|
Match
|
Document |
Document Title |
|
|
7616451 |
Semiconductor package substrate and method, in particular for MEMS devices
A semiconductor package substrate suitable for supporting a damage-sensitive device, including a substrate core having a first and opposite surface; at least one pair of metal layers covering the...
|
|
|
7549373 |
Integrated activating device for explosives
A detonator assembly according to one arrangement includes a capacitor discharge unit having a capacitor and a resistor formed on a surface of the capacitor. At least one side of the resistor is...
|
|
|
7525816 |
Wiring board and wiring board connecting apparatus
The present invention provides a wiring board including a first board provided with a first wiring pattern and a second board provided with a second wiring pattern while the first wiring pattern...
|
|
|
7377032 |
Process for producing a printed wiring board for mounting electronic components
A printed wiring board for mounting electronic components includes an insulating layer and a wiring pattern formed on one surface of the insulating layer, wherein one end portion of a filled via 4...
|
|
|
7301779 |
Electronic chip and electronic chip assembly
A multiplicity of nanotubes are applied to at least one external chip metal contact of an electronic chip in order to make contact between the electronic chip and a further electronic chip.
|
|
|
7268303 |
Circuit board, mounting structure of ball grid array, electro-optic device and electronic device
In a circuit board including a pad for mounting a ball grid array and a wiring, a mounting structure of the ball grid array, an electro-optic device, and an electronic device, the circuit board...
|
|
|
7268438 |
Semiconductor element including a wet prevention film
A columnar bump formed of copper etc. is formed on a wiring film of a semiconductor chip through an interconnected film and an adhesive film in a wafer unit by electrolytic plating in which package...
|
|
|
7259683 |
Rack
A rack has a plurality of LEDs arranged on the front surface thereof correspondingly to respective units. The rack is provided with an LED lighting circuit which lights these LEDs, on the back of a...
|
|
|
7239524 |
Resistive element apparatus and method
A resistive element, a circuit board, and a circuit package, as well as a method of adding a resistive element to a circuit board are described. The resistive element includes a first contact point...
|
|
|
7120033 |
Electrically conducting bonding connection
An electrically conducting bonding connection (B) is produced between an electronic circuit (S) arranged on an electrically conducting support plate ( 1 ) and the support plate ( 1 ) by providing a...
|
|
|
7084351 |
Electrical device allowing for increased device densities
A device comprising a circuit, a lead having a first end connected to the circuit and having a second end, and a deformable structure connected to the second end of the lead. The invention may be...
|
|
|
6940023 |
Printed-wiring board and electronic device
The present invention provides a board ensuring no peel-off of a wall and a land, even if a part is soldered to the board with lead-free solder. The board 10 is comprised of N (N≧3) layer...
|
|
|
6933449 |
Selective area solder placement
A printed circuit board having at least one layer of conductive traces on an external surface has at least one preformed solder element placed on a conductive trace area of the printed circuit...
|
|
|
6903938 |
Printed circuit board
The invention relates to a printed circuit board comprising capacitive and inductive elements. To arrange such a printed circuit board so that it has a smaller thickness and can be manufactured...
|
|
|
6853086 |
Semiconductor device and method of manufacture thereof, circuit board, and electronic instrument
A method of manufacture of a semiconductor device comprises a step of providing an adhesive ( 30 ) between a semiconductor chip ( 20 ) and a substrate ( 10 ), a step of positioning electrodes ( 22...
|
|
|
6828512 |
Apparatus and methods for interconnecting components to via-in-pad interconnects
A substrate has at least one via-in-pad that includes a bond pad and a bore. In addition, the substrate has a plug coupled to the at least one via-in-pad, the plug has a first conductive material...
|
|
|
6809935 |
Thermally compliant PCB substrate for the application of chip scale packages
A new method is provided for mounting a semiconductor on the surface of a Printed Circuit Board. A layer of Elastomer is deposifed on the surface face of the PCB, this layer of Elastomer makes the...
|
|
|
6804122 |
Self-stabilizing card edge terminal
A terminal body for use in combination with a circuitboard having edge conductor pads and being formed from a stamped metal blank so as to provide a first main longitudinally extending spring...
|
|
|
6801437 |
Electronic organic substrate
A method of forming electrically conductive elements on a base layer of an electronic substrate without the use of solder mask. A layer of electrically conductive material is deposited on the base...
|
|
|
6774314 |
Electronic device and coupler
An electronic device assembled using a coupler which has an electroconductive region and a resin region on the surface. Flexibility of the resin region absorbs stress caused by difference in...
|
|
|
6660942 |
Semiconductor device with an exposed external-connection terminal
A wiring substrate equipped with a rerouted wiring having one end connected to an electronic-part mounting pad for electrically connecting an electronic part and another end connected to an...
|
|
|
6643142 |
Module having a lead frame equipped with components on both sides
A module ( 1 ) for contactless communication includes a plurality of electrical components ( 4, 5, 6, 7, 8 ) which each have at least two contact faces ( 9, 10, 11, 12, 13, 14, 15, 16 ) for the...
|
|
|
6617529 |
Circuit board and electronic equipment using the same
In a circuit board having lands 2 each of which has a through hole 4 through which a lead of an electrical part is inserted, the lead 3 and the land 2 being mounted in the circuit board by...
|
|
|
6610430 |
Method of attaching a device to a circuit board
A method of soldering a ball grid array device onto a circuit board which includes: positioning a solder paste brick on top of a contact pad of the circuit board, said solder past brick defining an...
|
|
|
6555760 |
Electronic circuit interconnection system using a virtual mirror cross over package
A virtual mirror “crossover” package includes two groups of electrically interconnected pairs of first and second connection points. Within each group, the set of first and second connection...
|
|
|
6555759 |
Interconnect structure
An embodiment of the present invention is a method for wafer level IC packaging that includes the steps of: (a) forming compliant, conductive bumps on metalized bond pads or conductors; and (b)...
|
|
|
6528889 |
Electronic circuit device having adhesion-reinforcing pattern on a circuit board for flip-chip mounting an IC chip
An electronic circuit device has an insulating substrate and an integrated circuit having a surface disposed opposite to and confronting a surface of the insulating substrate to form a gap...
|
|
|
6526654 |
Method of producing double-sided circuit board
The method comprises forming a plurality of wiring pattern layers on the front surface of a substrate. In the process of forming the wiring pattern layers, an insulator protection film keeps...
|
|
|
6519161 |
Molded electronic package, method of preparation and method of shielding-II
A packaged electronic circuit using molded plastics, Thick Film, and Polymer Thick Film technology, and achieving shielding of the circuitry and components of the package. In this invention at...
|
|
|
6515233 |
Method of producing flex circuit with selectively plated gold
Disclosed is a method of producing a flexible circuit board having gold selectively plated on only desired elements of the conductive circuits. These desired elements typically are attachment...
|
|
|
6507122 |
Pre-bond encapsulation of area array terminated chip and wafer scale packages
An integrated circuit chip package wherein the chip is encapsulated prior to mechanical bonding to a packaging substrate. The package provides a continuous adhesive interface between the...
|
|
|
6501663 |
Three-dimensional interconnect system
A three-dimensional interconnect system is disclosed. The interconnect system electrically connects electrical devices that are disposed on different physical planes. The interconnect system...
|
|
|
6498308 |
Semiconductor module
A semiconductor module includes a chip formed with an integrated circuit, a first external connecting terminal electrically connected to the integrated circuit, a printed wiring board having a...
|
|
|
6490170 |
Package substrate
According to the package board of the present invention, each soldering pad formed on the top surface of the package board, on which an IC chip is to be mounted, is small (133 to 170 μm in...
|
|
|
6479763 |
CONDUCTIVE PASTE, CONDUCTIVE STRUCTURE USING THE SAME, ELECTRONIC PART, MODULE, CIRCUIT BOARD, METHOD FOR ELECTRICAL CONNECTION, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND METHOD FOR MANUFACTURING CERAMIC ELECTRONIC PART
A conductive paste containing: conductive particles; foamable material which foams at the time of heating or decompression; and resin; characterized in that even after foaming of the foamable...
|
|
|
6479755 |
Printed circuit board and pad apparatus having a solder deposit
A printed circuit board and a pad apparatus having a solder deposit formed on the pad apparatus by using a mask having a slit are provided. The slit has the same shape as the solder deposit. The...
|
|
|
6476503 |
Semiconductor device having columnar electrode and method of manufacturing same
A semiconductor device including a semiconductor chip sealed with an encapsulating resin. Columnar electrodes are connected to electrode pads of the semiconductor chip, and extend through the...
|
|
|
6476332 |
Conductor systems for thick film electronic circuits
A thick film electronic circuit is disclosed. The circuit includes a substrate for supporting the circuit and a conductive trace for interconnecting a plurality of electronic devices dispersed on...
|
|
|
6462957 |
High performance orthogonal interconnect architecture without midplane
An improved electrical interconnection between a first circuit board and a second circuit board is provided. In one embodiment, the first circuit board has a substantially rigid circuit portion...
|
|
|
6448507 |
Solder mask for controlling resin bleed
Damage to and short circuiting of bond fingers on a substrate due to die-attach resin bleed is prevented, thereby increasing yield and improving reliability. Embodiments include forming a trough in...
|
|
|
6449168 |
Circuit board and a method for manufacturing the same
The present invention refers to circuit board ( 10 ), in particular a multilayer circuit board including at least a first carrying section ( 11 ) and a second section ( 12 ), conductor pattern ( 17...
|
|
|
6437989 |
Circuit board with an electronic component and a method for producing a connection between the circuit board and the component
This circuit board contains electronic components having electrical contacts. At least one of the electrical contacts is initially glued to the circuit board using a conductive adhesive and at...
|
|
|
6406774 |
Electrically conductive composition for use in through hole of electric component
The invention provides an electrically conductive composition for use in a through hole of an electric component, comprising a noble metal powder, a base metal powder and an organic vehicle, the...
|
|
|
6395991 |
Column grid array substrate attachment with heat sink stress relief
Structure and method for reinforcing a solder column grid array attachment of a ceramic or the like substrate to a printed circuit board, the reinforcement providing support for a heat sink which...
|
|
|
6395993 |
Multilayer flexible wiring boards
The present invention aims to manufacture a reliable multilayer flexible wiring board at high yield. Flexible wiring board 10 used for multilayer flexible wiring board 40 of the present...
|
|
|
6370030 |
Device and method in electronics systems
The present invention relates to a device and a method at a printed board for obtaining good transmission qualities in transmission conductors on a predetermined area ( 10 ) of the printed board (...
|
|
|
6359233 |
Printed circuit board multipack structure having internal gold fingers and multipack and printed circuit board formed therefrom, and methods of manufacture thereof
Disclosed is a printed circuit board multipack, having a plurality of printed circuit boards (for example, a plurality of PCI compliant cards) provided using a common web of substrate material for...
|
|
|
6342682 |
Printed wiring board and manufacturing method thereof
A printed wiring board in which an opening existing around a pad which is a photovia land is arranged so that it is not overlapped with the pad, the area of an opening existing around a pad and...
|
|
|
6333563 |
Electrical interconnection package and method thereof
The present invention relates generally to an electrical interconnection package and a method thereof. More particularly, the invention encompasses an invention that increases the fatigue life of a...
|
|
|
6327158 |
Metal pads for electrical probe testing on wafer with bump interconnects
An improved integrated circuit device that includes both bond pads and trim pads is disclosed. Electrically conductive, non-wettable and non-corrosive protective caps are formed over each of the...
|