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7633766 |
Preferential via exit structures with triad configuration for printed circuit boards
A circuit board design is disclosed that is useful in high-speed differential signal applications uses either a via arrangement or a circuit trace exit structure. A pair of differential signal vias...
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7618165 |
LED lamp unit
There is provided an LED lamp unit comprising an LED lamp, a protective component for an LED lighting circuit, a circuit section and a case part, characterized in that the circuit section has a...
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7547850 |
Semiconductor device assemblies with compliant spring contact structures
Photolithography patterned spring contacts are disclosed. The spring contacts may be fabricated using thin film processing techniques. A substrate, such as a silicon wafer or a carrier substrate is...
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7545652 |
Printed circuit board and differential signaling structure
Provided is a system adopting a differential signaling system including a low frequency signaling line arranged to be adjacent to a pair of differential signaling lines in parallel to each other,...
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7541678 |
Printed wiring board, information processing apparatus, and method of manufacturing the printed wiring board
Disclosed is a printed wiring board comprising an insulating layer having a rectangular flat shape and provided with fibers in the layer, the direction of the fiber in the layer being almost...
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7532483 |
Mounting integrated circuit dies for high frequency signal isolation
A method of connecting signal lines between an integrated circuit (IC) die and a carrier or external circuit, and corresponding apparatus. Techniques for adjusting magnetic coupling between...
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7480150 |
Printed wiring board and method of manufacturing the same
In a printed wiring board 10 , an upper electrode connecting portion 52 penetrates through a capacitor portion 40 in top to bottom direction so that an upper electrode connecting portion first...
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7456364 |
Using a thru-hole via to improve circuit density in a PCB
A printed circuit board includes multiple layers on which electrically conductive traces reside, where at least two of the electrically conductive traces each has a first portion formed on one...
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7448909 |
Preferential via exit structures with triad configuration for printed circuit boards
A circuit board design is disclosed that is useful in high-speed differential signal applications uses either a via arrangement or a circuit trace exit structure. A pair of differential signal vias...
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7446261 |
Flexible circuit boards with tooling cutouts for optoelectronic modules
A flexible circuit comprises a flexible substrate having first and second opposing surfaces. The flexible substrate can include multiple layers. A plurality of electrical traces can be mounted on...
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7379307 |
Wiring board and method for manufacturing the same, and semiconductor device
A wiring board includes: an insulating base; a plurality of conductive wirings; and bumps formed on the conductive wirings, respectively. The conductive wirings can be connected with electrode pads...
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7375978 |
Method and apparatus for trace shielding and routing on a substrate
Some embodiments of the invention effectively shield signal traces on a substrate without impacting the signal trace routing on the metal layers of the substrate. Other embodiments of the invention...
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7332816 |
Method of fabricating crossing wiring pattern on a printed circuit board
A filet F is added to a portion constituting a corner portion C equal to or smaller than 90° in a crossing portion X of wiring patterns 58 b , 58 c and 58 d , and a wiring pattern 58 is...
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7292454 |
System and method for optimizing printed circuit boards to minimize effects of non-uniform dielectric
A system and method for minimizing the effects of non-uniform dielectric properties includes forming traces on printed circuit boards (PCB) where the fibers within the printed circuit boards are...
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7286372 |
Transceiver module with PCB having embedded traces for EMI control
A PCB is provided that is suitable for use in applications where EMI control is of interest. The PCB includes circuitry that communicates with an edge connector having edge traces located on its...
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7283374 |
Grow as you go equipment shelf
An extendable enclosure for circuit cards provides the capability for a customer to purchase a low cost system up-front, but still allow for growth. The extendable enclosure for circuit cards...
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7265299 |
Method for reducing voltage drop across metal lines of electroluminescence display devices
A conducting device for a display device is disclosed. It comprises one or more non-conducting base lines formed in predetermined locations on a substrate layer, and one or more conducting line...
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7257884 |
Method for fabricating semiconductor component with adjustment circuitry for electrical characteristics or input/output configuration
A semiconductor component includes adjustment circuitry configured to adjust selected physical and electrical characteristics of the component or elements thereof, and an input/output configuration...
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7259683 |
Rack
A rack has a plurality of LEDs arranged on the front surface thereof correspondingly to respective units. The rack is provided with an LED lighting circuit which lights these LEDs, on the back of a...
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7209368 |
Circuitized substrate with signal wire shielding, electrical assembly utilizing same and method of making
A circuitized substrate in which at least one signal line used therein is shielded by a pair of opposingly positioned ground lines which in turn are electrically coupled to a ground plane located...
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7176383 |
Printed circuit board with low cross-talk noise
A printed circuit board and a method of making same in which the board includes a common power plane having dielectric layers on opposing sides thereof and a signal layer on each of said dielectric...
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7103274 |
Cross-connect apparatus
An apparatus having n-number of working cross-connects for cross-connecting an n-bit input signals arriving from a plurality of input paths on a per-bit basis; n-number of first logic circuits for...
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7079400 |
High-frequency circuit
A high-frequency circuit comprises a substrate having an electronic component on an obverse side thereof, a first ground pattern formed on almost an entire reverse side of the substrate, a...
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7064431 |
Electronic assembly having select spacing of rows and columns of contacts to allow for routing of traces to the contacts
An electronic assembly is described, having a substrate and contacts on the substrate which are spaced and arranged in a manner that allows for a more dense arrangement of contacts but still allows...
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7061771 |
Mechanism to cross high-speed differential pairs
According to one embodiment, a printed circuit board (PCB) is disclosed. The PCB includes a first functional unit block (FUB) and differential traces coupled to the first FUB. The first FUB...
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7038917 |
Low loss, high density array interconnection
An interconnect architecture in which a substrate such as a printed circuit board includes multiple conductive layers separated by one or more interposed insulating layers, the conductive layers...
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7012811 |
Method of tuning a multi-path circuit
An improved method for reducing timing skew for signals, for example clock signals, that propagate along a circuit board, for example, a memory module, is disclosed. At least one signal trace of a...
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7007375 |
Method for fabricating a semiconductor component
A semiconductor component includes adjustment circuitry configured to adjust selected physical and electrical characteristics of the component or elements thereof, and an input/output configuration...
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6934163 |
Capacitor for dram connector
In one embodiment, a dummy via is created in a circuit board. The dummy via is positioned and coupled to a portion of a transmission line. This portion of the transmission line is further coupled...
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6930889 |
Circuit board and slot connector assembly
A circuit board includes a substrate and electrical contacts to mate with a slot connector. The contacts include a first set of contacts that are associated with the communication of power and...
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6894399 |
Microelectronic device having signal distribution functionality on an interfacial layer thereof
A microelectronic device includes a microelectronic die having an interfacial metal layer deposited over an active surface thereof to perform a signal distribution function within the device. The...
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6891731 |
Crosstalk cancellation for integrated circuit package configuration
A technique has been developed whereby crosstalk induced in a first electrical connection by current flow at an adjacent second electrical connection is at least partially cancelled by an opposing...
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6842346 |
Semiconductor device
Disclosed is a technique capable of improving a power supply efficiency in a power supply circuit. A power MOSFET in a high side of a combined power MOSFET constituting a DC-DC converter is...
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6804122 |
Self-stabilizing card edge terminal
A terminal body for use in combination with a circuitboard having edge conductor pads and being formed from a stamped metal blank so as to provide a first main longitudinally extending spring...
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6800939 |
Apparatus and method for providing low-loss transmission lines in interconnected mesh plane systems
An interconnected mesh plane system includes at least a pair of adjacent metal layers separated by dielectric, each layer having a plurality of spaced power, ground, and signal conductors extending...
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6792489 |
Multistage configuration and power setting
Multistage configuration and power setting for a processor includes an on-die configuration signal fuse block programmed during manufacturing, configuration signal Control and I/O circuitry, a...
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6787901 |
Stacked dies utilizing cross connection bonding wire
An integrated circuit package is constructed by attaching lower dies to a substrate that has bond fingers deposited on its surface. One lower die and its associated bond fingers are located offset...
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6787984 |
Wiring substrate, manufacturing method therefor, and image display device
A wiring substrate for a display panel having a plurality of wiring electrodes thereon includes an airtight container formed by disposing an opposing substrate through a frame member on the surface...
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6703651 |
Electronic device having stacked modules and method for producing it
An electronic device having stacked modules and method for producing it are described. Each module has a chip. Each chip is mounted on a stack intermediate plane. The stack intermediate planes of a...
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6643134 |
Holding and heat dissipation structure for heat generation part
In a holding and heat dissipation structure for a heat generation part for dissipating heat generated from the heat generation part having lead portions protruded from the main body thereof are...
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6628538 |
Memory module including module data wirings available as a memory access data bus
A module substrate has a plurality of module data terminal pairs individually provided in association with respective chip data terminals in a plurality of memory chips, and a plurality of module...
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6601292 |
Method for the connection and repair of flex and other circuits
A method for making and repairing connections between first and second circuits, such as flex circuits. An article 10 includes: a flexible dielectric substrate 12 having first and second edges ...
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6542377 |
Printed circuit assembly having conductive pad array with in-line via placement
A computer system including a microprocessor and a system memory coupled t provide storage to facilitate execution of computer programs by the microprocessor. An input is coupled to provide input...
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6542373 |
Memory module device formation and mounting methods thereof
In a memory module arranged with the connection terminals located on both sides of the circuit board, the connection terminals for transmitting a common signal to all memory modules conducts with...
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6483714 |
Multilayered wiring board
A multilayered wiring board comprising a first stacked structure consisting essentially of a first insulating layer having a first parallel conductor array and a second insulating layer formed...
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6462957 |
High performance orthogonal interconnect architecture without midplane
An improved electrical interconnection between a first circuit board and a second circuit board is provided. In one embodiment, the first circuit board has a substantially rigid circuit portion...
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6452808 |
Electronics module having power components, and a method of manufacture
A power electronics module has a metal substrate, a printed circuit card carried on one of the faces of the substrate, and components, at least some of which are power components, mounted on the...
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6449170 |
Integrated circuit package incorporating camouflaged programmable elements
An integrated circuit package includes at least one one-time programmable element, such as a fuse, having a first end and a second end separated by a programmable link. The programmable element is...
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6423909 |
Circuit board construction for differential bus distribution
A circuit board including differential bus traces on or buried within both sides of the board, interconnecting electronic devices such as disk drives, processors, and connectors for external...
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6420662 |
Wiring board
A power source (ground) line, which would have been formed with a broad conducting path is divided into multiple fine-line interconnections. A short-circuiting joint is formed to connect between...
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