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7623355 |
Extended universal serial bus connectivity
A system, method and apparatus is provided for extended universal serial bus connectivity. In one embodiment, the invention is an apparatus. The apparatus includes a printed circuit board having a...
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7618165 |
LED lamp unit
There is provided an LED lamp unit comprising an LED lamp, a protective component for an LED lighting circuit, a circuit section and a case part, characterized in that the circuit section has a...
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7615705 |
Enhanced-reliability printed circuit board for tight-pitch components
A printed circuit board is fabricated so contacts for tight-pitch components are at an angle with respect to the bundles of glass fibers in the epoxy-glass printed circuit board such that adjacent...
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7614800 |
Fiducial markings for quality verification of high density circuit board connectors
A printed circuit board having a pattern of fiducial marks on opposed edges of the board for assuring accuracy and alignment of an electrical connector printed on the board. The fiducial marks are...
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7582968 |
Wiring board with a protective film greater in heights than bumps
A wiring board according to the present invention includes: an insulating base 22 ; a plurality of first conductor wirings 23 a aligned in an inner region on the insulating base; bumps 24 ...
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7569428 |
Method for manufacturing semiconductor device, semiconductor device and apparatus comprising same
Disclosed is a method for manufacturing a method for manufacturing a semiconductor device which comprises a substrate, a semiconductor chip and a plurality of terminals. The method comprises...
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7566968 |
Biosensor with smart card configuration
A biosensor that has a smart card configuration includes a semiconductor chip including a bioactive structure and contact areas disposed on a first side of the semiconductor chip, and a rewiring...
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7564695 |
Circuit connection structure and printed circuit board
While gradually increasing the widths of signal lines ( 104 a, 104 b, 105 a, 105 b ) of first and second groups of differential signal lines ( 104, 105 ) to suppress attenuation in the lines,...
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7558078 |
Information processing equipment
According to the invention, information processing equipment using a flexible printed-circuit board which does not lose bendability with repeated opening and closing of a display unit, and which...
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7551455 |
Package structure
A package structure including a first carrier, a second carrier, at least a first electronic component and at least a second electronic component is provided. The second carrier is electrically...
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7550832 |
Stackable semiconductor package
A stackable semiconductor package includes a top package, a bottom package, an adhesive layer, a plurality of wires and a molding compound. A part of a surface of a chip of the bottom package is...
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7547974 |
Wiring substrate with improvement in tensile strength of traces
A wiring substrate with tensile-strength enhanced traces primarily comprises a core layer, a plurality of connecting pads, a plurality of traces, and a solder resist where the connecting pads and...
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7545029 |
Stack microelectronic assemblies
A stacked microelectronic assembly includes a base substrate having conductive elements projecting from a bottom surface thereof and a first microelectronic subassembly underlying a bottom surface...
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7541678 |
Printed wiring board, information processing apparatus, and method of manufacturing the printed wiring board
Disclosed is a printed wiring board comprising an insulating layer having a rectangular flat shape and provided with fibers in the layer, the direction of the fiber in the layer being almost...
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7538441 |
Chip with power and signal pads connected to power and signal lines on substrate
A semiconductor integrated circuit device is provided which comprises a semiconductor chip having wire bonding pads and a package encapsulating the semiconductor chip and connected via bonding...
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7535729 |
Optoelectronic system and method for its manufacture
An optoelectronic system includes a printed circuit board having a ground pad and a bond pad as well as an optoelectronic element. The optoelectronic element is electrically connected to the bond...
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7525190 |
Printed wiring board with wiring pattern having narrow width portion
A filet F is added to a portion constituting a corner portion C equal to or smaller than 90° in a crossing portion X of wiring patterns 58 b, 58 c and 58 d , and a wiring pattern 58 is...
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7514779 |
Multilayer build-up wiring board
Mesh holes 35 a and 59 a of upper solid layers 35 and upper solid layers 59 are formed to overlie on one another, so that the insulating properties of interlayer resin insulating layers 50...
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7511966 |
Printed circuit board
According to one embodiment, first to fourth pads are arranged on a surface mounting area of a printed circuit board along one side of the mounting area, with a preset gap defined between each pair...
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7511965 |
Circuit board device and manufacturing method thereof
In a circuit board device having an electronic component mounted on an electrode land on a board by reflow soldering, voids that adversely affect the solder joint in various ways are prevented from...
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7511962 |
Flexible printed circuit board
A flexible printed circuit board includes a flexible base, a working trace region, and at least one reinforcement trace. The working trace region and the at least one reinforcement trace are formed...
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7501583 |
Low noise multilayer printed circuit board
A low noise multilayer printed circuit board includes at least one ground layer and at least one power layer. The at least one ground layer is divided into a first area and a second area. The first...
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7498523 |
Direct wire attach
An assembly has a conductive trace on a substrate and at least one conductor electrically coupled to the trace. First and second gaps arranged such that one gap is on either side the trace,...
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7495930 |
Circuit board structure for high density processing of analog and digital signals
A circuit board which has a high speed digital circuit in close proximity to a sensitive analog structure has a grounded, conductive band interposed between them and a ground plane with two...
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7495927 |
Mount structure, electro-optical device, and electronic apparatus
A mounting structure includes a base member and an electronic component having a protruded electrode which is formed on a transparent substrate. The electrode includes pads and elastic projections...
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7489520 |
Printed circuit board and liquid crystal display device having the same
An LCD capable of preventing and electrostatic discharge is provided. The LCD includes a liquid crystal panel for displaying an image, a PCB on which electronic devices are mounted to generate...
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7489519 |
Power and ground ring snake pattern to prevent delamination between the gold plated ring and mold resin for wirebond PBGA
An exemplary ball grid array package for a semiconductor device includes an integrated circuit on a substrate, and a first bus on the substrate, the first bus including first portions that extend...
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7477523 |
Semiconductor device and method of manufacturing semiconductor device
A semiconductor device has at least a square wiring board having a board core made of an insulating material, wires made of a metal and formed on a first surface of the board core, a solder resist...
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7463491 |
Wiring board and a semiconductor device using the same
A wiring board includes a core composite layer having first and second core boards and an optical transmission portion; first electrodes disposed on one part of the core composite layer, being...
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7450396 |
Skew compensation by changing ground parasitic for traces
According to embodiments, small holes or openings may be cut on or through the ground plane(s) adjacent to a selected trace line, so that C and L will be changed accordingly. Then phase velocity...
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7446398 |
Bump pattern design for flip chip semiconductor package
A bump pattern design for flip chip semiconductor packages includes a pattern of contact pads formed on a package substrate. Each contact pad is adapted to receive a corresponding solder bump from...
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7446261 |
Flexible circuit boards with tooling cutouts for optoelectronic modules
A flexible circuit comprises a flexible substrate having first and second opposing surfaces. The flexible substrate can include multiple layers. A plurality of electrical traces can be mounted on...
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7443692 |
Power converter architecture employing at least one capacitor across a DC bus
A power converter utilizes a high frequency capacitor and a bulk capacitor coupled across the DC terminals to reduce high frequency effect and voltage overshoot, leading to space and cost savings...
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7433200 |
Wired circuit board
A wired circuit board has a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer and including at least...
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7426118 |
Printed wiring board
To cancel a magnetic field in an interconnection pattern of a printed wiring board. A first interconnection pattern 3 a is formed on a surface 1 a of an insulating substrate 1 . A second...
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7417197 |
Direct contact power transfer pad and method of making same
A power transfer pad, having: a non-conductive board having a top and a bottom; a plurality of conductive substrate sections disposed across the top of the non-conductive board; at least one...
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7414317 |
BGA package with concave shaped bonding pads
In the BGA package and its manufacturing method, a bonding pad is etched from the exposed surface to a part of the insulation layer-coated region so as to form a solder contact side having a dish...
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7402892 |
Printed circuit board for connecting of multi-wire cabling to surge protectors
A printed circuit board assembly for coupling a plurality of surge protectors to multi-line communication cables includes a multi-layer printed circuit board, to which has been mounted at least two...
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7385792 |
Electronic control apparatus
An electronic control apparatus includes an exclusive power source line for a charge pump circuit which is discriminated from a common power source line. The exclusive power source line is...
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7382005 |
Circuit component with bump formed over chip
A method of assembling chips. A first chip and a second chip are provided. At least one conductive pillar is formed on the first chip, and a conductive connecting material is formed on the...
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7379751 |
Multi-band transceiver and radio communication device using the transceiver
A multi-band transceiver has a function of sharing transmitted and received signals of multiple frequency bands by the same antenna. The multi-band transceiver mounts multiple filters that...
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7379307 |
Wiring board and method for manufacturing the same, and semiconductor device
A wiring board includes: an insulating base; a plurality of conductive wirings; and bumps formed on the conductive wirings, respectively. The conductive wirings can be connected with electrode pads...
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7378601 |
Signal transmission structure and circuit substrate thereof
A signal transmission structure is provided. The structure mainly comprises at least a conductive via, at least a via land and a conductive wall. One end of the conductive via is connected to the...
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7375978 |
Method and apparatus for trace shielding and routing on a substrate
Some embodiments of the invention effectively shield signal traces on a substrate without impacting the signal trace routing on the metal layers of the substrate. Other embodiments of the invention...
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7375287 |
Assembly for accommodating the power electronics and control electronics of an electric motor
An arrangement to receive and accommodate the power and control electronics of an electric motor comprises a first circuit board mounted with control electronic components, a second circuit board...
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7372143 |
Printed circuit board including via contributing to superior characteristic impedance
A via is formed in a printed circuit board to penetrate through an insulating layer. A guard pattern, made of an electrically-conductive material, extends on the front surface of the insulating...
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7362589 |
Circuit board adapted to couple to different types of add-in cards
A circuit board comprising at least one slot provided on a surface of the circuit board. An add-in card can be mated to the slot. The slot comprises a first electrical connection adapted to couple...
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7362098 |
Magnetic field sensor
Two coil forming elements ( 12, 14 ) formed of conductor layers and a contact means ( 19 ), which is formed in an interlayer dielectric film ( 13 ) interposed between the conductor layers and...
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7355283 |
Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging
A rigid wave pattern formed on a first side of a substrate in a semiconductor die package. The rigid wave pattern aligns with and overlies the contact fingers formed on the second side of the...
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7355127 |
Printed wiring board and electronic device using the same
The present invention provides a printed wiring board which has high insulation resistance between wirings and is unlikely to cause failures such as leakages or short circuits, attributable to ion...
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