard and an integrated circuit package electrically coupled to the motherboard and of a type having a spaced portion...
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7310240 |
Method for increasing stability of system memory through enhanced quality of supply power
An apparatus for buffering power transients in a supply power for expansion cards inserted into expansion slots on a computer motherboard. The apparatus comprises a printed circuit board, a...
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7304857 |
Sensor node and circuit board arrangement
An electronic circuit, preferable as a sensor node, has a highly sensitive radio function and is capable of performing a low-power-consumption operation. The electronic device has a board; a...
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7301230 |
Circuit board with a thin-film layer configured to accommodate a passive element
A laminating step includes a second step of laminating a second insulation layer on a conductive pattern last formed at a first step, roughening the surface of the laminated second insulation layer...
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7295445 |
Holder for surface mount device during reflow
Methods and apparatus to couple a device, such as, for example, a surface mount device, with a substrate, such as, for example, a printed circuit, are disclosed. An apparatus, according to one...
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7288728 |
Electronic package and packaging method
A first substrate includes a coil assembly and an integrated circuit mounted thereon. A second substrate includes capacitors 16 and resistors mounted thereon. The first substrate and the second...
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