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Document Title |
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7598604 |
Low profile semiconductor package
A first semiconductor element and a second semiconductor element each have an electrode forming surface with an electrode pad thereon. The first semiconductor element and the second semiconductor...
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7593235 |
Thermal conduit
A thermal conduit to extract heat from an electrical component on a circuit board is disclosed. An electronic assembly according to aspects of the present invention includes an integrated circuit...
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7514779 |
Multilayer build-up wiring board
Mesh holes 35 a and 59 a of upper solid layers 35 and upper solid layers 59 are formed to overlie on one another, so that the insulating properties of interlayer resin insulating layers 50...
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7495928 |
Semiconductor device and printed circuit board
For a multi-terminal semiconductor package, such as a BGA or a CSP, that handles high-speed differential signals, a high-speed signal is assigned to the innermost located electrode pad on an...
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7488899 |
Compliant contact pin assembly and card system
A compliant contact pin assembly and a contactor card system are provided. The compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin...
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7473854 |
Printed circuit board
A ground pattern includes a plurality of integrally formed first to third ground lines. A plurality of first ground lines are arranged parallel to one another at equal intervals. A plurality of...
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7426118 |
Printed wiring board
To cancel a magnetic field in an interconnection pattern of a printed wiring board. A first interconnection pattern 3 a is formed on a surface 1 a of an insulating substrate 1 . A second...
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7417197 |
Direct contact power transfer pad and method of making same
A power transfer pad, having: a non-conductive board having a top and a bottom; a plurality of conductive substrate sections disposed across the top of the non-conductive board; at least one...
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7361983 |
Semiconductor device and semiconductor assembly module with a gap-controlling lead structure
In a semiconductor device ( 1 ), semiconductor elements ( 2 ) and ( 3 ) are mounted on a lead frame ( 5 ) having leads ( 4 ). The semiconductor elements ( 2 ) and ( 3 ) are connected with the leads...
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7355862 |
Printed wiring board, method of manufacturing the printed wiring board, lead frame package, and optical module
A printed wiring board includes a plurality of conductor plates that includes at least one conductor plate that is used as a lead for electrical connection with an external circuit, the conductor...
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7355283 |
Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging
A rigid wave pattern formed on a first side of a substrate in a semiconductor die package. The rigid wave pattern aligns with and overlies the contact fingers formed on the second side of the...
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7292458 |
Circuit board assembly having a set of edge clips for connecting multiple boards together
A circuit board assembly includes a motherboard defining a motherboard plane, and a daughter board defining a daughter board plane which is substantially parallel to the motherboard plane. The...
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7283374 |
Grow as you go equipment shelf
An extendable enclosure for circuit cards provides the capability for a customer to purchase a low cost system up-front, but still allow for growth. The extendable enclosure for circuit cards...
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7262496 |
Wiring base with wiring extending inside and outside of a mounting region
A method for manufacturing a semiconductor device is provided. A resin paste is applied to a wiring base including a wiring pattern. Then, a semiconductor chip having a plurality of electrodes is...
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7227758 |
Printed circuit board assembly with integrated connector
A printed circuit board (PCB) assembly includes a PCB and a first integrated conductive bus structure extending from a first edge of the PCB. The PCB connects a plurality of electronic components...
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7203075 |
Screen mask
A film carrier tape for mounting electronic parts comprises an insulating film, a wiring pattern formed on a surface of the insulating film, and a solder resist layer formed by moving a squeegee...
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7193158 |
Wiring board device
At the tip of a marginal land of a wiring board corresponding to a marginal electrode of a QFP is provided a partly projecting area that projects in a direction away from another land. The partly...
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7158387 |
Film carrier tape for mounting electronic part
A film carrier tape for mounting electronic part comprises an insulating film, a wiring pattern formed on a surface of the insulating film, and a solder resist layer formed by moving a squeegee...
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7132736 |
Devices having compliant wafer-level packages with pillars and methods of fabrication
Devices and methods of fabrication thereof are disclosed. A representative device includes a complaint wafer-level package having one or more lead packages. A representative lead package includes a...
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7126829 |
Adapter board for stacking Ball-Grid-Array (BGA) chips
Electronic devices packaged with arrayed solder balls, leads, or pads, such as Ball Grid Array (BGA) devices, are stacked together. Each stack has a bottom adapter card with metal contacts on a top...
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7113408 |
Contact grid array formed on a printed circuit board
A printed circuit board includes a dielectric layer and an area array of contact elements extending above a first surface of the dielectric layer. Each contact element includes a conductive portion...
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7102221 |
Memory-Module with an increased density for mounting semiconductor chips
The invention is intended to increase the density for mounting the semiconductor chips on a memory-module, to increase the capacity of the memory-module, and to realize the memory-module capable of...
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7094068 |
Load board
A load board for packaged IC testing. The load board with predetermined testing circuit thereon has bonding pad areas on its surface. A plurality of bonding pads is formed on the bonding pad areas,...
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7082678 |
Method of fabricating an integrated circuit package
A method of forming a semiconductor package is provided. The method includes forming a leadframe wherein the conductors or leads of the leadframe extend from a first end to a second end such that a...
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7079398 |
Sash for land grid arrays
A conductive sash is etched around the periphery of a land grid array interconnection on a carrier for dense integrated circuit connections. If the array comprises more than one module or module...
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7075179 |
System for implementing a configurable integrated circuit
The present invention provides a system for implementing a configurable integrated circuit (IC). Aspects of the invention include an IC die; a plurality of input/outputs (I/Os) coupled to the IC...
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7068520 |
Circuit board made of resin with pin
In a flat pin to be used in a circuit board made of resin with pins comprising a rod portion having a diameter of not greater than 0.35 mm and a concentric tabular large diameter portion having a...
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7064278 |
Impedance matching connection scheme for high frequency circuits
Methods and apparatus provide for electrical coupling of electrical components to traces on a substrate such that impedance mismatches otherwise experienced in high frequency operation are avoided....
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7061095 |
Printed circuit board conductor channeling
A printed circuit board and a system and method of embedding conductor channels into a printed circuit board. These conductor channels are used to provided increased power to circuits on the...
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7002225 |
Compliant component for supporting electrical interface component
An apparatus in one example includes a compliant component for supporting an electrical interface component that serves to electrically and mechanically couple a die with a separate layer. In one...
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6989591 |
Method for making an integrated circuit of the surface-mount type and resulting circuit
The invention relates to a method for making an integrated circuit ( 40 ) of the surface-mount type the comprising, first of all, manufacture of a package having a rear face and a pin grid array...
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6972488 |
Semiconductor device in which a semiconductor chip mounted on a printed circuit is sealed with a molded resin
A semiconductor device includes (a) a printed wiring board, (b) a semiconductor chip mounted on the printed wiring board, (c) a molded resin formed on the printed wiring board, covering the...
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6961247 |
Power grid and bump pattern with reduced inductance and resistance
Disclosed are novel methods and apparatus for efficiently providing power buses and bump patterns with reduced inductance and/or resistance. In an embodiment, an apparatus is disclosed. The...
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6958527 |
Wiring board having interconnect pattern with land, and semiconductor device, circuit board, and electronic equipment incorporating the same
A wiring board includes a substrate, and an interconnect pattern which is formed on the substrate and includes a land. A penetration hole, which exposes the substrate, is formed in the land. The...
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6930889 |
Circuit board and slot connector assembly
A circuit board includes a substrate and electrical contacts to mate with a slot connector. The contacts include a first set of contacts that are associated with the communication of power and...
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6894904 |
Tab package
A tape automated bonding (TAB) package and a method for fabricating the same is provided. A chip (a wire-bond chip or a flip chip) is bonded to a tape carrier through thermal compression. The chip...
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6876085 |
Signal layer interconnect using tapered traces
An interconnection device has a substrate that includes a conductive trace having an exposed portion at an edge of the substrate. The exposed portion is tapered toward the edge of the substrate....
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6873037 |
Vertical surface mount package utilizing a back-to-back semiconductor device module
A back-to-back semiconductor device module including two semiconductor devices, the backs of each being secured to one another. The bond pads of both semiconductor devices are disposed adjacent a...
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6848176 |
Process for manufacturing flexible wiring boards
A process for manufacturing a flexible wiring board according to the present invention comprises growing metal bumps 16 using a mask film patterned by photolithography. Fine openings can be...
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6819570 |
Circuit board with lead frame
In a circuit board of the present invention, a lead frame includes an electrode for mounting an electronic component. The lead frame is encapsulated in a resin portion. The lead frame includes a...
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6813154 |
Reversible heat sink packaging assembly for an integrated circuit
A reversible heat sink packaging assembly ( 400 ) for integrated circuits is provided. The packaging assembly ( 400 ) includes a chip carrier ( 102 ) having an opening ( 104 ) formed therein and a...
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6800816 |
Wiring circuit board having bumps and method of producing same
A method of manufacturing a wiring circuit board having bumps is disclosed in which a stable bump connection is possible, and complex operations such as plating pre-treatment are unnecessary. Bumps...
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6798665 |
Module and method of manufacturing the module
A high-frequency module has a signal electrode provided on a cut side thereof, and is arranged to produce no burrs. The module includes a substantially four-sided substrate, a recess at a cut side...
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6791842 |
Image sensor structure
An image sensor includes a substrate, a frame layer, signal input terminals, a photosensitive chip, a transparent layer, a plurality of wires and a glue layer. The substrate has a first surface and...
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6791186 |
Mounting substrate and structure having semiconductor element mounted on substrate
A mounting substrate on which a semiconductor element is to be mounted by flip-chip bonding, the semiconductor element having a surface on which a plurality of electrode terminals are arranged in a...
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6787901 |
Stacked dies utilizing cross connection bonding wire
An integrated circuit package is constructed by attaching lower dies to a substrate that has bond fingers deposited on its surface. One lower die and its associated bond fingers are located offset...
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6781850 |
Protection against folding and displacement for a flexible printed circuit board in a contact-making region
A configuration is described for making electrical contact between a flexible printed circuit board disposed on a supporting element and a contact spring has a sliding element which is disposed...
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6778406 |
Resilient contact structures for interconnecting electronic devices
Resilient contact structures provide electrical interconnection between a semiconductor die and another electronic component. Multilayered packaging may be formed on the semiconductor die, and the...
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6774317 |
Connection components with posts
A subtractively created interconnection scheme and apparatus, typically used with microelectronic devices, wherein a flexible support structure is attached to a conductive sheet. The conductive...
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6765805 |
Circuit component
A circuit component comprising a circuit board and a terminal for mounting the circuit board on a second circuit board. A length of the circuit board is 10 mm-80 mm, a difference in a coefficient...
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